Yamaha Rmx 1 Manual

							HAMAMATSU,JAPAN
1.92K-***   I   Printed in Japan’98.12
Ù ÙÙ Ù
Ù CONTENTS
SPECIFICATIONS .................................................................................. 3/5
PANEL  LAYOUT ....................................................................................... 7
CIRCUIT  BOARD  LAYOUT ..................................................................... 9
DISASSEMBLY  PROCEDURE ............................................................... 10
LSI  PIN  DESCRIPTION ......................................................................... 13
IC  BLOCK  DIAGRAM ............................................................................ 18
BLOCK  DIAGRAM .................................................................................. 19
CIRCUIT  BOARDS ................................................................................. 20
TEST  PROGRAM & INITIALIZE ........................................................ 25/33
ERROR MASSAGE ............................................................................ 41/43
CONFIRMATION OF MIDI DATA ....................................................... 42/44
MIDI  IMPLEMENTION CHART .............................................................. 45
MIDI  DATA FORMAT ......................................................................... 47/53
PARTS  LIST
PANEL SWITCH TABLE
OVERALL  CIRCUIT  DIAGRAM
SERVICE MANUAL
SY   011446
19981201-99800 
						

							IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed that
basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and understood by
the users, and have therefore not been restated.
WARNING:Failure to follow appropriate service and safety procedures when servicing this product may result  in
personal injury, destruction of expensive components and failure of the product to per form as specified.
For these reasons, we advise all Yamaha product owners that all service required should be performed by
an authorized Yamaha Retailer or the appointed service representative.
IMPORTANT:This presentation or sale of this manual to any individual or firm does not constitute authorization, certifica-
tion, recognition of any applicable technical capabilities, or establish a principal-agent relationship of any
form.
The data provided is believed to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and
service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefor, inevitable and
changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to exist,
please contact the distributors Service Division.
WARNING:Static discharges can destroy expensive components. Discharge any static electricity you body may have
accumulated by grounding yourself to the ground buss in the unit (heavy gauge black wires connect to this
buss).
IMPORTANT:Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power to
the unit.
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical / electronic and / or plastic (where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly
other entities) to cause cancer and / or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL / ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON
WHAT SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose eyes to
solder / flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling
food.
LUTHIUM BATTERY HANDLING
This product uses a lithium battery for memory back-up.
WARNING:Lithium batteries are dangerous because they can be exploded by improper handling. Observe the follow-
ing precautions when handling or replacing lithium batteries.
ÔLeave lithium battery replacement to qualified service personnel.Ô Always replace with batteries of the same type.ÔWhen installing on the PC board by soldering, solder using the connection terminals provided on the battery cells.
Never solder directly to the cells. perform the soldering as quickly as possible.
ÔNever reverse the battery polarities when installing.ÔDo not short the batteries.ÔDo not attempt to recharge these batteries.ÔDo not disassemble the batteries.ÔNever heat batteries or throw them into fire.
ADVARSEL!Lithiumbatteri—Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type.  Levér
det brugte batteri tilbage til leverandoren.
VARNINGExplosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en ekvivalent typ som rekommenderas av
apparattillverkaren. Kassera använt batteri enlight fabrikantens instruktion.
VAROITUSParisto voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä
käytetty paristo valmistajan ohjeiden mukaisesti.
The following information complies with Dutch Official Gazette 1995. 45; ESSENTIALS OF ORDER ON THE COLLECTION OF
BATTERIES.
~Please refer to the diassembly procedure for the removal of Back-up Battery.
~Leest u voor het verwijderen van de backup batterij deze beschrijving.
RM1x
WARNINGComponents having special characteristics are marked     and must be replaced with parts having specification equal  to those  originally
installed. 
						

