Motorola Radio Mcs2000 Vol 1 68p81083c20 A Manual

							Introduction 1-11
GENERALRECEIVERTRANSMITTER
SpeciÞcations subject to change without notice.
FCC Designation: 30-35W: AZ492FT5773
15W: AZ492FT5765
Temperature Range:
Operating:-30 to +60°C
Storage:-40 to +85°C
Power Supply:
Nominal Voltage:13.6 V
Operating Voltage: 10.8-16.3 V
Current Drain, maximum values:
Stand-by:0.45 A
Receive:
1.7 A with 7.5 W speaker
2.5 A with 13 W speaker
1.5 A with 4 W speaker
Transmit (15W):6.5 A
Transmit (35W):13.5 A
Off: 30 mA
Number of Modes:
Model I: Standard 48, optional 150
Model II, III: Standard 160, optional 250
Channel Spacing:
806-821 & 851-866MHz:25 kHz
821-825 & 866-870MHz:20 kHz
Mode of Operation:Semi-Duplex
Modulation: FM
Antenna Impedance:50 W
Frequency Stability:
806-821 MHz & 851-866 MHz:±2.5 ppm
821-825 MHz & 866-870 MHz:±1.5 ppm
Dimensions (H/W/D):
1-25W Transceivers:
44x168x180 mm / 1.73Óx6.61Óx7.09Ó
25-50W Transceivers: 
44x168x230 mm / 1.97Óx6.61Óx7.76Ó
Control Head I, Dash Mt.:
44x168x30 mm / 1.75Óx6.61Óx1.81Ó
Control Head II, III, Dash Mt.:
60x186x30 mm / 2.35Óx7.33Óx1.83Ó
Control Head II, III, Remote Mt.:
60x186x71 mm / 2.35Óx7.33Óx2.78Ó
Weight:
1-25 Watt Transceivers:1.6 kg / 3.53 lbs
25-50 Watt Transceivers:1.8 kg / 4.04 lbs
Control Head I, Dash Mt.:152 g / 0.33 lbs
Control Head II, Dash Mt.:233 g / 0.51 lbs
Control Head III, Dash Mt.:229 g / 0.50 lbsFrequency Range:851-866MHz 
866-870MHz
Maximum Frequency Separation:18 MHz
Sensitivity:
20dB SINAD:0.40 uV
12dB SINAD:0.30 uV
Adjacent Channel Selectivity:
Model I:-75 dB
Models II & III:-80 dB
Spurious & Image Rejection:
Model I:-75 dB
Models II & III:-90 dB
Intermodulation: (uVemf)
Model I:-75 dB
Models II & III:-80 dB
Conducted Spurious Emission:
per FCC part 90
Audio Output:
4 W (internal, 16 W)
7.5 W or 13 W (external, 8 W/3.2 W)
Audio Response:
6 dB/octave +1/-3 dB at 300-3000 Hz
Distortion:4/7.5/13 W  @:
						

							1-12 Introduction
GENERALRECEIVERTRANSMITTER
SpeciÞcations subject to change without notice. All speciÞcations are per Electronic Industries Association (EIA) 603 unless otherwise noted.
FCC Designation: 30W: AZ492FT5773
12W: AZ492FT5765
Temperature Range:
Operating:-30 to +60°C
Storage:-40 to +85°C
Power Supply:
Nominal Voltage:13.6 V
Operating Voltage: 10.8-16.3 V
Current Drain, maximum values:
Stand-by:0.45 A
Receive:
1.7 A with 7.5 W speaker
2.5 A with 13 W speaker
1.5 A with 4 W speaker
Transmit (12W):6.5 A
Transmit (30W):14.5 A
Off: 30 mA
Number of Modes:
Model I: Standard 48, optional 150
Model II, III: Standard 160, optional 250
Channel Spacing:12.5 kHz
Mode of Operation:Semi-Duplex
Modulation: FM
Antenna Impedance:50 W
Frequency Stability:±1.5 ppm
Dimensions (H/W/D):
1-25W Transceivers:
44x168x180 mm / 1.73Óx6.61Óx7.09Ó
25-50W Transceivers: 
44x168x230 mm / 1.97Óx6.61Óx7.76Ó
Control Head I, Dash Mt.:
44x168x30 mm / 1.75Óx6.61Óx1.81Ó
Control Head II, III, Dash Mt.:
60x186x30 mm / 2.35Óx7.33Óx1.83Ó
Control Head II, III, Remote Mt.:
60x186x71 mm / 2.35Óx7.33Óx2.78Ó
Weight:
1-25 Watt Transceivers:1.6 kg / 3.53 lbs
25-50 Watt Transceivers:1.8 kg / 4.04 lbs
Control Head I, Dash Mt.:152 g / 0.33 lbs
Control Head II, Dash Mt.:233 g / 0.51 lbs
Control Head III, Dash Mt.:229 g / 0.50 lbsFrequency Range:896-941MHz
Maximum Frequency Separation:6 MHz
Sensitivity:
20dB SINAD:0.40 uV
12dB SINAD:0.30 uV
Adjacent Channel Selectivity:
Model I:-65 dB
Models II & III:-70 dB
Spurious & Image Rejection:
Model I:-70 dB
Models II & III:-90 dB
Intermodulation: (uVemf)
Model I:-65 dB
Models II & III:-70 dB
Conducted Spurious Emission:
per FCC part 90
Audio Output:
4 W (internal, 16 W)
7.5 W or 13 W (external, 8 W/3.2 W)
Audio Response:
6 dB/octave +1/-3 dB at 300-3000 Hz
Distortion:4/7.5/13 W  @:
						

