Panasonic KX FLB758RU User Manual

							8.1.8. IMAGE READING
The Image Readin g Part feeds and ejects the document when copying or scannin g.
The image reading part consists of the followin gs.
8.1.8.1. Copying with the Automatic Document Feeder
The automatic document feeder consists of separation roller, document feed roller, separation pad, springs, etc. It divides the
documents and transfers to the reading part, then stacks the documents on the document guide when finished reading.
This automatic document feeder is afforda ble until 15 documents at once. W hen the user set a document on the document feeder
and the top of the document is touched, the document detection sensor is turned ON and beep tone sounds, then the motor is
driven.
The driven motor feeds the document and transfers it a little. W hen the printing part is ready for reading the document, the motor
is driven again by the operation of the user to move the roller at a fixed speed. The documents are fed one by one separated by
the separation pad. The spring plate adds the pressure to the document so that the separation pad can separate the documents
properly. Spring plate helps the document endure the pressure of separation pad to be fed smoothly. The document is ejected
document stacker.
8.1.8.2. Copying with the Scanner Glass
The motor, gear, belt, etc., cause CIS and the carriage above CIS to drive while copying with the scanner glass.The document
should be set to the lower right standard point. Copy can be done without closing the document cover when the
document is thick.W hen ADF document detection sensor detects the scanner glass, CIS moves to the right of the document from
the home position .
W hen the printing part is ready for reading the document, the motor is driven again by the operation of the user to move the roller
at a fixed speed. This operation is repeated from the next copy.
8.1.8.3. CIS (Contact Image Scanner)
CIS consists of LED, lens and sensor array. W hen the light emitted from LED is reflected on the document, the light reaches the
sensor through the lens, then the sensor array detects the document.
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							8.1.9. TIMING CHART (When Printing Two Sheets of Paper) BASIC
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							8.1.10. Timing Chart [Initializing (Short)]
8.1.11. Timing Chart [Initializing (Long)]
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							8.1.12. Timing Chart (when the registration sensor is turned OFF then ON duringinitializing)
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							8.2. TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES
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							8.3.1. PREPARATION
 
     · 
  
  PbF (: Pb free) Solder
 
  
  · 
  
  Soldering Iron
Tip Temperature of 662 °F±50 °F (350° C±10°C)
Note: W e recommend a 30 to 40 W att solderin g iron. An
expert may be able to use a 60 to 80 W att iron where
someone with less experience could overheat and damage
the PCB foil.
 
     · 
  
  Flux
Recommended Flux: Specifi c Gravity →0.82.
Type →RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) (P.4).
8.3.2. PROCEDURE
 1. Tack the flat pack IC to the PCB by temporarily solderin g
two diagonally opposite pins in the correct position s on the
PCB.
Be certain each pin is located over the correct pad on
the PCB.
 2. Apply flux to all of the pins on the IC.
 3. Being careful to not unsolde r the tack points, slide the solderin g iron along the tips of the pins while feeding
enough solder to the tip so that it flows under the pins as
they are heated.
8.3.3. REMOVING SOLDER FROM BETWEEN PINS
 1. Add a small amount of solder to the bridged pins.
 2. W ith a hot iron, use a sweeping motion along the flat part of
the pin to draw the solder from between the adjacent pads.
8.3. HOW TO REPLACE A FLAT PACKAGE IC
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							8.4. DIGITAL BOARD SECTION
W hen the unit fails to boot up the system, take the troubleshootin g procedures very carefully. It may have a serious problem .
The symptom: No response when the power is turned on. (No LCD display, and keys are not accepted.)
The first step is to check the power source. If there is no problem with the power supply unit, the problem may lie in the digital
unit (main board).
As there are many potential causes in this case (ASIC, DRAM, etc.), it may be difficult to specify what you should check first.
If a mistake is made in the order of checks, a normal part may be determined faulty, wasting both time and money.
Although the tendency is to regard the problem as a serious one (IC malfunction, etc.), usually most cases are caused by solder
faults (poor contact due to a tunnel in the solder, signal short circuit due to solder waste).
Note: 1. Electrical continuity may have existed at the factory check, but a faulty contact occurred as a result of vibration, etc., duringtransport.
 2. Solder waste remaining on the board may get caught under the IC during transport, causing a short circuit.
Before we begin mass production, several hundred trial units are produced at the plant, various tests are applied and any
malfunctions are analyze d. (In past experiences, digital IC (especially, DRAM and ROM) malfunctions are extremely rare after
installation in the product.)
This may be repaired by replacin g the IC, (DRAM etc.). However, the real cause may not have been an IC malfunction but a
solderin g fault instead.
Soldering faults difficult to detect with the naked eye are common, particularly for ASIC and RA (Resistor Array). But if you have
an oscilloscope, you can easily determine the problem site or IC malfunction by checking the main signal lines.
Even if you don ’t have such a measuring instrument, by checking each main signal line and resoldering it, in many cases the
problem will be resolved.
An explana tion of the main signals (for booting up the unit) is presented below.
W hat are the main signals for booting up the unit?
Please refer to DIGITAL BLOCK DIAGRAM (P.165).
The ASIC (IC604) controls all the other digital ICs. W hen the power is turned on, the ASIC retrieves the operation code stored
in the ROM (IC606), then follows the instructions for controlling each IC. All ICs have some inner registers that are assigned to
a certain address.
It is the address bus by which the ASIC designa tes the location inside each IC. And the data bus reads or writes the data in
order to transmit the instructions from the ASIC to the ICs.
These signal lines are all controlled by voltages of 3.3V (H) or 0V (L).
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							8.4.1. NG EXAMPLE
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							8.4.2. ASIC (IC604) PIN LAYOUT
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