Motorola Sse 5000 6881094c12 A Manual

							6881094C12-ANovember 11, 2004
Theory of Operation: VOCON Board2-29
2.5.2.3.2  ESD Protection Circuitry
NOTE:See Figure 12-13. NCN6186_ VOCON Universal Connector Circuit on page 12-19.
Several components on the VOCON board protect the circuitry from ESD. The side connector signal 
lines have ESD protection components on them since they are exposed. These protection 
components include:
• 5.6-V zeners VR205, VR206, VR220, and VR221 on the SB9600 lines, RS232 lines, 
microphone lines, and option-select lines
• 12-V zeners VR201, VR203, and VR209 on the internal and external speaker and microphone  
audio lines
• 13-V zener VR204 on the OPTB+ line
• Low-capacitance ESD suppressors C205, C206, C209 D203, VR220,VR221, and VR205 on 
audio lines, USB datalines, and option-select lines
There were also several protection diodes on lines connected to the digital-support IC. These include 
C224, C225, C226, C227, VR205, and VR206. ESD protection for the battery status line is provided 
by a 5.6-V zener VR501.
2.5.2.3.3  Universal Connector Interface Circuitry
Some important components on the universal connector interface are two op-amps. The first op-
amp, U201, is used as a unity-gain buffer for the option-select line. Similarly, the other op-amp, 
U202, is used as a comparator for the buffered option-select line. The comparator threshold is 
determined by the voltage-divider network of R240 and R243. 
Universal Connector and Option Selects
The universal connector is located on the back of the radio. It is the external port or interface to the 
outside and is used for programming and interfacing to external accessories. The universal 
connector connects to the VOCON board at connector J102 via a flex circuit that is routed inside the 
external housing. Figure 2-9 shows the pinout for the universal side connector, and Table 2-10 
shows the pin assignments. Connections to J102 on the VOCON board are shown in Figure 2-10.
Figure 2-9.  Universal Side Connector
1
2
12
11
109
8 74563
EXT_SPKR_NEG                EXT_SPKR                       LHDATA
EXT_MIC                        CTSOUT                         LHBUSY
OPT_SEL                    OPT_B+/VPP                RTSIN/KEYFAIL 
1-WIRE               RS232_DOUT/USB_D+    RS232_DIN/USB_D- 
						

							November 11, 20046881094C12-A
2-30Theory of Operation: VOCON Board
Figure 2-10.  VOCON Board Connector J102 
Most of the signals are extensions of circuits described in other areas of this manual. However, the 
option-select pin is used to configure special modes: option-select 1 and option-select 2. This pin is 
controlled by accessories connected to the universal connector.Table 2-10.  Pin Assignments for Universal Side Connector
Pin NumberDescription
1 EXT_SPKR_NEG
2 EXT_SPKR_PLUS
3 LHDATA
4 EXT_MIC
5CTS_OUT
 6 LHBUSY
7 OPT_SEL
8 OPT_B+/VPP
9 RTSIN/KEYFAIL
10 1-WIRE
11 RS232_DOUT/USB+
12 RS232_DIN/USB- 
						

