Apple eMac User Manual

							 
58  
eMac Take Apart
 Hard Drive Carrier • Remove the Faraday cage.
• Remove the digital module assembly.
• Remove the hard drive.  Procedure  1. Remove the seven carrier screws. Peel back the EMI tape on the on both sides of the 
carrier. 
2. Lift the carrier off the logic board. 
						

							 
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 Logic Board Heatsink  Logic Board Heatsink  Tools  This procedure requires the following tools:
• Screwdriver to pry the heatsink clip  Part Location
Preliminary Steps 
Before you begin, do the following:
• Place the computer face down on an ESD mat.
• Remove the user access door. 
• Remove the feet.
• Remove the rear housing. 
• Discharge the CRT. 
• Remove the fan.
• Remove the Faraday cage.
• Remove the digital module assembly. 
						

							 
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eMac Take Apart
 Logic Board Heatsink • Remove the hard drive.
• Remove the hard drive carrier.  Procedure  1. With a screwdriver, pry the heatsink clip out of the hole on the logic board.
2. Lift the heatsink off the logic board.  
Replacement Note: 
 Whenever the heatsink is 
removed, the bottom side of the heatsink and the top of the microprocessor must be 
cleaned and thermal paste must be applied to the microprocessor. If the mating 
surfaces are not cleaned and thermal paste is not applied, the CPU may overheat and 
become damaged. Refer to the next topic, “Thermal Paste Application”. 
						

							 
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 Logic Board Heatsink  Thermal Paste Application  The microprocessor uses a heatsink/thermal pipe to transfer heat away. Whenever the 
heatsink is removed, the bottom side of the heatsink and the top of the microprocessor 
must be cleaned and thermal paste must be applied. If the mating surfaces are not 
cleaned and thermal paste is not applied, the CPU may overheat and become damaged.  Tools  This procedure requires the following tools:
• Plastic stylus or nylon probe tool (922-5065) to remove the old thermal paste
• Thermal paste (922-4757), each tube contains 4-5 applications  Procedure  1. Thoroughly clean the thermal film from the heatsink surface with a plastic stylus or the 
nylon probe tool. Do not use an abrasive material or liquid cleaner. 
 Important:
  Be 
e
xtremely careful not to bend the heatpipes on the heatsink. 
						

							 
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eMac Take Apart
 Logic Board Heatsink 2. Carefully clean the surface of the microprocessor with a plastic stylus or nylon probe 
tool (922-5065) to remove the old thermal paste. 
3.  Squeeze a drop of thermal paste onto the middle of the microprocessor as 
shown. 
						

							 
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 Logic Board Heatsink4. Spread the paste evenly over the processor. 
  Important:
    On this product, 
 it is critical 
to spread
   
  the paste over the processor
  , or the chip could overheat. 
5. Reinstall the heatsink and heatsink clip. 
						

							 
64  
eMac Take Apart
 Logic Board  Logic Board  Tools  This procedure requires the following tools:
• Phillips #2 screwdriver  Part Location
Preliminary Steps 
Before you begin, do the following:
• Place the computer face down on an ESD mat.
• Remove the user access door. 
• Remove the feet.
• Remove the rear housing. 
• Discharge the CRT. 
• Remove the fan.
• Remove the Faraday cage. 
						

							 
 eMac  Take Apart -  
65  
 Logic Board• Remove the digital module assembly.
• Remove the hard drive.
• Remove the down converter.
• Remove the hard drive carrier.
• Remove the logic board heatsink.  Procedure  1. Carefully position the assembly on the optical drive door. Disconnect the optical data 
cable and the optical power cable.  
						

							 
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eMac Take Apart
 Logic Board 2. Turn the assembly so the logic board is facing up. Remove the four screws on the logic 
board. 
  Note:
   The screw in the bottom left corner is different from the other three 
screws. It is self-tapping with no collar.
3. Lift the logic board off the optical assembly. Before returning the board to Apple, 
remove the following items:
•  I/O panel
• RJ-11 connector (if present)
• Modem board
• SDRAM
• 
Warning: 
  The microprocessor uses a heatsink/thermal pipe to transfer heat away. 
Whenever the heatsink is removed, the bottom side of the heatsink and the top of 
the microprocessor must be cleaned and thermal paste must be applied to the 
microprocessor. If the mating surfaces are not cleaned and thermal paste is not 
applied, the CPU may overheat and become damaged. Refer to “Thermal Paste 
Application” in this chapter. 
						

							 
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67 
 Memory  Memory  Tools  • No tools are required for this procedure  Part Location  Note:
   Memory can be accessed through the user access door   on the back of the 
computer.  
Preliminary Steps 
Before you begin, do the following:
• Place the computer face down on an ESD mat.
• Unplug all cables except the power cord, from the computer.
• Remove the user access door.