							RM1x
3 Sequencer block
Data capacity
approximately 110,000 notes
Note resolution480 clocks per quarter note
Polyphony64 notes
BPM (Tempo)25.0 - 300.0
Recording methodRealtime Recording (Replace)
Realtime Recording(Overdub)
Realtime Recording (Punch In) - only the Song mode
Step Recording
Grid Step Recording
TracksPattern : 16 tracks
Song : 16 tracks, BPM track
Patterns960 preset patterns (60 styles x 16 sections)
800 user patterns (50 styles x 16 sections)
Measures : Up to  256
PhrasesOver 7,000 preset phrases
256 user phrases/1 user style
Pattern Chain20 chains
Songs20 user songs
EditPhrase edit
Song edit
JobsPattern jobs : 36
Pattern chain jobs : 8
Song jobs : 28
SplitSplit song, Split pattern
GrooveGrid Groove (Note offset, Clock shift, Gate time offset, Velocity offset)
Play FxHarmonize (Unison, Octaver, Harmonize1, 2)
Play Fx (Beat stretch, Clock shift, Gate time, Velocity offset)
MIDI delayMIDI delay edit, Feedback edit
ArpeggioType  (Up, Down, Alternate1, 2, Random) , Sort, Hold, Octave range
Sequence file formatsRM1x native sequence format, SMF format 0
Demo song4  (Included disk)
Tone generator block
Type
AWM2 tone generator
Maximum polyphony32 notes
Multi-timbral capability16 timbres (with DVA)
Preset voicesNormal voices 654 (except GM voices)
Drum voices 46 kits (except GM kits)
Effects3 systems (Reverb effect, Chorus effect, Variation effect)
Reverb 11 types
Chorus 11 types
Variation 43 types
Digital low boostFrequency (50Hz - 2.0kHz), Gain (+/-24dB)
Controls
Standby / On switch (STANDBY / ON)
Volume control (VOLUME)
Assignable knobs (x 8)
Display knobs (x 4)
CONTRAST control
Mode buttons [PATTERN], [PATT CHAIN], [SONG], [UTILITY]
Submode buttons [GROOVE], [PLAY FX], [MIDI DELAY], [ARPEGGIO],[VOICE], [VOICE EDIT],
[EFFECT], [SETUP], [DISK], [JOB], [EDIT], [SPLIT]
Function buttons[F1] - [F4]
Knob A/B button[KNOB] 
						

							RM1x
4
Eject button[EXIT]
Display button[DISPLAYá], [DISPLAYà]
Sequencer  buttons       ,       ,      ,      ,      ,
Data entry buttons [NO -1], [YES+1]
Cursor buttons[CURSORâ], [CURSORã], [CURSORá], [CURSORà]
Shift button[SHIFT]
Keyboard mode buttons[TRACK], [TRANSPOSE], [NUM], [MUTE], [SECTION]
Arpeggio on button[ARPEGGIO ON]
Octave button [OCT DOWN] , [OCT UP]
Keyboard pad E2 - F4, Tap tempo button [TAP]
Display (LCD)64 x 240 dot graphic LCD
 (with CFL backlight, adjustable contrast)
LED indicatorsMODE ( x 4)  (green)
REC (red)
PLAY (green)
TRACK (x 16) (red)
KEYBOARD MODE - MUTE (red),  SECTION (red),
ARPEGGIO ON (red)
FUNCTION BUTTON (red x 4)
KNOB A/B (red)
MIDI IN (red), MIDI OUT (green)
7 segments LED (x 4)
ConnectorsPHONES (stereo phone jack)
OUTPUT (phone jack x 2) (L/MONO, R)
FOOT SW
DC IN
MIDI IN, MIDI OUT
Floppy disk drive3.5 inch 2HD (MF2HD) and 2DD (MF2DD) types
Power supplyAC adaptor (PA-5C)
Dimensions420 mm (W) x 282 mm (D) x 98 mm (H)
Weight4.4kg
Included itemsPower adaptor (PA-5C)
Floppy disk (Demo song)
Owner’s manual
* Specifications and appearance are subject to change without notice for
improvement of the product. 
						

							RM1x
5
23
1
13
16
17
4
16
5
6
15
19 14
9
818
9
11
7
1012
1. BPM Display
2. MIDI Data Monitors
3. LCD Display
4. Display Knobs
5. Function Buttons and Indicators
6. VOLUME Control
7. Real Time Controller Knobs & [KNOB] Button
8. Cursor Buttons
9. [NO -1] and [YES +1] Buttons
10. DISPLAY [] Buttons
11. MODE and SUBMODE Buttons
12. [EXIT] Button
13. Sequencer Buttons and Indicators
14. Keyboard
15. Keyboard Mode Buttons
16. [OCT DOWN] and [OCT UP] Buttons
17. [SHIFT] Button
18. [ARPEGGIO ON] Button
19. [TAP/ENTER] Button
PANEL LAYOUT
ÔçFront Panel 
						

							RM1x
61. STANDBY/ON Switch
2. DC IN Jack
3. CONTRAST Control
4. MIDI IN & OUT Connectors
5. L/MONO & R OUTPUT Jacks
6. PHONES Jack
7. FOOT SW Jack
Ô ÔÔ Ô
ÔRear Panel
4375621 
						

