HP Pavilion G6 User Manual

							When replacing the system board, be sure that the following components are removed from the
defective system board and installed on the replacement system board:
●Heat sink assembly (see 
Heat sink assembly on page 75)
●Processor (see 
Processor on page 79)
Reverse this procedure to install the system board.
Component replacement procedures 73 
						

							RTC battery 
DescriptionSpare part number
RTC battery (includes mounting adhesive) 637193-001
Before removing the RTC battery, remove the following components:
1.Battery (see 
Battery on page 43)
2.Service access cover (see 
Service access cover on page 44)
3.Hard drive (see 
Hard drive on page 45)
4.Optical drive (see 
Optical drive on page 47)
5.WLAN module (see 
WLAN module on page 49)
6.Memory module (see 
Memory module on page 51)
7.Keyboard (see 
Keyboard on page 52)
8.Top cover (see 
Top cover on page 55)
9.TouchPad LED board (see 
TouchPad LED board on page 60)
10.USB board (see 
USB board on page 62)
11.Power connector (see 
Power connector on page 63)
12.Display assembly (see 
USB board on page 62)
13.System board (see 
System board on page 71)
Remove the RTC battery:
1.Position the system board face up, with the front toward you.
2.Disconnect the RTC battery connector from the system board (1).
3.Remove the RTC battery (2).
Reverse this procedure to install the RTC battery.
74 Chapter 4   Removal and replacement procedures 
						

							Heat sink assembly
NOTE:The heat sink assembly includes replacement thermal material. The heat sink fan is
available separately, using spare part number 639460-001.
DescriptionSpare part number
For use in AMD UMA computer models 639463-001
For use in Intel UMA HM55 computer models 637189-001
For use in Intel discrete HM55 computer models 637190-001
For use in AMD discrete computer models 639462-001
Before removing the heat sink assembly, remove the following components:
1.Battery (see 
Battery on page 43)
2.Service access cover (see 
Service access cover on page 44)
3.Hard drive (See 
Hard drive on page 45)
4.Optical drive (see 
Optical drive on page 47)
5.WLAN module (see 
WLAN module on page 49)
6.Memory module (see 
Memory module on page 51)
7.Keyboard (see 
Keyboard on page 52)
8.Top cover (see 
Top cover on page 55)
9.USB board (see 
USB board on page 62)
10.Display assembly (see 
Display assembly on page 64)
11.Power connector (see 
Power connector on page 63)
12.System board (see 
System board on page 71)
Remove the heat sink assembly (heat sink appearance may vary):
NOTE:Steps 1 through 5 apply only to computer models equipped with Intel processors.
1.Position the system board right-side up, with the front toward you.
2.Disconnect the fan cable from the system board (1).
3.Follow the sequence embossed on heat sink to loosen the seven Phillips 10.0×2.0 captive
screws (2) that secure the heat sink assembly to the system board.
NOTE:Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it might be necessary to move the heat sink assembly
from side to side to detach the assembly.
Component replacement procedures 75 
						

							4.Remove the heat sink assembly (3) by lifting it straight up.
NOTE:Steps 6 through 10 apply only to computer models equipped with AMD processors.
5.Position the system board right-side up, with the front toward you.
6.Disconnect the fan cable from the system board (1).
7.Remove the three Phillips 3.0×2.0 screws (2) that secure the heat sink assembly to the system
board.
NOTE:Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it might be necessary to move the heat sink assembly
from side to side to detach the assembly.
8.Follow the sequence embossed on the heat sink to loosen the three Phillips 10.0×2.0 captive
screws (3) that secure the heat sink assembly to the system board.
76 Chapter 4   Removal and replacement procedures 
						

							9.Remove the heat sink assembly (4) by lifting straight up.
Each time the heat sink assembly is removed, the thermal material must be thoroughly cleaned from
the system board at locations (1) and (2), from the heat sink assembly at locations (4) and (5), and
from the processor (3). Thermal pads and thermal paste must be installed on all surfaces before the
heat sink assembly is reinstalled.
NOTE:Thermal pads and thermal paste are included with all heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with Intel processors.
Each time the heat sink assembly is removed, the thermal material must be thoroughly cleaned from
the system board at locations (1), (2), and (3), from the heat sink assembly at locations (5), (6), and
(7), and from the processor (4). Thermal pads and thermal paste must be installed on all surfaces
before the heat sink assembly is reinstalled.
Component replacement procedures 77 
						

							The following illustration shows the locations for thermal material on systems with AMD processors.
After applying fresh thermal paste to the components, reverse the above procedure to install the heat
sink assembly.
78 Chapter 4   Removal and replacement procedures 
						

