Asus S62 Service Guide

							
           S62 series Hardware Technical Specification Rev. 1.0 06/04/20 
 
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26  KEYDETECT0  Keyboard ID bit 0  I 
27 GND  Ground  GND 
28  KEYDETECT1  Keyboard ID bit 1  I 
 
5.6  Internal Touch Pad Pin assignment 
Vendor Part No. Pin No. 
ENTERY  6701-20  10 Pin (SMT) 
 
No Signal Description Type 
1 +5VS  Power  P 
2 +5VS  Power  P 
3 TPAD_DAT  PS/2 DATA  I/O 
4 TPAD_DAT  PS/2 DATA  I/O 
5 TPAD_CLK  PS/2 Clock  I/O
 
6 TPAD_CLK  PS/2 Clock  I/O 
7 GND  Ground  P 
8 GND  Ground  P 
9 TP_LEFT_SW# Left Switch  I 
10  NC
 
  
11 NC     
12 TP_RIGHT_SW# Right Switch  I  
						

							
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5.7 1ST Battery pin assignment 
No Signal Description Type 
1  BAT_CON  Battery input/output voltage  P 
2  BAT_CON  Battery input/output voltage  P 
3  BAT1_CNT1#  NVDC control pin 1  I 
4  BAT1_CNT2#  NVDC control pin 2  I 
5  SMCLK_BAT  SMB Bus Clock  I/O 
6  SMDATA_BAT  SMB Bus DATA  I/O 
7 TS#  Thermal Pin  O 
8 GND  Ground  P 
9 GND  Ground  P 
 
5.8  DC in Jack pin assignment 
Vendor Part No. Pin No. 
SINGATRON  2DC-G026B201  4 Pin (DIP) 
 
No Signal Description Type 
1  A/D_DOCK_IN  Adapter input voltage  P 
2 GND  Ground  P 
3 GND  Ground  P 
4 GND  Ground  P 
 
5.9 Audio Jack 
5.9.1  Internal Speaker Jack 
Vendor Part No. Pin No. 
ACES  85204-04001  4 Pin (SMT) 
 
No Signal Description Type 
1 INTSPKR+  Internal speaker  signal channel positive  O  
						

							
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2 INTSPKR-  Internal spea ker left sound negative  O 
3 INTSPKL+  Internal speaker  signal channel positive  O 
4  INTSPKL-  Internal speaker left sound negative  O 
 
5.9.2 Headphone Jack 
Vendor Part No. Pin No. 
SINGATRON  2SJ-A373-001  10 Pin (DIP) 
 
No Signal Description Type 
1  EARR  Headphone right sound  O 
4  EARL  Headphone left sound  O 
5 GND  Ground  P 
6 GND  Ground  P 
7  JACK_IN#  S/PDIF/Headphone be plugged in  I 
9 GND  Ground  P 
10 GND  Ground  P 
A GND  Ground  P 
B  +5VS  +5V power for S/PDIF  P 
C  SPDIF_O  S/PDIF output   O 
 
5.9.3 Microphone Jack 
Vendor Part No. Pin No. 
FOXCONN  JA6333L-B200-7F  5 Pin (DIP) 
 
No Signal Description Type 
1 GND  Ground  P 
2  MIC_CENTER  External microphone input   O 
3 NC  No Connection   
4 MIC_BIAS  Internal MIC connection/BIAS.  I 
5 NC  No Connection   
6  EXT_MIC  Internal Microphone switch out connection  O  
						

							
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5.10  Fan Pin Assignment 
Vendor Part No. Pin No. 
ACES  85205-03701  3 Pin (SMT) 
 
No Signal Description Type 
1  +5VS_FAN  5V Power Supply  P 
2  FANSP1  FAN speed signal input  I 
3 GND  Ground  P 
 
5.11  Inverter pin assignment 
Vendor Part No. Pin No. 
E&T  3753-20  20 Pin (SMT) 
 
No Signal Description Type 
1 NC  No Connection   
2  AC_BAT_SYS  Ac in voltage  P 
3  +5V_USB35  USB 5V power  P 
4  AC_BAT_SYS  Ac in voltage  P 
5  +5V_USB35  USB 5V power  P 
6 GND  Ground  P 
7 GND  Ground  I/O 
8  LID_SW#  LID Switch signal output(Reserve)  O 
9 GND Ground  I/O 
10 BACK_ADJ  Brightness signal adjustment  O 
11 GND Ground  P 
12 BACK_OFF#  Turn Off Backlight  O 
13 USB_P3-  USB- signals of CCD Camera  I/O 
14 +3VA  3.3V power for LID switch  P 
15 USB_P3+  USB+ signals of CCD Camera  I/O 
16 GND Ground  P  
						

