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Panasonic KX FLB758RU User Manual

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    							©2003 Panasonic Communication Co., Ltd. All
    rights reserved. Unauthorized copying and
    distribution is a violation of law.
    KX-FLB758RU
    (for Russia)
    Multi-Function Laser Fax
    ORDER NO. KMF0307675C3
    Downloaded From ManualsPrinter.com Manuals 
    						
    							 1 INTRODUCTION 4
     1.1. ABOUT LEAD FREE SOLDER (PbF: Pb free) 
    4
     1.2. HOW TO RECOGNISE THAT Pb FREE SOLDER IS USED 
    5
     1.3. TRANSLATI ON LISTS 
    6
     1.4. SAFETY PRECAUTIONS 
    8
     1.5. INSULATION RESISTANCE TEST 
    8
     1.6. FOR SERVICE TECHNICIANS 
    8
     1.7. BATTERY CAUTION 
    8
     1.8. AC CAUTION 
    9
     1.9. PERSONAL SAFETY PRECAUTIONS 
    9
     1.10. SERVICE PRECAUTIONS 
    11
     2 FEATURES AND SPECIFICATIONS 
    12
     2.1. FEATURES 
    12
     2.2. SPECIFICAT IONS 
    13
     2.3. OPTIONAL ACCESSORIES 
    13
     3 INSTALLAT ION 
    14
     3.1. LOCATION OF CONTROLS 
    14
     3.2. CONNECTIONS 
    16
     3.3. CONNECTING TO A COMPUTER 
    17
     3.4. INSTALLATI ON 
    18
     3.5. INSTALLING MULTI-FUNCTION STATION SOFTW ARE  
    27
     4 MAINTENANCE 
    28
     4.1. MAINTENANCE ITEMS AND COMPONENT LOCATIONS  
    28
     4.2. PRINTING 
    30
     4.3. PRINTING (PAPER PICK UP) 
    31
     4.4. SCANNING (ADF) 
    32
     4.5. MAINTENANCE 
    33
     4.6. DOCUMENT JAMS 
    36
     4.7. RECORDING PAPER JAMS 
    37
     5 DISASSEMBLY INSTRUCTIONS 
    39
     5.1. UPPER MAIN CABINET SECTION  
    39
     5.2. LOW ER MAIN CABINET SECTION  
    40
     5.3. DOCUMENT COVER (ADF) SECTION  
    41
     5.4. PRINTER COVER SECTION  
    42
     5.5. HOW TO REMOVE THE PAPER TRAY, DOCUMENT
    COVER AND PAPER GUIDE 
    43
     5.6. HOW TO REMOVE THE PRINTER COVER 
    44
     5.7. HOW TO REMOVE THE PICK UP ROLLER ASS x 
    45
     5.8. HOW TO REMOVE THE DUCT UNIT AND FAN MOTOR  
    46
     5.9. HOW TO REMOVE THE BOTTOM PLATE 
    46
     5.10. HOW TO REMOVE THE ANALOG BOARD AND LSU 
    47
     5.11. HOW TO REMOVE THE DIGITAL BOARD AND MOTOR
    DRIVER BOARD 
    47
     5.12. HOW TO REMOVE THE POW ER BOARD, AND
    VARISTOR BOARD AND AC INLET 
    48
     5.13. HOW TO REMOVE THE MAIN FRAME 
    48
     5.14. HOW TO REMOVE THE REGISTRAT ION ROLLER 
    49  5.15. HOW TO REMOVE THE H.V.P.S 
    49
     5.16. HOW TO REMOVE THE HEAT ROLLER AND EXIT ROLLER 
    50
     5.17. HOW TO REMOVE THE PRESSURE ROLLER 
    50
     5.18. HOW TO REMOVE THE MOTOR BLOCK 
    51
     5.19. HOW TO REMOVE THE W HITE SHEET 
    52
     5.20. HOW TO REMOVE THE DOCUMENT GUIDE 
    53
     5.21. HOW TO REMOVE THE ADF RELAY BOARD 
