Yamaha Motif 8 Service Manual

							31 MOTIF8
23.
Front Rail Assembly (Time required: about 7 minutes)
23-1. Turn the unit upside down. Then remove the five
(5) screws marked [330] and the two screws
marked [340a]. (Fig. 2)
23-2. Open the control panel. (See procedure 1)
23-3. Remove the two (2) screws marked [340b]. The
front rail assembly can then be removed. (Fig. 9)
24.
Keyboard Assembly (Time required: about 9 minutes)
24-1. Open the control panel. (See procedure 1)
24-2. Remove the two (2) screws marked [340b]. (Fig. 9)
24-3. Remove the nine (9) screws marked [370] and the
two (2) screws marked [380]. Then slide the
keyboard assembly backward to remove. (Fig. 9)
When moving the keyboard assembly, make sure
to hold its both side ends. Holding back side of
keyboard may damage the strings for the PC
sensor. (Fig. 16)
Not to damage the GHD PC circuit board, it is
recommended to apply a masking shield tape over
the holder on the right side end of the keyboard.
(Fig. 16)
Note: The keyboard assembly can be removed without
the procedure 24-2. However, it is recommended to
follow the procedure to make reassembling easier.
When reinstalling the keyboard assembly, follow
the procedure below.
(1) After tightening nine (9) screws marked [370],
tighten the two (2) screws marked [380]. (Fig. 9)
(2) Tighten the two (2) screws marked [340b]. (Fig. 9)
25. GHDPC Circuit Board
(Time required: about 6 minutes)
25-1. Open the control panel. (See procedure 1)
25-2. Remove the three (3) screws marked [P60]. The
GHDPC circuit board can then be removed. (Fig. 17)
PC Censor Masking Tape String
GHDPC
[P60]
(Fig.16)(Fig.17)
[P60] Bind Head Tapping Screw-P 3.0X8 MFZN2BL (EP630220) 
						

							32MOTIF8
26.
Exchanging the PC Sensor (Time required: about 12 minutes)
26a. Preparing a replacement PC sensor
The sensor sheet holder of PC sensor assy is
bonded to keyboard assy and it can not be re-
moved.
So in the event of a replacemet, send for a new PC
sensor assembly (V6782900), disengage the PC
sensor (with spring) from it, and use the PC sensor
as the replacement parts.
26a-1. Remove the three (3) screws marked [P60] on the
new PC sensor assembly. (Fig.23-1)
26a-2. Disengage the GHDPC circuit board and the PC
sensor spring from the sensor sheet holder.
26b. Removing the PC Sensor
26b-1. Remove the keyboard assembly. (See procedure
24)
26b-2. Holding the V-spring assembly slightly, insert the
tool (VB299400) as shown in Fig.18 until it is
fixed.
(Fig.18)
Cross CoverCross CoverCross CoverKeyboard 
Keyboard AssemblyAssemblyKeyboard Assembly
Master stringsMaster stringsMaster strings
Slave strings
Slave stringsSlave strings
V spring 
V spring AssemblyAssemblyV spring Assembly
(Fig.19)
(Fig.20)
Master stringsMaster stringsMaster strings
Slave strings
Slave stringsSlave strings
V spring 
V spring AssemblyAssemblyV spring Assembly
Keyboard Keyboard AssemblyAssemblyKeyboard Assembly
Master stringsMaster stringsMaster strings
Slave strings
Slave stringsSlave strings
HolderHolderHolder
(Fig.21)
Slave strings Slave strings
Censor SpringCensor SpringCensor Spring
(Fig.22)
(Fig.23)
Master
Push Slave
V-spring AssemblyKeyboard Assembly
Tool
Slave Master
GHDPCSensor sheet holder
PC Sensor spring Keyboard AssemblyConnector Assembly[P60]
GHDPC[P60]Slave Master
Sensor sheet holder PC Sensor spring
(Fig.23-1) 
						