							6881094C12-ANovember 11, 2004
Theory of Operation: VOCON Board2-31
Table 2-11 outlines their functions as defined at the universal connector.
2.5.3 Display Module
NOTE:The VOCON kit is only compatible with the 7285419E01 display module.
The 7285419E01 display module is an integral 112 by 32 pixel bit-mapped, liquid-crystal display 
(LCD) module. The display module is connected to the VOCON board through flex connector J301. 
It uses chip-on-film technology and is not field repairable.
The display module is controlled by the dual-core processor MCU core, which programs the display 
through the serial peripheral interface (SPI) bus. The SPI bus programs the display through the 
serial data line (pin 10), serial clock line (pin 7), chip select line (pin 3), and register select line (pin 6) 
that is used to select the register to be programmed. The dual-core processor can reset the display 
module through pin 2. 
The display is supplied with 2.893V GCAP II regulated voltage (B700) to pins 11 and 14. Display 
backlighting is controlled by the dual-core processor GPIO line BL_EN signal through components 
R140 and Q101. The LEDs on the display module are powered by 5 V going through resistors R704, 
R705, and Q700. 
2.5.4 Controls and Control Top Flex
The housing assembly top controls include the On/Off/Volume switch (S1), a 16-position Channel 
Select switch, and a programmable three-position (A,B,C) toggle switch (S2). 
The side controls include three programmable pushbutton switches (top side button [SB1], side 
button 1 [SB2], side button 2 [SB3]) and a Push-to-Talk (PTT) switch (SW2). These components are 
connected through a flex circuit to the controller at J707. 
UNSW_B+ is routed through switch S1 to provide the B+SENSE signal, which is used to activate the 
SW_B+ and GCAP_B+ voltages that, in turn, power up the radio. Volume control is also provided by 
S1, which contains a potentiometer biased between V2 regulated voltage and ground. The VOL 
signal is a voltage level between V2 regulated voltage and ground, depending on the position of the 
knob. The VOL signal is fed to buffer U506 pin 3, and then the output of the buffer is voltage-divided 
down to 2.5 volts before the signal goes to the GCAP II IC AD5 pin. The dual-core processor reads 
the GCAP II IC A/D value through the SPI bus, and from this reading, the dual-core processor DSP 
adjusts the speaker volume.
Switch S2 is the three-position, programmable, toggle switch typically used for zone selection. The 
switch can output the following voltages: 0 volts, half of the V2 regulated voltage, or V2 regulated 
voltage (measurable at R523). The switch is connected to the GCAP II IC AD1 input pin through the 
voltage divider network of R519 and R523. The dual-core processor reads the A/D value through the 
SPI bus, and it uses that reading to determine the position of the toggle switch. Table 2-11.  Option Select Functions
FunctionOption Select 
Vo l t a g e
External PTT < 0.30
External Audio & Internal Antenna 1.25
External Audio & External Antenna 2.50
No Accessory Attached >4.40 
						

							November 11, 20046881094C12-A
2-32Theory of Operation: VOCON Board
Programmable side buttons SB1, SB2, and SB3 are active-low (activated when side button voltage 
is 0V). When the side buttons are not pressed there are 2 V on the respective lines. S1 is a binary-
coded switch. The output pins from U1, which are connected to GPIO pins on the dual-core 
processor, provide a four-bit binary word (signals RTA0, RTA1, RTA2, and RTA3) to the MCU, 
indicating to which of the 16 positions the rotary is set. 
2.5.5 VOCON Audio Paths
This section describes the VOCON transmit and receive audio paths.
2.5.5.1  Transmit Audio Path
Refer to Figure 2-11. The internal microphone audio enters the VOCON board through pin 8 of the 
M102 contact, and the internal microphone bias is set by circuitry that includes R531, R533, C519 
and C521. The internal microphone signal is connected to the MICIN_NEG pin, which is the input 
terminal on the GCAP II IC internal op-amp A3. The gain of the A3 op-amp is set by the values of 
R540, R555, and the resistance of EEPOT U509 (digital potentiometer), which is programmed by 
dual-core processor GPIO lines.
The external microphone audio enters the VOCON board through the remote connector J102, pin 
10, and the external microphone bias is set by circuitry that includes R563, R565, C547, and C548. 
The external microphone signal is connected to the AUX_MIC_NEG pin, which is an input terminal 
on the GCAP II IC internal op-amp A5. The gain of the A5 op-amp is set by the values of R566, 
R561, and the resistance of the EEPOT U509.
The dual-core processor, through the SPI bus, programs a multiplexer to select one of the 
microphone signals. Then, the selected amplified microphone signal goes through a programmable 
gain amplifier before it goes to the CODEC for A/D conversion. The resulting digital data is filtered 
and sent to the DSP on the SAP CODEC_TX line from the GCAP II IC TX pin. After additional 
filtering and processing, the DSP sends the data-out from the STDB pin to the RF interface 
connector P201 pin 4 (TX_DATA), which is connected to the DAC U203 on the transceiver board. 
						