							Processor
NOTE:All processor spare part kits include thermal material.
DescriptionSpare part number
Intel Core™ i7-2620M processor (2.7 GHz, SC turbo up to 3.40 GHz, 4 MB L3), Dual 35 W 631252-001
Intel Core™ i5-2540M processor (2.6 GHz,SC turbo up to 3.3 GHz, 3 MB L3), Dual 35 W 631255-001
Intel Core™ i5-2520M processor (2.5 GHz, SC turbo up to 3.2 GHz, 3 MB L3), Dual 35 W 631253-001
Intel Core™ i5-2410M processor (2.3 GHz, SC turbo up to 2.9 GHz, 3 MB L3), Dual 35 W 638039-001
Intel Core i3 2310M (2.1 GHz, 3 MB L3) Dual 35 W 638037-001
Intel Core™ i5-480M processor (2.66 GHz, SC turbo up to 2.93 GHz, 3 MB L3), Dual 35 W 634693-001
Intel Core™ i3-390M processor (2.66 GHz, 3 MB L3), Dual 35 W 634692-001
Intel Core™ i3-380M processor (2.53 GHz, 3 MB L3), Dual 35 W 625823-001
Intel Pentium P6300 (2.26 GHz, 3 MB L3), Dual 35 W 635500-001
Intel Pentium P6200 (2.13 GHz, 3 MB L3), Dual 35 W 625831-001
Phenom II N970 (2.2GHz, 2MB L2, 1333MHz, 3.6GT/s –Quad 35W 635496-001
Phenom II P960 (1.8GHz, 2MB L2, 1066MHz, 3.6GT/s – Quad 25W 634689-001
Phenom II N870 (2.3GHz, 1.5MB L2, 1333MHz, 3.6GT/s –Triple 35W 635495-001
Phenom II P860 (2.0GHz, 1.5MB L2, 1066MHz, 3.6GT/s –Triple 25W 634688-001
Phenom II N850 (2.2GHz, 1.5MB L2, 1333MHz, 3.6GT/s –Triple 35W 616345-001
Phenom II N660 (3.0GHz, 2MB L2, 1333MHz, 3.6GT/s –Dual 35W 635494-001
Phenom II P650 (2.6GHz, 2MB L2, 1066MHz, 3.6GT/s – Dual 25W 634687-001
Turion II P560 (2.5GHz, 2MB L2, 1066MHz, 3.6GT/s–Dual 25W 634691-001
Athlon II P360 (2.3GHz, 1MB L2, 1066MHz, 3.6GT/s–Dual 25W 636635-001
Athlon II P340 (2.2GHz, 1MB L2, 1066MHz, 3.2GT/s–Dual 25W 616343-001
V160 (2.4GHz, 512K L2, 1066MHz, 3.2GT/s) – SC 25W 636634-001
V140 (2.3GHz, 512K L2, 1066MHz, 3.2GT/s) – SC 25W 616333-001
Before removing the processor, remove the following components:
1.Battery (see 
Battery on page 43)
2.Service access cover (see 
Service access cover on page 44)
3.Hard drive (See 
Hard drive on page 45)
4.Optical drive (see 
Optical drive on page 47)
5.WLAN module (see 
WLAN module on page 49)
6.Memory module (see 
Memory module on page 51)
Component replacement procedures 79 
						

							7.Keyboard (see Keyboard on page 52)
8.Top cover (see 
Top cover on page 55)
9.USB board (see 
USB board on page 62)
10.Display assembly (see 
Display assembly on page 64)
11.Power connector (see 
Power connector on page 63)
12.System board (see 
System board on page 71)
13.Heat sink assembly (see 
Heat sink assembly on page 75)
Remove the processor:
1.Turn the processor locking screw (1) one half-turn counterclockwise until you hear a click.
2.Lift the processor (2) straight up and remove it.
NOTE:The gold triangle (3) on the processor must be aligned with the triangle icon (4)
embossed on the processor socket when you install the processor.
Reverse this procedure to install the processor.
80 Chapter 4   Removal and replacement procedures 
						

							5 Specifications
Computer specifications
Dimensions
Depth24.5 cm (9.6 in)
Width37.4 cm (14.7 in)
Height (front to rear)3.1 to 3.6 cm (1.2 to 1.4 in)
Weight (lowest weight configuration) < 2.5 kg (5.5 lbs)
Input power
Operating voltage 18.5 V dc @ 3.5 A - 65W
Operating current 3.5 A
Temperature
Operating (not writing to optical disc)0°C to 35°C (32°F to 95°F)
Operating (writing to optical disc)5°C to 35°C (41°F to 95°F)
Nonoperating-20°C to 60°C (-4°F to 140°F)
Relative humidity
Operating 10% to 90%
Nonoperating 5% to 95%
Maximum altitude (unpressurized)
Operating-15 m to 3,048 m (-50 ft to 10,000 ft)
Nonoperating-15 m to 12,192 m (-50 ft to 40,000 ft)
NOTE:Applicable product safety standards specify thermal limits for plastic surfaces. The computer operates well within
this range of temperatures.
Computer specifications 81 
						

							39.6-cm (15.6-in) display specifications
Dimensions
Height21.0 cm (8.27 in)
Width35.9 cm (14.1 in)
Diagonal39.6 cm (15.6)
Number of colorsUp to 16.8 million
Contrast ratio300:1 (typical)
Brightness200 nits (typical)
Pixel resolution
Pitch 0.259 × 0.259 mm
Format 1280 × 800; HD: 1366 × 768
Configuration RGB vertical stripe
BacklightLED
Character display80 × 25
Total power consumption4.0 W
Viewing angle±40° horizontal, +120/-40° vertical (typical)
82 Chapter 5   Specifications