							 
Basic Maintenance 2-1 
Basic Maintenance 
2 
Introduction 
This chapter of the manual describes preventive maintenance, safe handling 
of CMOS devices, and repair procedures and techniques. Each of these topics 
provides information vital to the successful operation and maintenance of 
your radio. 
Preventive 
Maintenance 
The radios do not require a scheduled preventive maintenance program; 
however, periodic visual inspection and cleaning is recommended. 
Inspection 
Check that the external surfaces of the radio are clean, and that all external 
controls and switches are functional. A detailed inspection of the interior 
electronic circuitry is not needed or desired. 
Cleaning 
The following procedures describe the recommended cleaning agents and the 
methods to be used when cleaning the external and internal surfaces of the 
radio. External surfaces include the front cover, housing and assembly. These 
surfaces should be cleaned whenever a periodic visual inspection reveals the 
presence of smudges, grease, and/or grime. Internal surfaces should be cleaned 
only when the radio is disassembled for servicing or repair.
The only recommended agent for cleaning the external radio surfaces is a 0.5% 
solution of a mild dishwashing detergent in water. The only factory 
recommended liquid for cleaning the printed circuit boards and their 
components is isopropyl alcohol (70% by volume).  
The effects of certain chemicals and their vapors can have harmful results 
on certain plastics. Aerosol sprays, tuner cleaners, and other chemicals 
should be avoided. 
Plastic Surfaces 
The detergent-water solution should be applied sparingly with a stiff, 
nonmetallic, short-bristled brush to work all loose dirt away from the radio. A 
soft, absorbent, lint-free cloth or tissue should be used to remove the solution 
and dry the radio. Make sure that no water remains entrapped near the 
connectors, cracks, or crevices. 
Circuit Boards and 
Components 
Isopropyl alcohol may be applied with a stiff, nonmetallic, short-bristled 
brush to dislodge embedded or caked materials located in hard-to-reach areas. 
The brush stroke should direct the dislodged material out and away from the 
inside of the radio.
Alcohol is a high-wetting liquid and can carry contamination into unwanted 
places if an excessive quantity is used. Make sure that controls or tuneable 
components are not soaked with the liquid. Do not use high-pressure air to 
hasten the drying process, since this could cause the liquid to puddle and 
collect in unwanted places.
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C a u t i o n 
						