							6881094C12-ANovember 11, 2004
Theory of Operation: VOCON Board2-33
Figure 2-11.  VOCON Transmit Audio Path
2.5.5.2  Receive Audio Path
Refer to Figure 2-12. The receive audio data comes from the Abacus III IC U500 through the RF 
interface connector P201 pin 12 (RX_DATA) to the dual-core processor SRDB pin. The DSP 
decodes the data and sends it out through the CODEC_RX line to the GCAP II IC RX pin. The 
CODEC filters and converts the digital data into an analog audio signal, which, in turn, is sent to a 
programmable gain amplifier. The dual-core processor programs a multiplexer to route the audio 
signal to the A4 amplifier, which has a fixed gain of 3.5 dB. The output of the A4 amplifier is pin 
EXTOUT.
From the EXTOUT pin, the audio signal goes through the pre-amplifier U502 and then to the audio 
power amplifier U503, which together provide approximately 30 dB of gain. The dual-core processor 
selects whether the amplified audio is routed to the internal speaker or the external speaker.
TP214INTERNAL MIC
Bias (R531,
R533, C519, C521)
and Input
(R540, C522)
EXTERNAL MIC
Bias (R563,
R565, C547, C548)
and Input
(R566, C549)
GCAP II IC U501
EEPOT U509
0 - 50K, 256 taps
MIC PREAMP
A3
Gain =
-14dB to 16dB
MIC PREAMP
A5
Gain =
-14dB to 16dB
EEPOT U509
0 - 50K, 256 tapsMUXPGA
-7 to +8dB
in 1dB steps
Set at 6dBCODEC A/D
13-bitHP FILTER
cutoff = 200HZ
LP FILTER
cutoff = 3.5KHZ
Patriot GPIO
PB4, PB5,
PB6, PB7Patriot SPIBPatriot SAP/BBPFlipper
U301
RF D/A
U203
(On RF Board)
TX_SSI_FSYNC
TX_SSI_CLK
TX_DATACODEC_FSYNC
CODEC_DCLK CODEC_TX GCAP_CE, SCKB
SPI_MISOB
SPI_MOSIB AUX_OUT
R561
MIC_OUT
R555
4
EEPOT_CS_EXT*
EEPOT_CS*
EEPOT_U_D*
EEPOT_INC*
4
3
MICIN
_NEG
AUX_MIC
_NEG
MAEPF-27418-A 
						

							November 11, 20046881094C12-A
2-34Theory of Operation: VOCON Board
Figure 2-12.  VOCON Receive Audio Path
2.5.6 Radio Power-Up/Power-Down Sequence
The radio power-up sequence begins when the user closes the radio On/Off switch on the control 
top, placing 7.5 Vdc on the B+SENSE line. This voltage enables the pass element Q501 and Q502, 
enabling SW_B+ and GCAP_B+.
When the GCAP II IC U501 detects a low-to-high voltage transition on GCAP_B+, it turns on and 
enables voltage supplies VSW1, VSW2, V2 and Vref. As soon as these voltages come up, the 
1.55 V regulator ramps up (only on the VOCON board), and the digital-support IC U301 drives the 
WDI line high to enable VCC5 from regulator U505 and to maintain the GCAP II IC in the ON state. If 
WDI remains low, the GCAP II IC turns off 50 ms after turning on.
The radio power-down sequence begins by opening the radio On/Off switch, which removes the 
B+SENSE signal from the VOCON board. This does not immediately remove power because the 
GCAP II IC has control of Q502 through Vref, and U301 through WDI maintains the GCAP II IC in an 
active state. Both the MCU and digital-support IC monitor B+SENSE. After B+SENSE is removed, 
the digital-support IC waits 125 ms. before releasing WDI to allow for software cleanup; however, the 
software has the ability to prolong this time if it was necessary to complete its operations. When WDI 
is released, the GCAP II IC shuts down its supplies and the rest of the radio through Q501.
GCAP II IC U501
LP FILTER
cutoff = 3.5KHZHP FILTER
cutoff = 200HZGCAP CODEC
13-bit D/APGA
-35 to 0dB
in 5dB steps
Default 0dBGCAP A4
Gain = 1.5
(3.5dB)
Audio_PA_Enable
0
0
1
1Audio_Mode_Sel
0
1
0
1Audio PA Status
Audio Off
Mute
Audio On
Audio OnMode (V)
1.5V 
						