							33 MOTIF8
26b-3. Remove the slave string from the V-spring assem-
bly. (Fig.19, Fig20)
26b-4. Remove the slave string from the PC sensor
spring. (Fig.21, Fig.22)
26b-5. Disconnect the connector assembly from the
GHDPC circuit board. (Fig.23)
26b-6. Remove the three (3) screws marked [P60] to
remove the GHDPC circuit board. (Fig.23)
26b-7. Remove the PC sensor spring from the sensor
sheet holder. (Fig.23)
Note: When removing the PC sensor spring or the
GHDPC circuit board, hold the slit of the sensor
sheet holder. (Fig.23-1)
26c. Installing the PC Sensor
26c-1. Fit the GHDPC circuit board to the boss of sensor
sheet holder. (Fig.24)
26c-2. Tighten the three (3) screws marked [P60] in the
order shown in Fig.24.
26c-3. Connect the connector assembly to the GHDPC
circuit board. (Fig.23)
GHDPC[P60]1
23Slave Master
Sensor sheet holder PC Sensor spring
(Fig.28)
Master strings Master strings
Sensor Sheet Holder
PC Censor SpringV Spring
V Spring Master String
Slave String
(Fig.24)
(Fig.26)
(Fig.27)
Master strings Master strings
V spring Assembly V spring Assembly
Master strings
Master strings
Cloth Cover
Cloth CoverSlave strings Slave strings
V spring Assembly V spring Assembly
(Fig.25)
Insert the strings into the
slit, and slide them until
they reaches a hole (an
oval hole as for the
master string) at the end
of the slit. 
						

							34MOTIF8
26c-4. Insert the slave string into the slit of the PC sensor
spring. (Fig.21, Fig.22)
Move the PC sensor spring slightly to make sure
that the slave string can move smoothly.
26c-5. Insert the slave string into the slit of the V-spring
assembly. (Fig.19, Fig.20)
Make sure that the V-spring assembly can move
smoothly in the direction along the string.
26c-6. Remove the tool (VB299400).
27.
Exchanging the strings set (Time required: about 12 minutes)
Note: This procedure is only for the case that the strings
have damaged.
If even the only one string has damaged, make
sure to exchange the whole strings set.
Insert the rod (TX000670) into the frame to avoid
to let the key hammers hit the strings. (Fig.33)
The string set (V784300) consists of following parts.
• Master string x 1
• Slave string x 1
• Adhesive tape x1
27a. Removing the strings set
27a-1. Remove the keyboard assembly. (See procedure 24)
27a-2. Remove the cloth cover carefully from both sides
of the keyboard frame. (Fig.25)
27a-3. Remove the master string and the slave string from
the V-spring assembly. (Fig.19, Fig20)
27a-4. Remove the master string from the sensor sheet
holder. (Fig.21)
27a-5. Remove the slave string from the PC sensor spring.
(Fig.21, Fig.22)
27b. Installing the strings set
27b-1. Insert the master string one by one into the slit of
the sensor sheet holder. (Fig.26)
27b-2. After untwisting the master string, insert it into the
slit of V-spring assembly. (Fig.27)
Make sure that V-spring assembly can move
smoothly in the direction along the string.
Make sure that you can see the master string
through between the frame and the stopper.
(Fig.28)
27b-3. Insert the slave string into the slit of the V-spring
assembly. (Fig.19, Fig.20)
27b-4. After untwisting the slave string, insert it into the
slit of the PC sensor spring. (Fig.29)
Slave strings Slave strings
Sensor Spring
Sensor Spring
MoveMoveMove
(Fig.29)
(Fig.30)
Sensor Spring Sensor Spring
Holder Holder
Slave String
Slave String
SLITSLITSLIT 
						

