MSI Hetis 865gv-e Manual

							User’s Guide Hetis 865GV-E
G52-B6279X1 
						

							iiFCC-B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class
B digital device, pursuant to part 15 of the FCC rules. These limits are designed
to provide reasonable protection against harmful interference when the equip-
ment is operated in a commercial environment. This equipment generates, uses
and can radiate radio frequency energy and, if not installed and used in accor-
dance with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to
cause harmful interference, in which case the user will be required to correct
the interference at his own expense.
Notice 1
The changes or modifications not expressly approved by the party responsible
for compliance could void the user’s authority to operate the equipment.
Notice 2
Shielded interface cables and AC. power cord, if any, must be used in order to
comply with the emission limits.
VOIR LA  NOTICE D’INSTALLATION  AVANT  DE RACCORDER AU RESEAU.
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference
that may cause undesired operation.Micro-Star International
Hetis 865GV-E 
						

							iiiMacrovision® 
Statement
This product incorporates copyright protection technology that is protected
by method claims of certain U.S. patents and other intellectual property rights
owned by Macrovision Corporation and other rights owners.  Use of this
copyright protection technology must be authorized by Macrovision
Corporation, and is intended for home and other limited viewing users only
unless otherwise authorized by Macrovision Corporation.  Reverse engineer-
ing or disassembly is prohibited.
Copyright Notice
The material in this document is the intellectual property of MICRO-STAR
INTERNATIONAL. We take every care in the preparation of this document,
but no guarantee is given as to the correctness of its contents.  Our products
are under continual improvement and we reserve the right to make changes
without notice. 
						

							iv Trademarks
All trademarks are the properties of their respective owners.
Intel®
 and Pentium®
 are registered trademarks of Intel Corporation.
PS/2 and OS®
/2 are registered trademarks of  International Business Machines
Corporation.
Windows®
 95/98/2000/NT/XP are registered trademarks of Microsoft
Corporation.
Netware®
 is a registered trademark of Novell, Inc.
Award®
 is a registered trademark of  Phoenix Technologies Ltd.
AMI®
 is a registered trademark of American Megatrends Inc.
Revision History
RevisionRevision  HistoryDate
V1.0First  ReleaseSeptember 2004 
						

							v CONTENTS
Chapter 1.  Getting Started........................................................1-1
1.1 System Specifications.................................................1-2
1.2 System Configuration..................................................1-4
Front Panel...............................................................1-4
Rear Panel...............................................................1-5
Chassis Design..........................................................1-6
1.3 Thermal Solution........................................................1-7
Chapter 2.  Introducing Mainboard.............................................2-1
2.1 Mainboard Layout.......................................................2-2
2.2 CPU...........................................................................2-3
2.3 Memory.....................................................................2-3
Memory Speed /CPU FSB Support Matrix....................2-3
DDR Population Rules...............................................2-4
DDR Module Combination......................................2-4
Installing DDR Modules............................................2-5
2.4 Power Supply.............................................................2-6
2.5 Front Panel.................................................................2-7
SPDIF-Out Jack.........................................................2-7
Audio Ports...............................................................2-7
USB Ports.................................................................2-8
IEEE 1394 Port: J1394-2.............................................2-8
2.6 Rear Panel.................................................................2-9
Mouse/Keyboard Connectors......................................2-9
Audio Ports...............................................................2-10
Composite Connector: TV1........................................2-10
RJ45 LAN Jack..........................................................2-11
USB Ports.................................................................2-11
Parallel Port..............................................................2-12
DVI Connector: DVI1 (optional).................................2-13 
						

							vi IEEE1394 Port: J1394-1..............................................2-14
VGA Port..................................................................2-14
Serial Port.................................................................2-15
2.7 Connectors.................................................................2-16
IDE Connector: IDE1.................................................2-16
Serial ATA Connectors: SATA1/SATA2.......................2-16
Front Panel Connector: JFP1......................................2-17
CD-in Connector: JCD1.............................................2-17
Fan Power Connectors...............................................2-18
On-Board S-Video Out Connector: JTV1.....................2-18
Internal Speaker Connector: CON1............................2-18
Front USB Connector: J3...........................................2-19
2.8 Jumpers......................................................................2-20
Clear CMOS Jumper: JBAT1......................................2-20
2.9 Slots...........................................................................2-21
PCI Interrupt Request Routing....................................2-21
Chapter 3: System Assembly......................................................3-1
3.1 Overview...................................................................3-2
3.2 Installation Procedures................................................3-4
1. Removing Cover,Front Bezel, Drives Cage
    and HDD tray.......................................................3-4
2. Installing Memory Modules....................................3-7
3. Installing CPU......................................................3-8
4. Releasing Coolor Clips..........................................3-9
5. Installing CPU Cooler...........................................3-10
6. Installing HDD.....................................................3-12
7. Installing Optical Drive and Card Reader...............3-14
8. Replacing Chassis Cover.......................................3-20
Chapter 4: BIOS Setup..............................................................4-1
4.1 Entering Setup............................................................4-2
Selecting the First Boot Device..................................4-2 
						