							Chapter 3 Test Equipment and Service Aids
This chapter provides lists of test equipment and service aids, as well as information on field 
programming equipment that can be used in programming and servicing SSE 5000 radios at all of 
the three different levels of service.
3.1 Levels of Service
Level 1 service procedures, shown below, are all performed on the outside of the radio:
• Operating the radio
• Programming the radio
• Aligning the radio
• Checking radio performance
Level 2 service procedures are performed inside the radio, and include all Level 1 procedures, in 
addition to:
• Disassembling and reassembling the radio
• Replacing assemblies, controls, flexes, gaskets, connectors, microphones, speakers, etc.
• Replacing boards or modules
Level 3 service procedures include all Level 1 and Level 2 procedures, in addition to:
• Replacing components on boards or modules
Table 3-1 lists the test equipment used to perform Level 1 service procedures. Table 3-2 lists the 
service aids for all levels of service, and indicates the level for which each item is appropriate.
3.2 Test Equipment
The list of equipment contained in Table 3-1 includes all of the standard test equipment required for 
servicing the SSE 5000 radio. The “Characteristics” column is included so that equivalent equipment 
may be substituted, as needed.
Table 3-1.  Test Equipment
Motorola
Model NumberDescriptionCharacteristicsApplication
R2670_ or 
equivalentCommunications 
System AnalyzerThis monitor will substitute for 
items with an asterisk (*)Frequency/deviation meter and 
signal generator for wide-range 
troubleshooting and alignment
Agilent 8901B or 
equivalentModulation AnalyzerTransmitter parameter testing: 
deviation balance and limit
R1717_, R1737_, 
R1738_ or 
equivalentDigital MultimeterRecommended for ac/dc voltage 
and current measurements
WPLN4124_R or 
equivalentBattery Optimizing 
System (BOS) 
						

							November 11, 20046881094C12-A
3-2Test Equipment and Service Aids: Test Equipment
RL73063BOS Adapter for SSE 
5000
R1512_ or 
equivalentFunction Generator 
with Benchlinks 
Software
R1730_ or 
equivalent120 W Single-Output 
DC Power Supply0-20 Vdc, 0-5 Amps 
current limitedBench supply for 7.5 Vdc
R1736_ or 
equivalentScopemeter200 MHz
R1150_ or 
equivalent*Code SynthesizerInjection of audio and digital 
signaling codes
R1736_ or 
equivalent*Single-Channel 
Power/Voltmeter (AC)1 mV to 300 V, 10-Megohm 
input impedanceAudio voltage measurements
R1733_, R1734_ or 
equivalentDigital Dual-Trace 
Oscilloscope20 MHz bandwidth 5 mV to 
5 V/divisionWaveform measurements
R1515_ or 
equivalentMicrowave Counter225 MHz, frequency to 1.5 GHz
R1440_ or 
equivalent*WattmeterFixed-Element, BroadbandTransmitter power output 
measurements
S1339_ or 
equivalentRF Millivolt Meter100µV to 3V RFRF level measurements
R1013_ or 
equivalent*SINAD MeterReceiver sensitivity measurements
HP8903_ or 
equivalentAudio GeneratorUsed for RF tests (RX and TX)
RF GeneratorMust produce at least 1 GHz and 
FM modulation
RRDN4010_ or 
equivalentStandard RF Probe Kit
RRDN4011_ or 
equivalent50-ohm Diode Power 
Sensor500 KHz to 18 GHz, –70 to +20
0180386A82 or 
equivalentAnti-Static KitIncludes wrist strap, ground 
cords, table mat and floor matGuards against electrostatic 
discharge
R1735_Bandit Split Vision 
Rework System with 
Monitor
Table 3-1.  Test Equipment (Continued)
Motorola
Model NumberDescriptionCharacteristicsApplication 
						