							35 MOTIF8
Make sure that PC sensor spring can move
smoothly in the direction along the string.
Make sure that the slave string is kept in the center
of the stopper without removing from it.
27b-5. Apply the accessorius adhesive tape on the frame
and install the cloth cover. (Fig.30-1)
27b-6. Make sure that the position of the PC sensor spring
accords with the mark on the sensor sheet holder.
(Fig.30)
Note: The position of the sensor is automatically detected
and acceptable margine of error is within 0.5mm.
After installing the strings set, press the keyboards to
make sure that the PC sensor spring moves normally.
HEDaf-EBUS Keyboard Assembly
GHD-EBUS L Circuit board
GHD-EBUS H Circuit Board
[260a] x 7
[260b] x 10Thin Metal Plate etc.
Triangle Mark
(Fig.31)(Fig.32) 28. Disassembling the HEDaf-EBUS Keyboard
* After inserting a round stick (Rod: TX000670)
between the frame and keys, remove the circuit
boards.
28-1. GHD-EBUS L circuit board
Remove the seven (7) screws marked [260a]. The
GHD-EBUS L circuit board can then be removed.
(Fig.31)
28-2. GHD-EBUS H circuit board
Remove the ten (10) screws marked [260b]. The
GHD-EBUS H circuit board can then be removed.
(Fig.31)
* 
Key can be removed without removing the circuit boards.
(Fig.30-1)
Flame Flame Adhesive Tape Adhesive Tape
Rib Edge
Rib Edge
String Set (V784300)
  Master String
  X1
  Slave String
  X1
  Adhesive Tape
  X1
28-3. White Key
Insert a thin plate between the white keys, near the
triangle mark around the fulcrum of the key, and
press down the stopper marked [A] to remove the
key. (Fig. 32, Fig. 33)
* Take care not to damage the key spring when
removing a key.
* A black key can be removed after both adjacent
white keys have been removed. 
						

							36MOTIF8
Stopper L88Hammer, White Key
Slit
Frame
Spring
HookStopper L88
Hammer, White Key
(Fig.33) (Fig.34) (Fig.35)
Upside
Spring
Frame
Hook
(Fig.36)
(Fig.37)
(Fig.38)
[E]
[F]White Key
Key GuideKey Spring
[B][C]
[D]
White Key
Spring
(Rod : TX000670)
28-4. Hammer, White Key
After a key has been removed, push the key spirng down
once to take it out of the hook. (Fig. 34)
Place the HEDaf-EBUS keyboard assembly upside
down and peel away the stopper L88. The hammer of
the white key can then be removed. (Fig. 35)
* The hammer of a black key can be removed in the
same manner.
29. Assembling the HEDaf-EBUS keyboard
29-1. Hammer of White (Black) Key
Place the HEDaf-EBUS keyboard assembly upside
down, insert a hammer assembly into the frame,
and put the stopper L88 on. (Fig. 36)
* There are four kinds of hammers that differ in
weight.
29-2. Key Spring
Place the HEDaf-EBUS keyboard assembly
rightside up, and fix a key spring to the frame by
setting it at the slit and pushing it down once. (Fig.
37)
* Be careful of the direction of the spring.
29-3. White (Black) Key
After a key has been fit to part [F] and the key
guide, make sure that the spring is fixed to the key.
Then press part [E] of the key down. (fig. 38)
29-4. GHD-EBUS L circuit board
Tighten the seven (7) screws marked [260a] to fix
the GHD-EBUS L circuit board. (Fig. 31)
29-5. GHD-EBUS H circuit board
Tighten the ten (10) screws marked [260b] to fix
the GHD-EBUS H circuit board. (Fig. 31)
* Set the slits of the rubber contact at the marks on
the frame. 
						