							 
2-2Basic Maintenance  
Upon completion of the cleaning process, use a soft, absorbent, lint-free cloth 
to dry the area. Do not brush or apply any isopropyl alcohol to the frame, 
front cover, or back cover.
Always use a fresh supply of alcohol and a clean container to prevent 
contamination by dissolved material (from previous usage). 
Safe Handling 
of CMOS 
Devices 
Complementary metal-oxide semiconductor (CMOS) devices are used in 
this family of radios. While the attributes of CMOS are many, their 
characteristics make them susceptible to damage by electrostatic or high 
voltage charges. Damage can be latent, resulting in failures occurring 
weeks or months later. Therefore, special precautions must be taken to 
prevent device damage during disassembly, troubleshooting, and repair. 
Handling precautions are mandatory for CMOS circuits, and are especially 
important in low humidity conditions. DO NOT attempt to disassemble 
the radio without observing the following handling precautions. 
Precautions 
12.Eliminate static generators (plastics, styrofoam, etc.) in the work area.
13.Remove nylon or double-knit polyester jackets, roll up long sleeves, and 
remove or tie back loose hanging neckties
14.Store and transport all static-sensitive devices in ESD-protective 
containers.
15.If at all possible, handle CMOS devices by the package and not by the 
leads. Prior to touching the unit, touch an electrical ground to remove 
any static charge that you may have accumulated. The package and 
substrate may be electrically common. If so, the reaction of a discharge 
to the case would cause the same damage as touching the leads.
16.Disconnect all power from the unit before ESD-sensitive components are 
removed or inserted unless otherwise noted.
17.Use a static-safeguarded workstation, which can be accomplished 
through the use of an anti-static kit (Motorola part number 01-
80386A82). This kit includes a wrist strap, two ground cords, a static-
control table mat and a static-control ßoor mat. For additional 
information, refer to Service and Repair Note SRN F1052, ÒStatic Control 
Equipment for Servicing ESD Sensitive ProductsÓ, available from 
Motorola Literature Distribution 2290 Hammond Drive Schaumburg, IL 
60173 (847) 576-2826
When these items are not readily available, observing the following 
techniques will minimize chance of damage.
-If a static-sensitive device is to be temporarily set down, use a 
conductive surface for placement of the device.
-Make skin contact with a conductive work surface Þrst and maintain 
this contact when the device is set down or picked up.
Note
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C a u t i o n 
						

							 
Basic Maintenance2-3  
18.Always wear a conductive wrist strap when servicing this equipment. 
The Motorola part number for a replacement wrist strap that connects to 
the table mat is 42-80385A59.
19.When straightening CMOS pins, provide ground straps for apparatus used.
20.When soldering, use a grounded soldering iron. 
Parts 
Replacement 
and 
Substitution 
Special care should be taken to be as certain as possible that a suspected 
component is actually the one at fault. This special care will eliminate 
unnecessary unsoldering and removal of parts, which could damage or 
weaken other components or the printed circuit board itself.
When damaged parts are replaced, identical parts should be used. If the 
identical replacement component is not locally available, check the parts list 
for the proper Motorola part number and order the component from the 
nearest Motorola Communications Parts ofÞce. 
Rigid Circuit 
Boards 
This family of radios uses bonded, multi-layer, printed circuit boards. Since the 
inner layers are not accessible, some special considerations are required when 
soldering and unsoldering components. The printed-through holes may 
interconnect multiple layers of the printed circuit. Therefore, care should be 
exercised to avoid pulling the plated circuit out of the hole.
When soldering near the module socket pins, use care to avoid accidentally 
getting solder in the socket. Also, be careful not to form solder bridges between 
the module socket pins. Closely examine your work for shorts due to solder 
bridges. When removing modules with metal enclosures, be sure to desolder 
the enclosure ground tabs as well as the module pins. 
SpeciÞc 
During all repair procedures, heating neighbouring components can be 
minimized by:
¥using upper heat only.
¥using the correct size heat focus head approximately the same size as the 
carrier being replaced
¥keeping the heat focus head approximately1/8Ó or 3-6 mm above the 
printed circuit board when removing or replacing the device.  
If neighbouring OMPAC components are heated above 365 degrees F or 
185 degrees C they will suffer die-bond delamination and possible 
ÒpopcornÓ failure.
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C a u t i o n 
						