							
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17  GND Ground  P 
18 INTMIC_A_GND Audio Ground  P 
19 GND Ground  P 
20 INVMIC_A Internal MIC  I 
*** 
5.12 MDC signal 
Vendor Part No. Pin No. 
AMP  1-179397-2  12 Pin (SMT) 
 
No Signal Description Type 
1 
GND
 
Ground NC 
2 NC  None  NC 
3 SDOUT  DATA OUT  I 
4 NC  None  NC 
5 GND  Ground  NC 
6 +3V  Power +3V  P 
7 SYNC  SYNC  O 
8 GND  Ground  P 
9 SDIN  DATA IN  O 
10 GND  Ground  P 
11 RST#  AC Reset  I 
12 BCLK  Azalia Clock  O 
 
5.13  1394 pin assignment 
Vendor Part No. Pin No. 
SUYIN  020204FR004S502ZA  4 Pin (DIP) 
 
No Signal Description Type 
1  LTPB0-  Twisted-pair cable A negative  I/O 
2  LTPB0+  Twisted-pair cable B positive  I/O 
3  LTPA0-  Twisted-pair cable A negative  I/O  
						

							
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4  LTPA0+  Twisted-pair cable A positive  I/O 
 
5.14  USB pin assignment 
Vendor Part No. Pin No. 
SUYIN  020122MR008S523ZA  8 Pin (DIP) 
 
No Signal Description Type 
1  +5V_USB01  USB 5V power  P 
2  USB_P0-  USB port 0 negative signal  I/O 
3  USB_P0+  USB port 0 positive signal  I/O 
4  GND  USB 5V ground  P 
5  +5V_USB01  USB 5V power  P 
6  USB_P1-  USB port 1 negative signal  I/O 
7  USB_P1+  USB port 1 positive signal  I/O 
8  GND  USB 5V ground  P 
 
Vendor Part No. Pin No. 
SUYIN  020122MR008S523ZA  8 Pin (DIP) 
 
No Signal Description Type 
1  +5V_USB23  USB 5V power  P 
2  USB_P2-  USB port 2 negative signal  I/O 
3  USB_P2+  USB port 2 positive signal  I/O 
4  GND  USB 5V ground  P 
5  +5V_USB23  USB 5V power  P 
6  USB_P3-  USB port 3 negative signal  I/O 
7  USB_P3+  USB port 3 positive signal  I/O 
8  GND  USB 5V ground  P 
 
5.15  LAN & Modem pin assignment 
Vendor Part No. Pin No.  
						

							
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ALLTOP  C10089-112A4-Y  12 Pin (DIP) 
 
No Signal Description Type 
1 None  None  NC 
2 RJ11_RING  Modem signal  I/O 
3 RJ11_TIP  Modem signal  I/O 
4 None  None  NC 
5  LAN_TXP  Transmit data positive signal  O 
6  LAN_TXN  Transmit data negative signal  O 
7  LAN_RXP  Receive data positive signal  I 
8 LAN_MDI2P  GigaLan MDI2+  I 
9 LAN_MDI2N  GigaLan MDI2-  I 
10  LAN_RXN  Receive data negative signal  I 
11 LAN_MDI3P  GigaLan MDI3+  I 
12 LAN_MDI3N  GigaLan MDI3-  I 
 
5.16  Card Reader pin assignment 
Vendor Part No. Pin No. 
TAITWUN  R009-030-LR  21 Pin (SMT) 
 
Pin No Signal Remark 
1. SD_DAT1   
2.   SD_DAT0   
3   SD_GND  
4 MS_GND   
5 MS_BS   
6 SD_CLK   
7 MS_DATA1   
8 MS_DATA0   
9 VCC   
10 MS_DATA2   
11 SD_GND    
						