							vii Control Keys.............................................................4-3
Getting Help.............................................................4-3
Main Menu...............................................................4-3
Default Settings........................................................4-3
4.2 The Main Menu..........................................................4-4
4.3 Standard CMOS Features.............................................4-6
4.4 Advanced BIOS Features.............................................4-8
4.5 Advanced Chipset Features.........................................4-12
4.6 Power Management Features.......................................4-14
4.7 PNP/PCI Configurations...............................................4-18
4.8 Integrated Peripherals..................................................4-21
4.9 PC Health Status........................................................4-26
4.10 Frequency/Voltage Control........................................4-27
4.11 Set Supervisor/User Password.....................................4-29
4.12 Load Optimal/Fail Safe Defaults...............................4-30
Chapter 5.  Using 4- or 6-Channel Audio Function........................5-1
5.1 Installing the Audio Drivers..........................................5-2
5.2 Using Audio Function..................................................5-4
5.3 Testing the Connected Speakers...................................5-8
5.4 Playing KaraOK..........................................................5-10 
						

							viii Safety Instructions
1.Always read the safety instructions carefully.
2.Keep this User’s Manual for future reference.
3.Keep this equipment away from humidity.
4.Lay this equipment on a reliable flat surface before setting it up.
5.The openings on the enclosure are for air convection hence pro
tects the equipment from overheating.  DO NOT COVER THE OPENINGS.
6.Make sure the voltage of the power source and adjust properly
115/230V before connecting the equipment to the power inlet.
7.Place the power cord such a way that people can not step on it.
Do not place anything over the power cord.
8.Always Unplug the Power Cord before inserting any add-on card
or module.
9.All cautions and warnings on the equipment should be noted.
10.Never pour any liquid into the opening that could damage or cause
electrical shock.
11.If any of the following situations arises, get the equipment checked
by a service personnel:
- The power cord or plug is damaged.
- Liquid has penetrated into the equipment.
- The equipment has been exposed to moisture.
- The equipment has not work well or you can not get it work according
   to User’s Manual.
- The equipment has dropped and damaged.
- The equipment has obvious sign of breakage.
12.Do not leave this equipment in an unconditioned environment with
storage temperature above 600 
C (1400
F). Extreme heat may damage the
equipment.CAUTION:  Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the
manufacturer. 
						

							Getting Started
1
Congratulations for purchasing Hetis 865GV-E (MS-6279)
barebone. Hetis barebone is your best Slim PC choice.  Based on
the “all-in-one” design idea, Hetis provides USB ports and optional
TV-out jack, DVI jack and 1394 ports.  With the fantastic appear-
ance and small form factor, it can easily be set anywhere. The feature
packed platform also gives you an exciting PC experience. 
						

							Chapter 1
1-2 1.1 System Specifications
Mainboard Model
† MS-7065 v1.0, 320mm (L) x 195mm (W), 6 mounting holes, 4-layer proprietary
form factor
CPU
† Supports Socket 478 for Intel®
 Pentium™ 4/Northwood FSB800 processor
up to 3.0 GHz and Prescott up to 3.4GHz
(For the latest information about CPU, please visit http://www.msi.com.tw/
program/products/mainboard/mbd/pro_mbd_cpu_support.php)
Chipset
† Intel® 
 865GV chipset
- Supports FSB 800/533/400 MHz
- Supports integrated graphics
- Supports DDR 400/333/266 memory interface
† Intel®
 ICH5 chipset
- Hi-Speed USB (USB2.0) controller, 480Mb/sec, 8 ports
- 2 Serial ATA/150 ports
- 2 channel Ultra ATA 100 bus Master IDE controller.
- PCI Master v2.3, I/O APIC
- Supports both ACPI and legacy APM power management
Main Memory
† Two 184-pin DDR DIMM slots
† Supports dual channel DDR 400/333/266 memory up to 2GB
(For the updated supporting memory modules, please visit http://www.msi.
com.tw/program/products/mainboard/mbd/pro_mbd_trp_list.php.)
Slot
† PCI2.2 slots x 2 through riser card bracket
On-Board Peripherals
†  Front I/O
- Audio Ports (Line-Out x 1, Mic-In x 1)
- USB2.0 Ports x 4
- Optical SPDIF-Out x 1
- IEEE1394 (4 pins) x 1 (optional)