							37 MOTIF6 / MOTIF7 / MOTIF8
 LSI PIN DESCRIPTION

 MBCG46183-129 (XV833A00) GATE ARRAYDM: IC37PIN
NO.NAME I/O FUNCTIONPIN
NO.NAME I/O FUNCTION
1D5 I/ O
25TX 31 O2D6 I/ O Data bus
26RX32 I3D7 I/ O
27TX 32 OSeri al  data4/I RQ0 I /O Inte r r up t re quest
28RX33 I5/I RQ1 I /O Inte r r up t re quest
29TX 33 I /O6VSS6 Gr ound
30/I C I Initial Cle ar7/I RQ2 I /O Inte r r up t re quest
31VSS31 Gr oun d8/I RQ3 I /O Inte r r up t re quest
32XI I Cr ystal qua r ts i n put9/RD I Read
33VSS33 Gr oun d10/WR I Wr i t e
34XO O Cr ystal qua r ts  ou tput11/CE I Ch i p enabl e
35A0 I12/AST B I
36A1 I13TE ST I 0 I Test  mode
37A2 I14RX0 I
38A3 I
Address bus15TX 0 O
39A4 I16RX1 ISeri al  data
40A5 I17TX 1 O
41CPU CLK I Clo ck18VSS18 Gr oun d
42VSS42 Gr oun d19VDD19 Power suppl y
43VDD43 Power supply20RX2 I
44D0 I/ O21TX 2 O
45D1 I/ O22RX30 ISeri al  data
46D2 I/ O
Data bus23TX 30 O
47D3 I/ O24RX31 I
48D4 I/ O

 SED1335F0B (XQ595A00) LCDC (LCD Controller)DM: IC47
1 VA5 O 31 XD2 O
2 VA4 O 32 XD1 O Data bus output for 4 bit dot
3 VA3 O
VRAM address bus33 XD0 O
4 VA2 O 34 XECL O S driver enable, chain clock
5 VA1 O 35 XSCL O Data bus shift clock
6 VA0 O 36 Vss - Ground
7 /VWR O VRAM read/write 37 LP O X driver latch pulse
8 /VCE O Memory control 38 WF O Frame signal for X/Y driver
9 /VRD - Not used 39 YDIS O
Power down signal for displaying off mode10 /RES I Initial clear 40 YD O Scan start signal
11 NC - Not used 41 YSCL O Scan shift clock
12 NC - Not used 42 VD7 I/O
13 /RD I Read strobe 43 VD6 I/O
14 /WR I Write strobe 44 VD5 I/O
15 SEL2 I Bus select 45 VD4 I/O
VRAM data bus
16 SEL1 I Bus select 46 VD3 I/O
17 OSC1 I Clock 47 VD2 I/O
18 OSC2 O Clock 48 VD1 I/O
19 /CS I Chip select 49 VD0 I/O
20 A0 I Data mode select 50 VA15 O
21 Vdd - Power supply 51 VA14 O
22 D0 I/O 52 VA13 O
23 D1 I/O 53 VA12 O
24 D2 I/O 54 VA11 O
VRAM address bus
25 D3 I/O
Data bus55 VA10 O
26 D4 I/O 56 VA9 O
27 D5 I/O 57 VA8 O
28 D6 I/O 58 VA7 O
29 D7 I/O 59 VA6 O
30 XD3 O Data bus output for 4 bit dot 60 NC - Not used PIN
NO.NAME I/O FUNCTION
PIN
NO.NAME I/O FUNCTION 
						