    53
     5.22. HOW TO REMOVE THE FEED ROLLER AND ADF
    SEPARATIO N ROLLER 
    54
     5.23. HOW TO REMOVE THE TOP COVER AND CONVEYOR
    BLOCK 
    55
     5.24. HOW TO REMOVE THE ADF MOTOR AND PF SENSOR BOARD 
    56
     5.25. HOW TO REMOVE THE ADF EXIT ROLLER AND DRIVE
    ROLLER 
    56
     5.26. HOW TO REMOVE THE TRANSFER ROLLER 
    57
     5.27. HOW TO REMOVE THE OPERATION BOARD 
    58
     5.28. HOW TO REMOVE THE SCANNER GLASS UNIT AND
    CIS 
    59
     5.29. HOW TO REMOVE THE CIS RELAY BOARD AND CIS
    SENSOR BOARD 
    60
     5.30. HOW TO REMOVE THE CARRIAGE MOTOR AND SCAN MOTOR DRIVE BOARD 
    60
     5.31. NOTES FOR ASSEMBLING 
    61
     5.32. INSTALLATI ON POSITION OF THE LEAD 
    64
     6 TROUBLESHOOTING GUIDE 
    69
     6.1. USER RECOVERABLE ERRORS 
    69
     6.2. PROGRAMMING AND LISTS 
    71
     6.3. TEST FUNCTIONS 
    74
     6.4. REMOTE PROGRAMMING 
    77
     6.5. TROUBLESHOOTING DETAILS 
    85
     6.6. PROBLEMS W ITH PC SOFTW ARE 
    158
     7 CIRCUIT OPERATIONS 
    160
     7.1. CONNECTION DIAGRAM 
    160
     7.2. GENERAL BLOCK DIAGRAM 
    163
     7.3. FACSIMILE SECTION  
    165
     7.4. CIS CONTROL SECTION  
    173
     7.5. STEPPING MOTOR DRIVE SECTION  
    174
     7.6. FAN MOTOR SECTION  
    180
     7.7. SOLENOID DRIVE SECTION  
    182
     7.8. LSU (Laser Scanning Unit) SECTION 
    183
     7.9. SENSORS AND SW ITCHES SECTION  
    185
     7.10. OPERATION BOARD SECTION  
    194
     7.11. LCD SECTION 
    195
     7.12. HVPS (High Voltage Power Supply) SECTION 
    196
     7.13. HEAT LAMP CONTROL CIRCUIT 
    199
     7.14. POW ER SUPPLY BOARD SECTION  
    203
     8 REFERENCE MATERIALS DATA 
    206
     8.1. PRINTING OPERATION PRINCIPLE 
    206
    CONTENTS
     Page  Page
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    							 8.2. TERMINAL GUIDE OF THE ICs TRANSISTO RS ANDDIODES 
    215
     8.3. HOW TO REPLACE A FLAT PACKAGE IC 
    217
     8.4. DIGITAL BOARD SECTION  
    218
     8.5. MODEM SECTION 
    221
     8.6. NCU SECTION 
    227
     8.7. ITS (Integrated telephone System) and MONITOR SECTION  
    228
     8.8. TEST CHART 
    232
     9 FIXTURES AND TOOLS 
    234
     10  CABINET, MECHANICAL AND ELECTRICAL PARTS
    LOCATION  
    235
     10.1. GENERAL SECTON 
    235
     10.2. DOCUMENT TRAY BLOCK AND UPPER ADF SECTION  
    236
     10.3. CONVERYOR BLOCK SECTION 
    237
     10.4. LOW ER ADF SECTION 
    238
     10.5. UPPER PRINTER COVER SECTION  
    239
     10.6. LOW ER PRINTER SECTION 
    240
     10.7. UPPER MAIN CABINET SECTION  
    241
     10.8. LOW ER MAIN CABINET SECTION  
    242
     10.9. FUSER SECTION  
    243
     10.10.  MAIN FRAME SECTION 
    244
     10.11.  MOTOR SECTION 