							 
2-4Basic Maintenance 
Audio PA Component Replacement Procedure 
For High Power Models 
This procedure must be used when replacing these components to ensure 
proper alignment and heatsinking.  
1.Remove the main board from the chassis per disassembly instructions in 
Chapter 5.
2.Remove the faulty component in the Audio PA section of the main 
board. Ensure that the through-holes are free of solder.
3.Place the main board in a chassis eliminator (Motorola Part Number 
2705815W03). Assemble the screws based on the Screw-Down sequence 
in Figure 5-19.
4.Place new component(s) in the proper location. Assemble the Audio PA 
Clip per the reassembly instructions Step 8. on page 5-22.
5.Flip the chassis eliminator over. 
6.Using a large tip soldering iron set to 750 
° 
F max, heat ground plane 
around through holes for approximately 15 seconds. Dispense 6337 Tin 
Lead solder wire until a uniform solder Þllet exists. Repeat this operation 
for all leads.
7.Inspect solder joints. There should be a uniform Þllet. The joints should 
be shiny and not dull in appearance.
8.Remove the Audio PA clip per disassembly instructions Step 2. on page 5-
14. Remove all screws. Pull board out of chassis eliminator.
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Basic Maintenance2-5 
Antenna/Power Connector Replacement Procedure 
For Low, Mid, and High Power Models 
Note that Figures show High Power Chassis, but apply to all power levels.
1.Remove damaged connector by heating the solder 
joints until they reßow. Pull connector from board 
with small pliers or like instrument.
2.Place new connector (either Power or RF) in 
opening in chassis (See Figure 2-1.). Connector 
Part Numbers can be found in Chapter 10.
3.Install connector retaining clip over connector 
and chassis wall (See Figure 2-2.).
4.Install PA Board, aligning connector holes over 
connector pins per orientation in Figure 2-3. 
Ensure that the undamaged connector has a 
retaining clip installed. 
5.Screw down board using Torx drivers per the 
Assembly Section of Chapter 5. For High Power 
radios, follow the screw-down sequence found in  
Figure 5-19.
6.Using a large tip soldering iron set to maximum 
750 
° 
F/400 
° 
C, heat ground leads on connector for 
approximately 15 seconds. Dispense 6337 Tin 
Lead solder wire until a uniform solder Þllet exists.  
Using temperatures higher than 750 
°  
F/
400 
° 
C will cause the modular ground 
rings to pull off the board around pins 
and cause the board irreparable 
damage. 
7.Inspect solder joints. The solder should not Òball-
upÓ over leads. There should be a uniform Þllet. 
The joints should be shiny and not dull in 
appearance. 
If solder joint does not exhibit these 
characteristics, the joint will contain a 
cold solder and/or voids that could 
damage the Power AmpliÞer portion of 
the radio. 
8.Remove retaining clips. Unscrew board. Take 
board out of chassis. 
9.Inspect for uniform solder Þllet around leads on 
heavy side of board. Ensure that there is not 
excessive solder around leads. If excessive solder 
exists, carefully remove it with the soldering iron.
10.Reassemble board into chassis per the Reassembly/
Assembly procedure on the previous pages based 
on the power level being repaired.
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C a u t i o n
!
C a u t i o n
 
Figure 2-1   RF and Power Connector Openings
Figure 2-2   Install Connector Retaining Clip
Figure 2-3   Replace PA Board
Power Connector
Opening RF Connector
Opening
MEPC-96587-O
Retaining
Clip
Chassis 
Wall
Connector
MEPC-96588-O
PA Board
Ground Leads
MEPC-96589-O 
						

							 
2-6Basic Maintenance 
NOTES 
						

							 
Test Equipment, Service Aids, and Tools 3-1 
Test Equipment, 
Service Aids, and Tools 
3 
Recommended
Test 
Equipment 
The list of equipment contained in the table below includes all of the standard 
test equipment required for servicing two-way mobile radios, as well as several 
unique items designed speciÞcally for servicing the radio. Battery-operated test 
equipment is recommended when available. The ÒCharacteristicsÓ column is 
included so that equivalent equipment may be substituted; however, when no 
information is provided in this column, the speciÞc Motorola model listed is 
either a unique item or no substitution is recommended. 
* Any of the R2000 Series system analyzers will substitute for items with an asterisk (*) 
Table 3-1    Recommended Test Equipment 
Motorola 
Model Number
DescriptionCharacteristicsApplication  
R2000 Series  System Analyzer This monitor will substitute for 
items with an asterisk (*)Frequency/deviation meter and signal 
generator for wide-range 
troubleshooting and alignment.
R1150C* Code Synthesizer Injection of audio and digital signalling 
codes.
S1053D*
HM-203-7*
SKN6008A*
SKN6001A*220 VAC Voltmeter
110 VAC Voltmeter
Power Cable for Meter
Test Leads for Meter1mV to 300V, 10-Mohm input 
impedanceAudio voltage measurements.
S1350C*
ST1213B (VHF)*
(Superseded by ST1217B)
ST1217B (VHF)*
ST1223B (UHF)*
(Superseded by ST1237B 
and ST1227B)
ST1237B (UHF R1)*
ST1227B (UHF R2)*Watt Meter
Plug-in Element
Plug-in Element
RF Dummy Load
Plug-in Element
Plug-in Element50 ohm,   
±  
5% accuracy
10 Watts, maximum
0-1000 MHz, 300WTransmitter power output 
measurements.
T1013A
(Supersedes R1065A)Load Resistor 0-1000MHz, 300W For use with Wattmeter.
R1065A
(Superseded by T1013A)Load Resistor 10-watt Broadband For use with Wattmeter.
S1339A RF Millivolt Meter
10kHz to 1.2 GHz100  
m  
V to 3V rf  RF level measurements.
R1013A* SINAD Meter Receiver sensitivity measurement.
R1011B
(Supersedes S1347D & 
S1348D)DC Power Supply 0-40Vdc, 0-30 Amps Current limited bench power supply.
S1347D or
S1348D (programmable)
(Superseded by R1011B)DC Power Supply 0-20Vdc, 0-5 Amps Current limited bench power supply. 
						