							38MOTIF6 / MOTIF7 / MOTIF8

 SPC7214F0B (XY625A00) SCSI ControlDM: IC52
Power supply +3.3V
Port DMA data bus
Ground
SCSI I/O signal (Low active)
Power supply +5V
SCSI REQ signal (Low active)
Ground
SCSI C/D signal (Low active)
SCSI SEL signal (Low active)
Ground
SCSI MSG signal (Low active)
SCSI RST signal (Low active)
Ground
SCSI ACK signal (Low active)
Power supply +5V
SCSI BSY signal (Low active)
Not used
Ground
Power supply +5V
SCSI ATN signal (Low active)
Ground
SCSI data parity (Low active)
Power supply +5V
SCSI data bus (Low active)
Ground
Not used
SCSI data bus (Low active)
Power supply +5V
SCSI data bus (Low active)
Ground
SCSI data bus (Low active)
Power supply +5V
SCSI data bus (Low active)
Ground
SCSI data bus (Low active)
Not used
Power supply +5V
SCSI data bus (Low active)
Ground
SCSI data bus (Low active)
Power supply +5V
Not used
Ground Power supply +3.3V
External clock input
Ground
Oscillator input
Oscillator output
Power supply +3.3V
Input clock select
System clock select
Internal VCO control
PLL power down input
PLL control
Test monitor output
Test input
Data bus
Power supply +5V
Data bus
Address bus
Ground
Power supply +3.3V
Address bus
Data write (Low active)
Data read (Low active)
System reset (Low active)
Interrupt request (Low active)
Chip select (Low active)
Ground
Port DMA acknowledge
Port read (Low active)
Port wright (Low active)
Port DMA request (Low active)
Port DMA data bus
Power supply +5v
Port DMA data bus
Ground
PIN
NAME I/O FUNCTION
NO.PIN
NAME I/O FUNCTION
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50LVDDEXCLK
Vss
OSCIN
OSCOUT
LV
DDCLKSEL0
CLKSEL1
VC
XPLLPD
PLLCT0
PLLCT1
TESTMON
TESTEN
DB0
DB1
DB2
DB3
HV
DDDB4
DB5
DB6
DB7
AD0
Vss
LV
DDAD1
AD2
AD3
AD4
XWR
XRD
XRESET
XINT
XCS
Vss
XPDACK
XPRD
XPWR
PDREQ
PD15
PD0
PD14
PD1
HV
DDPD13
PD2
PD12
PD3
Vss51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100LV
DDPD11
PD4
PD10
PD5
PD9
PD6
PD8
PD7
Vss
XSIO
HV
DDXSREQ
Vss
XSCD
XSSEL
Vss
XSMSG
XSRST
Vss
XSACK
HV
DDXSBSY
NC
Vss
HVDD
XSATN
Vss
XSDBP
HV
DDXSDB7
Vss
NC
XSDB6
HV
DDXSDB5
Vss
XSDB4
HV
DDXSDB3
Vss
XSDB2
NC
HV
DDXSDB1
Vss
XSDB0
HV
DDNC
Vss I
I
O
I
I
O
I
I
I
O
I
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
O
I
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/OI/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O 
						

