HP Pavilion G6 User Manual
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Page 81
When replacing the system board, be sure that the following components are removed from the defective system board and installed on the replacement system board: ●Heat sink assembly (see Heat sink assembly on page 75) ●Processor (see Processor on page 79) Reverse this procedure to install the system board. Component replacement procedures 73
Page 82
RTC battery DescriptionSpare part number RTC battery (includes mounting adhesive) 637193-001 Before removing the RTC battery, remove the following components: 1.Battery (see Battery on page 43) 2.Service access cover (see Service access cover on page 44) 3.Hard drive (see Hard drive on page 45) 4.Optical drive (see Optical drive on page 47) 5.WLAN module (see WLAN module on page 49) 6.Memory module (see Memory module on page 51) 7.Keyboard (see Keyboard on page 52) 8.Top cover (see Top cover on...
Page 83
Heat sink assembly NOTE:The heat sink assembly includes replacement thermal material. The heat sink fan is available separately, using spare part number 639460-001. DescriptionSpare part number For use in AMD UMA computer models 639463-001 For use in Intel UMA HM55 computer models 637189-001 For use in Intel discrete HM55 computer models 637190-001 For use in AMD discrete computer models 639462-001 Before removing the heat sink assembly, remove the following components: 1.Battery (see Battery on page...
Page 84
4.Remove the heat sink assembly (3) by lifting it straight up. NOTE:Steps 6 through 10 apply only to computer models equipped with AMD processors. 5.Position the system board right-side up, with the front toward you. 6.Disconnect the fan cable from the system board (1). 7.Remove the three Phillips 3.0×2.0 screws (2) that secure the heat sink assembly to the system board. NOTE:Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it might...
Page 85
9.Remove the heat sink assembly (4) by lifting straight up. Each time the heat sink assembly is removed, the thermal material must be thoroughly cleaned from the system board at locations (1) and (2), from the heat sink assembly at locations (4) and (5), and from the processor (3). Thermal pads and thermal paste must be installed on all surfaces before the heat sink assembly is reinstalled. NOTE:Thermal pads and thermal paste are included with all heat sink assembly, system board, and processor spare...
Page 86
The following illustration shows the locations for thermal material on systems with AMD processors. After applying fresh thermal paste to the components, reverse the above procedure to install the heat sink assembly. 78 Chapter 4 Removal and replacement procedures
Page 87
Processor NOTE:All processor spare part kits include thermal material. DescriptionSpare part number Intel Core™ i7-2620M processor (2.7 GHz, SC turbo up to 3.40 GHz, 4 MB L3), Dual 35 W 631252-001 Intel Core™ i5-2540M processor (2.6 GHz,SC turbo up to 3.3 GHz, 3 MB L3), Dual 35 W 631255-001 Intel Core™ i5-2520M processor (2.5 GHz, SC turbo up to 3.2 GHz, 3 MB L3), Dual 35 W 631253-001 Intel Core™ i5-2410M processor (2.3 GHz, SC turbo up to 2.9 GHz, 3 MB L3), Dual 35 W 638039-001 Intel Core i3 2310M (2.1...
Page 88
7.Keyboard (see Keyboard on page 52) 8.Top cover (see Top cover on page 55) 9.USB board (see USB board on page 62) 10.Display assembly (see Display assembly on page 64) 11.Power connector (see Power connector on page 63) 12.System board (see System board on page 71) 13.Heat sink assembly (see Heat sink assembly on page 75) Remove the processor: 1.Turn the processor locking screw (1) one half-turn counterclockwise until you hear a click. 2.Lift the processor (2) straight up and remove it. NOTE:The...
Page 89
5 Specifications Computer specifications Dimensions Depth24.5 cm (9.6 in) Width37.4 cm (14.7 in) Height (front to rear)3.1 to 3.6 cm (1.2 to 1.4 in) Weight (lowest weight configuration) < 2.5 kg (5.5 lbs) Input power Operating voltage 18.5 V dc @ 3.5 A - 65W Operating current 3.5 A Temperature Operating (not writing to optical disc)0°C to 35°C (32°F to 95°F) Operating (writing to optical disc)5°C to 35°C (41°F to 95°F) Nonoperating-20°C to 60°C (-4°F to 140°F) Relative humidity Operating 10% to 90%...
Page 90
39.6-cm (15.6-in) display specifications Dimensions Height21.0 cm (8.27 in) Width35.9 cm (14.1 in) Diagonal39.6 cm (15.6) Number of colorsUp to 16.8 million Contrast ratio300:1 (typical) Brightness200 nits (typical) Pixel resolution Pitch 0.259 × 0.259 mm Format 1280 × 800; HD: 1366 × 768 Configuration RGB vertical stripe BacklightLED Character display80 × 25 Total power consumption4.0 W Viewing angle±40° horizontal, +120/-40° vertical (typical) 82 Chapter 5 Specifications