    245
     10.12.  ACTUAL SIZE OF SCREW S AND W ASHER 
    246
     11  ACCESSORIES AND PACKING MATERIALS  
    247
     12  REPLACEMENT PARTS LIST 
    248
     12.1. CABINET AND ELECTRICAL PARTS 
    248
     12.2. ACCESSORIES AND PACKING MATERIALS 
    250
     12.3. DIGITAL BOARD PARTS 
    251
     12.4. ANALOG BOARD PARTS 
    254
     12.5. OPERATION BOARD PARTS 
    257
     12.6. HIGH VOLTAGE POW ER SUPPLY BOARD PARTS 
    257
     12.7. LOW VOLTAGE POW ER SUPPLY BOARD PARTS 
    258
     12.8. MOTOR DRIVE BOARD PARTS 
    259
     12.9. SENSOR BOARD PARTS 
    259
     12.10.  VARISTOR BOARD PARTS 
    259  12.11.  ADF RELAY BOARD PARTS 
    259
     12.12.  PF SENSOR BOARD PARTS 
    259
     12.13.  CIS RELAY BOARD PARTS 
    259
     12.14.  CIS SENSOR BOARD PARTS 
    260
     12.15.  SCAN MOTOR DRIVE BOARD PARTS 
    260
     12.16.  FIXTURES AND TOOLS  
    260
     13  FOR THE SCHEMATIC DIAGRAMS  
    261
     14  SCHEMATIC DIAGRAM 
    262
     14.1. DIGITAL BOARD (PCB1) 
    262
     15  SCHEMATIC DIAGRAM 
    266
     15.1. ANALOG BOARD (PCB2) 
    266
     15.2. OPERATION BOARD (PCB3) 
    268
     15.3. HIGH VOLTAGE POW ER SUPPLY BOARD (PCB4) 
    270
     15.4. LOW VOLTAGE POW ER SUPPLY BOARD (PCB5) 
    272
     15.5. MOTOR DRIVE BOARD (PCB6) 
    274
     15.6. SENSOR BOARD (PCB7) 
    275
     15.7. VARISTOR BOARD (PCB8) 
    275
     15.8. ADF RELAY BOARD (PCB9) 
    275
     15.9. PF SENSOR BOARD (PCB10) 
    275
     15.10.  CIS RELAY BOARD (PCB11) 
    275
     15.11.  CIS SENSOR BOARD (PCB12) 
    275
     15.12.  SCAN MOTOR DRIVER BOARD (PCB13) 
    275
     16  PRINTED CIRCUIT BOARD 
    276
     16.1. DIGITAL BOARD (PCB1) 
    276
     16.2. ANALOG BOARD (PCB2) 
    278
     16.3. OPERATION BOARD (PCB3) 
    280
     16.4. HIGH VOLTAGE POW ER SUPPLY BOARD (PCB4) 
    281
     16.5. LOW VOLTAGE POW ER SUPPLY BOARD (PCB5) 
    283
     16.6. MOTOR DRIVE BOARD (PCB6) 
    285
     16.7. SENSOR BOARD (PCB7) 
    286
     16.8. VARISTOR BOARD (PCB8) 
    287
     16.9. ADF RELAY BOARD (PCB9) 
    288
     16.10.  PF SENSOR BOARD (PCB10) 
    288
     16.11.  CIS RELAY BOARD (PCB11) 
    289
     16.12.  CIS SENSOR BOARD (PCB12) 
    290
     16.13.  SCAN MOTOR DRIVER BOARD (PCB13) 
    291
    3
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    							1 INTRODUCTION
    1.1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
    Note:In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
    contains lead.
    W e will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
    Silver, (Ag), and Copper, (Cu).
    This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
    work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
    Caution  
         · 
      
      PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a solderin g iron with
    temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature solderin g iron, please
    be careful not to heat too long.
     
         · 
      
      PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
     
      
      · 
      
      If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
    and be sure that any remaining is melted prior to applyin g the Pb solder.
     
         · 
      
      W hen applyin g PbF solder to double layered boards, please check the component side for excess which may flow onto the
    opposite side (See figure, below).
    1.1.1. SUGGESTED PBF SOLDER
    There are several types of PbF solder available commercially. W hile this product is manufactured using Tin, Silver, and Copper,
    (Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac-
    turer’s specific instructions for the melting points of their products and any precautions for using their product with other
    materials.
    The followin g lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
    4
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    							1.2. HOW TO RECOGNISE THAT Pb FREE SOLDER IS USED
    P.C.Boards marked as “PbF” use Pb Free solder. (See the figure below.)
    Pb Free is not used the Power Supply Board of this unit.
    (Example:Dig ital board)
    R664
    54C672 C675 R680
    IC608
    IC606
    IC610 RA623
    RA608
    RA607
    C699
    C698 C680 C6
    5
    C681
    R751
    R750
    R749
    RA613
    RA6
    C682
    R676
    C693
    24 25
    48
    1
    RA605
    RA606
    RA622 R674
    RA625 RA624
    RA614
    1
    CN610
    15
    R688+3.3V
    C771 Q614
    L639
    D603 Q613
    R733 L643
    R637 Q626
    Q627
    R638 R634
    R633
    F603
    Q604
    R618 R610
    R611
    Q608
    CN606
    CN603
    RA617
    R624 R623
    Q609Q622
    Q623
    Q624
    Q625
    R625
    1
    2
    CN609D604
    F604
    CN612
    CN613
    CN605
    C604 Q610 D608
    R723
    C752
    C740 8
    1
    4
    511
    1
    14
    1Q615R690
    F605
    C753
    C626
    L678C705
    S
    I
    I
    R613
    C602
    R606
    41
    80
    81 40
    603
    778
    PbF
    Marked(Digital Board : Component View)
    Note:
    The“PbF” marked may be found on differen t areas of the same P.C.Board,dep ending on manufacture date.
    5
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    							1.3. TRANSLATION LISTS
    1.3.1. HELP FUNCTION
    1.3.2. LCD MESSAGES
    6
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    							1.3.3. REPORTS
    7
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    							1.4. SAFETY PRECAUTIONS
     1. Before servicing, unplug the AC power cord to prevent an electric shock.
     2. W hen replacin g parts, use only the manufacturer´s recommended components.
     3. Check the conditio n of the power cord. Replace if wear or damage is evident.
     4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
     5. Before returning the serviced equipment to the customer, be sure to perform the followin g insulation resistance test to prevent the customer from being expose d to shock hazards.
    1.5. INSULATION RESISTANCE TEST
     1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
     2. Turn on the power switch.
     3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each expose d metal cabinet part
    (screw heads, control shafts, bottom frame, etc.).
    Note: Some expose d parts may be isolated from the chassis by design. These will read infinity.
     4. If the measurement is outside the specifie d limits, there is a possibility of a shock hazard.
    1.6. FOR SERVICE TECHNICIANS
    ICs and LSIs are vulnera ble to static electricity.
    When repairing, the following precautions will help preven t recurring malfunctions.
     1. Cover the plastic part ´s boxes with aluminum foil.
     2. Ground the solderin g irons.
     3. Use a conductive mat on the worktable.
     4. Do not touch the IC or LSI pins with bare fingers.
    1.7. BATTERY CAUTION
    CAUTION There is a danger of explosi on if the battery is incorrectly replaced. Replace only with the same or equivalent type
    recommended by the manufacturer. Dispose used batteries according to the manufacturer ’s instructions:
    The lithium battery is a critical component (type No. CR2032). Please observe for the proper polarity and exact location when
    replacin g and solderin g the replacement battery .
    8
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    							1.8. AC CAUTION
    For safety, before closing the lower cabinet, please make sure of the followin g precautions.
     1. The earth lead is fixed with the screw.
     2. The AC connector is connected properly.
     3. W ind the earth lead around the core 5 times.
     4. W ind the earth AC around the core 4 times.
    1.9. PERSONAL SAFETY PRECAUTIONS
    1.9.1. MOVING SECTIONS OF THE UNIT
    Be careful not to let your hair, clothes, fingers, accessories, etc., become caught in any moving sections of the unit.
    The moving sections of the unit are the rollers and a gear. There is a separation roller and a document feed roller which are rotated
    by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especia lly when the unit
    is operating.
    9
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    							1.9.2. LIVE ELECTRICAL SECTIONS
    All the electrical sections of the unit supplie d with AC power by the AC power cord are live.
    Never disassemble the unit for service with the AC power supply plugged in.
    CAUTION:AC voltage is supplie d to the primary side of the power supply unit. Therefo re, always unplug the AC power cord before
    disassembling for service.
    1.9.3. LASER BEAM AND FUSER UNIT SECTION
     
         · 
      
      The printer of this unit utilises a laser. Use of controls or adjustments or performance of procedures other than those specifie d
    herein may result in hazardous radiation exposu re.
     
         · 
      
      The fuser unit is inside of the unit and gets hot. Do not touch it when removing the jammed paper or cleanin g the lower glass.
    10
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