							39 MOTIF6 / MOTIF7 / MOTIF8

 TC203C760HF-002 (XS725A00) SWP30B (AWM Tone Generator coped with MEG) Standard Wave Processor)DM: IC54
PIN
NO .NAME I/O FUNCTIONPIN
NO .NAME I/O FUNCTION1 Vss (Ground) 121 VSS (Ground)2 CA 0 I 12 2 HM D0 I/O3 CA 1 I 12 3 HM D1 I/O4 CA 2 I 12 4 HM D2 I/O5 CA 3 I 12 5 HM D3 I/O6 CA 4 I 12 6 HM D4 I/O7 CA 5 I A dd res s  bu s  of  i nte rna l  reg i st er 12 7 HM D5 I/O8 CA6 I 128 HMD6 I/O W ave  memory data bus (Upper 16 bits)9 CA 7 I 12 9 HM D7 I/O10 CA 8 I 13 0 HM D8 I/O11 CA 9 I 13 1 HM D9 I/O12 CA 1 0 I 13 2 HM D1 0 I/O13 CA 1 1 I 13 3 HM D1 1 I/O14 V SS (Grou nd ) 13 4 HM D1 2 I/O15 CD 0 I/O 13 5 HM D1 3 I/O16 CD 1 I/O 13 6 HM D1 4 I/O17 CD 2 I/O 13 7 HM D1 5 I/O18 CD 3 I/O 13 8 V SS (Grou nd )19 CD 4 I/O 13 9 HM A 0 O20 CD 5 I/O 14 0 HM A 1 O21 CD 6 I/O 14 1 HM A 2 O22 CD 7 I/O 14 2 HM A 3 O23 CD 8 I/O Da ta  bu s  of  i nte rna l  reg i st er 14 3 HM A 4 O24 CD 9 I/O 14 4 HM A 5 O25 CD 10 I/O 14 5 HM A 6 O26 CD 11 I/O 14 6 HM A 7 O27 CD 12 I/O 14 7 HM A 8 O28 CD 13 I/O 14 8 HM A 9 O29 CD 14 I/O 14 9 HM A 10 O30 VDD (Power supply) 150 VDD (Power supply)31 V SS (Grou nd ) 15 1 V SS (Grou nd )32 CD 15 I/O 15 2 HM A 11 O33 CS N I Ch i p s e le c t 15 3 HM A 12 O W av e  mem ory  a dd res s  bu s34 W RN I W rit e s tro be 15 4 HM A 13 O35 RD N I Re ad  s tro be 15 5 HM A 14 O36 VDD (Power supply) 156 HMA15 O37 SYSH0 O 157 HMA16 O38 S YS H1 O 15 8 HM A 17 O39 S YS H2 O 15 9 HM A 18 O40 S YS H3 O NS Y S/ LNS Y S up pe r 16  b it s ou tpu t 16 0 HM A 19 O41 SYSH4 O 161 HMA20 O42 SYSH5 O 162 HMA21 O43 S YS H6 O 16 3 HM A 22 O44 S YS H7 O 16 4 HM A 23 O45 K ONO0 O 16 5 HM A 24 O46 KONO1 O Key on data 166 VSS (Ground)47 K ONO2 O 16 7 M RA SN ORAS when DRAM(s ) is connec ted to wa ve memory48 K ONO3 O 16 8 M CA SN OCAS when DRAM(s ) is connec ted to wa ve memory49 V SS (Grou nd ) 16 9 M OEN O W av e  mem ory  o utp ut  en ab l e50 S YS L0 I/O 17 0 M W E N O W av e  mem ory  wri te  e nab l e51 SYSL1 I/O 171 VSS (Ground)52 S YS L2 I/O 17 2 LM D0 I/O53 S YS L3 I/O NS Y S  in pu t/L NS YS  o ut pu t l ow er 8  bi ts 17 3 LM D1 I/O54 S YS L4 I/O 17 4 LM D2 I/O55 S YS L5 I/O 17 5 LM D3 I/O56 S YS L6 I/O 17 6 LM D4 I/O57 S YS L7 I/O 17 7 LM D5 I/O58 K ONI0 I 17 8 LM D6 I/O59 KONI1 I Key on data input 179 LMD7 I/O W ave  memory data bus (Lower 16 bits)60 VDD I (Power supply) 180 VDD (Power supply)61 V SS (Grou nd ) 18 1 