							6881094C12-ANovember 11, 2004
Test Equipment and Service Aids: Service Aids 3-3
3.3 Service Aids
Refer to Table 3-2 for a listing and description of the service aids designed specifically for servicing 
this family of radios. These kits and/or parts are available from the Radio Products and Services 
Division offices listed in “Appendix B: Replacement Parts Ordering”. While all of these items are 
available from Motorola, most are standard shop equipment items, and any equivalent item capable 
of the same performance may be substituted for the item listed.
Table 3-2.  Service Aids
Motorola 
Part 
Number
DescriptionApplicationService 
Level
0180386A82 Anti-static grounding 
kitUsed during all radio assembly and disassembly procedures 1, 2, 3
RKN4121_ USB Cable Kit Connects radio to RLN-4460 Portable Test Set for radio 
performance checks, and to Universal Serial Bus (USB) port on 
personal computer for CPS programming and tuner 
alignments.1
RKN4122_ RS232 Cable Kit Connects radio to RLN-4460 Portable Test Set for radio 
performance checks, and to serial port on personal computer 
for CPS programming and tuner alignments.1
RLN4460_ Portable Test Set Used for radio performance checks and alignments. Connects 
to radio’s universal connector and allows remote switching and 
signal injection/outputs for test equipment measurements.1
RTL4224_ Battery Eliminator Used in place of battery to connect radio to an external power 
supply. 1
RVN4181_ Customer 
Programming Software 
(CPS) and Tuner 
SoftwareCPS allows customer-specific programming of modes and 
features. Tuner software required to perform alignment of radio 
parameters. 1
TKN8506_ Saber Keyload Cable Connects radio to keyloader for loading encryption keys. 1
5880384G68 SMA-BNC Adapter Adapts radio’s female SMA antenna port to BNC cabling of test 
equipment.1
RSX4043_ ROTO-TORQ Tool Adjustable torque screwdriver 2
6680321B79 Phillips Head Star Bit Bit used for attaching/detaching power contact screws. 2
6680370B88 Channel and Volume 
Switch Spanner Nut BitBit used for attaching/detaching volume control and channel 
select switch spanner nuts.2
6680371B34 Antenna Spanner Nut 
BitBit used for attaching/detaching antenna spanner nuts. 2
6680387A74 T-10 Torx Bit Bit used for attaching/detaching radio bolts. 2
8180384N70 Housing Eliminator Special fixture that allows radio’s internal board to be mounted 
externally. Provides easy access to electronic circuits, required 
for board-level troubleshooting.2
R1453 Digital-readout solder 
station Digitally controlled soldering iron 3 
						

							November 11, 20046881094C12-A
3-4Test Equipment and Service Aids: Service Aids
RLN4062 Hot-air workstation, 
120V Tool for hot-air soldering/desoldering of surface-mounted 
integrated circuits3
0180386A78 Illuminated magnifying 
glass with lens 
attachment Illumination and magnification of components 3
0180302E51 Master lens system3
6684253C72 Straight prober3
6680384A98 Brush3
1010041A86  Solder (RMA type), 63/
67, 0.5 mm diameter, 
1 lb. spool 3
0180303E45  SMD tool kit (included 
with R1319A) 3
R1319 ChipMaster (110V) Surface-mount removal and assembly of surface-mounted 
integrated circuits and/or rework station shields. Includes 5 
nozzles.3
R1321 ChipMaster (220V)3
R1364 Digital heated tweezer 
system Chip component removal 3
R1427 Board preheater Reduces heatsink on multi-level boards 3
6680309B53 Rework equipment 
catalog Contains application notes, procedures, and technical 
references used to rework equipment3
ChipMaster Options: 
6680370B54 0.710” x 0.710”  Heat-focus heads for R1319 workstation 3
6680370B57 0.245” x 0.245” 
6680370B58 0.340” x 0.340” 
6680371B15 0.460” x 0.560” 
Table 3-2.  Service Aids (Continued)
Motorola 
Part 
Number
DescriptionApplicationService 
Level