							
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12 MS_CD   
13 MS_DATA3   
14 SD_CMD   
15 MS_SCLK   
16 MS_VCC   
17 SD_DAT3   
18 GND   
19 SD_DAT2   
20 SD_WP   
21 SD_CD   
 
6 POWER MANAGEMENT 
6.1  System power plane 
Power Group Power Control 
Pin 
Controlled Devices 
+12V SUSC# Control 
+5V  SUSC#  PCMCIA Slot 5V, USB 
+3.3V  SUSC#  NB, DDR, PCMCIA C ontroller, PCMCIA Slot 3.3V, 
Keyboard Controller 
+2.5VS  SUSC#  VGA DAC/GLAN power 
+12VS SUSB# Control 
+5VS  SUSB#  HDD, CD-ROM, Internal Touch Pad, Audio AMP 
+3.3VS  SUSB#  SB, Audio, Clock Gene rator, PCI interface, Super I/O, 
VGA, AC97 CODEC, FWH, Thermal sensor, IR 
+1.8V SUSC# PCMCIA ch ip power, DDR2 power 
+1.5VS SUSB# NB Core 
+0.9VS SUSB# DDR Termination 
+1.05VS  SUSB#  CPU, NB AG TL+ Bus power, NB core 
+VCORE CPU_VRON CPU power 
+5VA   
+3.3VA    Resume Power, EC,ISA ROM 
+V_RTC  ICH7-M(RTC) 
  
						

							
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6.2  Power management mode 
6.2.1 Full-On mode 
All system devices are not power managed and the sy stem can respond to applications with maximum 
performance. 
6.2.2 Doze mode 
The CPU clock is slow down but all other devices are full on.  
6.2.3  Stand by mode 
A suspend state where all motherboard components ar e still powered-on except for the system clock 
generator device. The PCI and CPU buses are driven to  the inactive idle state. The system memory is 
powered and refreshed by the memory bridge, and  the graphics frame buffer is powered and refreshed 
by the graphic chip. The system provides a 32KHz  clock (SUSCLK) in this suspend mode to support 
refresh of these memory subsystems. Only an enabled  “resume event” can bring the system out of the 
stand by state. The south bridge also provides a resu me timer that allows the system to resume after a 
programmed time has elapsed. 
6.2.4  Suspend to RAM mode (STR) 
A suspend state where all mother board components are powered-off. The CPU and PCI busses are 
powered off. All devices connected to the CPU and PC I busses must either be powered-off or isolate 
their bus interfaces. The system memory is pow ered and refreshed by the memory bridge, and the 
graphics frame buffer is powered and refreshed by  the graphics chip. The system provides a 32 kHz 
clock (SUSCLK) in this suspend mode to support  refresh of these memory subsystems. Only an enabled 
“resume event” can bring the platform out  of the suspend to RAM (STR) state. 
6.2.5  Suspend to disk mode (STD) 
A suspend state where the context of the entire system is saved to disk, all motherboard components are 
powered-off, and all clocks are stopped. Any enabled “resume  event”, such as Power switch or RTC, can 
bring the platform out of the suspend to disk (STD) state. 
6.2.6  Soft off mode (SOFF) 
This is the same as suspend to di sk except the context of memory is  not saved. The system will resume 
from Soft Off as if a hard reset had occurred. 
 
6.2.7  Mechanical off mode (MOFF) 
All power except the RTC has been removed from the system. 
 
6.3  PMU mode transition event 
The following table summarizes the entry events  and wake-up events of each power management mode. 
Power State  Entry Event  Wake up Event  
Doze   Doze Time out  Predefined Memory/IO range access  
Ring Indicator Keystroke 
Mouse movement  
						

							
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IRQ 1-15 
Stand by  Stand by Time out 
Stand by hot key pressed  Predefined Memory/IO range access 
Battery Warning 
Battery Low 
Ring Indicator 
Keystroke 
Mouse movement 
Schedule Alarm 
STR  Suspend Time out 
STR hot key pressed 
Suspend button 
Battery Low  Power Button 
Ring Indicator 
Keystroke (Int. KB) 
Schedule Alarm  
STD  Suspend Time out 
STD hot key pressed 
Hibernate 
Battery Low  Power Button 
Schedule Alarm  
Soft Off  Power button 
Execute Windows shutdown command  Power Button 
Schedule Alarm