V SS (Grou nd )62 K ONI2 I 18 2 LM D8 I/O63 K ONI3 I 18 3 LM D9 I/O64 DA C0 O DA C ou tpu t 18 4 LM D1 0 I/O65 DA C1 O 18 5 LM D1 1 I/O66 W CLK O DA C0 /DA C1  wo rd  clo ck 18 6 LM D1 2 I/O67 M EL O0 O 18 7 LM D1 3 I/O68 M EL O1 O 18 8 LM D1 4 I/O69 M EL O2 O 18 9 LM D1 5 I/O70 MELO3 O MEL wave data output 190 VSS (Ground)71 MELO4 O 191 LMA0 O72 M EL O5 O 19 2 LM A 1 O73 M EL O6 O 19 3 LM A 2 O74 M EL O7 O 19 4 LM A 3 O75 VDD (Power supply) 195 LMA4 O76 ADLR O ADC word clock 196 LMA5 O77 M EL I0 I 19 7 LM A 6 O78 M EL I1 I 19 8 LM A 7 O79 M EL I2 I 19 9 LM A 8 O80 MELI3 I MEL wave data input 200 LMA9 O81 M EL I4 I 20 1 LM A 10 O82 M EL I5 I 20 2 LM A 11 O83 MELI6 I 203 VSS (Ground)84 M EL I7 I 20 4 LM A 12 O85 V SS (Grou nd ) 20 5 LM A 13 OWav e mem ory  address bus (Lower data mem ory)86 RC AS N O DR AM  c ol u mn  ad dre ss  s t ro be  (R AS  s i gn al ) 20 6 LM A 14 O87 RA 8 O 20 7 LM A 15 O88 RA 7 O 20 8 LM A 16 O89 RA 6 O 20 9 LM A 17 O90 VDD (Power supply) 210 VDD (Power supply)91 V SS (Grou nd ) 21 1 V SS (Grou nd )92 RA5 O DRAM address bus 212 LMA18 O93 RA 4 O 21 3 LM A 19 O94 RA 3 O 21 4 LM A 20 O95 RA 2 O 21 5 LM A 21 O96 RA 1 O 21 6 LM A 22 O97 RA 0 O 21 7 LM A 23 O98 RR AS N O DR AM  ro w ad dre s s  st rob e (R AS  s i gn al ) 21 8 LM A 24 O99 RW E N O DA RM  wri te  en ab l e 21 9 V SS (Grou nd )100 VSS (Ground) 220 SYO O Sync. signal for master clock10 1 RD 7 I/O 22 1 S YOD O S yn c . s i gn al  f or H CLK /QC LK10 2 RD 6 I/O 22 2 QCL K O 1/ 12  ma s ter c l o ck  (6 4F s)10 3 RD 5 I/O 22 3 HC LK O 1/ 6 m as te r c l oc k  (12 8F s)104 RD4 I/O 224 CK256 O 1/3 master clock (256F s)10 5 RD 3 I/O 22 5 S YS CL K O 1/ 2 m as te r c l oc k  (38 4F s)10 6 RD 2 I/O 22 6 V DD (P owe r s up pl y )10 7 RD 1 I/O 22 7 S YI I S yn c . c l oc k10 8 RD 0 I/O 22 8 M CLK I I M as te r c lo c k in pu t109 VSS (Ground) 229 MCLKO O Master clock output11 0 RD 17 I/O 23 0 V DD (P owe r s up pl y )111 RD16 I/O DRAM data bus 231 XIN I Crystal  osc.  input112 RD15 I/O 232 XOUT O Crystal osc. output11 3 RD 14 I/O 23 3 V SS (Grou nd )11 4 RD 13 I/O 23 4 IC N I In i ti al  c l ea r115 RD12 I/O 235 CHIP2 I 2 chips mode enable11 6 RD 11 I/O 23 6 S LA VE I M as te r/ Sl a ve  s e le c t wh en  2  ch i ps  m od e11 7 RD 10 I/O 23 7 TE S TON I11 8 RD 9 I/O 23 8 A CIN I Te st  pi n11 9 RD 8 I/O 23 9 DC TE ST I120 VDD (Power supply) 240 VDD (Power supply) 
						