							RM1x
7
Ù CIRCUIT BOARD LAYOUT 
						

							RM1x
8
[230]:Bind Head Tapping Screw-B 3.0X6  MFZN2BL (EP600230)
[231]:Bind Head Tapping Screw-B 3.0X8  MFZN2BL (EP600190)
[250]:Bind Head Tapping Screw-B 3.0X6  MFZN2BL (EP600230)
[251]: Bonding Head Screw-B 3.0X10 MFZN2BL (VQ498000)
[310]:Bind Head Tapping Screw-B 3.0X8  MFZN2BL (EP600190)
2. DM Circuit Board
2-1 Remove the bottom case assembly. (See Proce-
dure 1.)
2-2 Remove the two (2) screws marked [310] and the
screw marked [251] on the back of the upper case.
(Fig. 2)
2-3 Remove the six (6) screws marked [250]. The DM
circuit board can then be removed. (Fig. 2)
3. FDD Assembly
3-1 Remove the bottom case assembly. (See Proce-
dure 1.)
3-2 Remove the three (3) screws marked  [230] and
the screw marked [231]. The FDD assembly can
then be removed. (Fig. 2)
[280]:Bind Head Tapping Screw-B 3.0X6  MFZN2BL (EP600230)
[281]: Bonding Head Screw-B 3.0X10 MFZN2BL (VQ498000)
(Fig.1) (Fig.2)
1. Bottom Case Assembly
1-1 Remove the eight (8) screws marked [280] and the
four (4) screws marked [281]. The bottom case
assembly can then be removed. (Fig. 1)
Rear View
Bottom view
Ù DISASSEMBLY PROCEDURE 
						

							RM1x
9
[210]:Bind Head Tapping Screw-B 3.0X6   MFZN2BL (EP600230)
[211]: Bind Head Tapping Screw-B 3.0X8   MFZN2BL (EP600190)
[212]: Bonding Head Screw-B 3.0X10 MFZN2BL (VQ498000)
4. PN Circuit Board
4-1 Remove the bottom case assembly. (See Proce-
dure 1.)
4-2 Remove the DM circuit board. (See Procedure 2.)
4-3 Remove the FDD assembly. (See Procedure 3.)
4-4 Remove the four (4) screws marked [210],  the two
(2) screws marked [212] and the four (4) screws
marked [211]. The shield cover can then be re-
moved. (Fig. 3)
4-5 Remove the four (4) knobs marked [320]. (Fig. 4)
4-6 Remove the twelve (12) screws marked [60]. The
PN circuit board can then be removed. (Fig. 5)
[60]:Bind Head Tapping Screw-B 3.0X6   MFZN2BL (EP600230)
(Fig.5) (Fig. 4)(Fig.3)
[330]: Knob  (V2887900)
[320]: Knob  (V2647700)Rear View
Bottom view 
						

							RM1x
10
[40]: Bind Head Tapping Screw-B 3.0X8   MFZN2BL (EP600190)
[80]: Bind Head Tapping Screw-B 3.0X6   MFZN2BL (EP600230)
[100]:Bind Head Tapping Screw-B 3.0X6   MFZN2BL (EP600230)
5. Knob Circuit board
5-1 Remove the bottom case assembly. (See Proce-
dure 1.)
5-2 Remove the DM circuit board. (See Procedure 2.)
5-3 Remove the FDD assembly. (See Procedure 3.)
5-4 Remove the shield cover.  (See Procedure 4.)
5-5 Remove the nine (9) knobs marked [330]. (Fig. 4)
5-6 Remove the four (4) screws marked [100]. The
KNOB circuit board can then be removed. (Fig. 6)
6. MVR Circuit Board
6-1 Remove the bottom case assembly. (See Proce-
dure 1.)
6-2 Remove the DM circuit board. (See Procedure 2.)
6-3 Remove the FDD assembly. (See Procedure 3.)
6-4 Remove the shield cover. (See Procedure 4.)
6-5 Remove the PN circuit board. (See Procedure 4.)
6-6 Remove the volume knob marked [330]. (Fig.4)
6-7 Remove the two (2) screws marked [80]. The MVR
circuit board can then be removed. (Fig.6)
7. LCD
7-1 Remove the bottom case assembly. (See Proce-
dure 1.)
7-2 Remove the DM circuit board. (See Procedure 2.)
7-3 Remove the FDD assembly. (See Procedure 3.)
7-4 Remove the shield cover. (See Procedure 4.)
7-5 Remove the four (4) screws marked [40]. The LCD
can then be removed. (Fig. 6)
Bottom View
(Fig.6)