							40MOTIF6 / MOTIF7 / MOTIF8

 D65621GF-028-3B9 (XS370A00) SMIDM: IC69
1 LMA24 I 41 VDD -
2 LMA23 I 42 L1RAS2 O RAS2 for LoMem SIMM 1
3 LMA22 I 43 L1RAS3 O RAS3 for LoMem SIMM 1
4 LMA21 I Low Memory Address 44 GND -
5 LMA20 I 45 HDRAS0 O RAS for HiMem DRAM 0
6 LMA19 I 46 HDRAS1 O RAS for HiMem DRAM 1
7 LMA18 I 47 GND -
8 HMA24 I 48 VDD -
9 HMA23 I
High Memory Address49 LDRAS0 O RAS for LoMem DRAM 0
10 HMA22 I 50 LDRAS1 O RAS for LoMem DRAM 1
11 HMA21 I 51 LMA1 I
Low Memory Address
12 GND - No.12 52 LMA0 I
13 HMA20 I 53 GND - No.53
14 HMA19 I High Memory Address 54 LMA1X O
Low Memory Address Exchanged15 HMA18 I 55 LMA0X O
16 RASN I Row Address Strobe 56 GND -
17 H0RAS0 O RAS0 for HiMem SIMM 0 57 VDD -
18 H0RAS1 O RAS1 for HiMem SIMM 0 58 HMA1 I
High Memory Address
19 GND - 59 HMA0 I
20 H0RAS2 O RAS2 for HiMem SIMM 0 60 HMA1X O
High Memory Address Exchanged21 H0RAS3 O RAS3 for HiMem SIMM 0 61 HMA0X O
22 GND - 62 D 0 I
Data Input
23 VDD - 63 D 1 I
24 L0RAS0 O RAS0 for LoMem SIMM 0 64 GND -
25 L0RAS1 O RAS1 for LoMem SIMM 0 65 D 2 I
26 GND - 66 D 3 I
Data Input
27 L0RAS2 O RAS2 for LoMem SIMM 0 67 D 4 I
28 L0RAS3 O RAS3 for LoMem SIMM 0 68 D 5 I
29 GND - 69 A 2 I Address
30 VDD - 70 WRN I Write
31 H1RAS0 O RAS0 for HiMem SIMM 1 71 GND - No.71
32 H1RAS1 O RAS1 for HiMem SIMM 1 72 VDD - No.72
33 GND - 73 CSN I Chip Select
34 VDD - 74 A 0 I
35 H1RAS2 O RAS2 for HiMem SIMM 1 75 A 1 IAddress
36 H1RAS3 O RAS3 for HiMem SIMM 1 76 MCLK I Clock (37MHz)
37 GND - 77 SYI I Sync Clock (48kHz)
38 L1RAS0 O RAS0 for LoMem SIMM 1 78 HBANK O HiMem Bank Select 01/23
39 L1RAS1 O RAS1 for LoMem SIMM 1 79 LBANK O LoMem Bank Select 01/23
40 GND - 80 REFRN O Refresh Timing
PIN
NAME I/O FUNCTION
NO.PIN
NAME I/O FUNCTION
NO.
1 VINL I Analog input (L ch.) 13 LRCK I/O Sampling cloc k input/output
2 VREF1 Reference 1  decoupling cap. 14 BCK I/O Bit  clock  input/output
3 REFCOM Reference decoupling common 15 DOUT O Audio data output
4 VREF2 Reference 2  decoupling cap. 16 SYSCK I System  clock  input
5 VINR I Analog input  (R ch.) 17 DGND Digital ground
6 RSTB I Res et input active  L 18 VDD Power supply +5V
7 BYPAS I LCF  bypas s control 19 CINNR Anti-aliasing  filter  cap. (-) R  ch.
8 FMT0 I Audio data format 0 20 CINPR Anti-aliasing filter cap. (+) R ch.
9 FMT1 I Audio data format 1 21 CINNL Anti-aliasing filter cap. (-) L ch.
10 MODE0 I Master/Slave mode selection 0 22 CINPL Anti-aliasing filter cap. (+) L ch.
11 MODE1 I Master/Slave mode  selection 1 23 VCC Analog power supply
12 FSYNC I/O Frame sync. input/output 24 AGND Analog ground
PIN
NAME I/O FUNCTION
NO.PIN
NAME I/O FUNCTION
NO.

 PCM1800 (XU770A00) A/D ConverterDM: IC88