							 
3-2Test Equipment, Service Aids, and Tools 
  
Service Aids 
and 
Recommended
Tools 
Refer to the ÒSERVICE AIDSÓ and ÒRECOMMENDED TOOLS LISTÓ for a listing 
and description of the service aids and tools designed speciÞcally for servicing 
the radio, as well as the more common tools required to disassemble and 
properly maintain the radio. These kits and/or parts are available from 
Motorola.
The following table lists service aids recommended for working on the radio. 
While all of these items are available from Motorola, most are standard shop 
equipment items, and any equivalent item capable of the same performance 
may be substituted for the item listed. 
Field 
Programming 
The radio can be aligned and programmed in the Þeld. This requires speciÞc 
equipment and special instructions. Refer to the ÒRadio Service Software UserÕs 
ManualÓ for complete Þeld programming information.  
Table 3-2   Service Aids 
 Part Number
DescriptionApplication  
RKN4062BProgramming and Cloning CableConnects the RIB RLN4008B to the microphone connector. Cloning is the 
act of transferring programmed data from one radio to another.
RKN4063AFLASH, Programming and 
Cloning Cable with Test BoxConnects the RIB RLN4008B to the accessory connector. Cloning is the act 
of transferring programmed data from one radio to another. FLASHing is the 
act of adding new software to the radio.
3080376E36Control Head Extender CableConnects the control head to the 18 pin connector.
(see page 4 for correct use of this cable).
GTF373A
 
*
 
Test Box CableConnects radio to GTF180B test box.
GTF372A*Combined Interface CableConnects radio to RLN4008B RIB and Microphone Port and Accessory 
Connector.
HKN4191ADC Power Cable for radiosInterconnects radio below 50 W to power supply.
HKN6110DC Power Cable for radiosInterconnects radio of over 50 W to power supply.
RLN4460A or 
GTF180B*Test BoxAllows switching for radio testing.
RLN4008BRadio Interface BoxEnables communications between the radio and the computerÕs serial 
communications adapter.
0180358A56 or   
EPN4041A*Power SupplyUsed to supply power to the RIB (220 VAC).
0180357A57Power SupplyUsed to supply power to the RIB (110 VAC).
EPN4040A*Power SupplyUsed to supply power to the RIB (240 VAC).
3080369B71 or 
3080369B72Computer Interface CableUse B72 for the IBM PC AT. All other IBM models use B71. Connects the 
computerÕs serial communications adapter to the RIB.
RLN4438AAdapter25 pin (F) to 9 pin (M) adapter, for use with 3080369B72 for AT applications.
RLN1015BSmart Radio Interface Box (SRIB)Enables communications between the radio and the computerÕs serial 
communications adapter. For FLASHing, programming and cloning.
0180302E27SRIB Power SupplyUsed to supply power to the SRIB (120 VAC).
2580373E86SRIB Power SupplyUsed to supply power to the SRIB (220 VAC).
RLN4488ASRIB Battery PackUsed to power the SRIB from a battery.
3080390B48 or 
3080390B49Computer Interface CableUse B49 for the IBM PC AT. All other IBM models use B48. Connects the 
computerÕs serial communications adapter to the SRIB only.
2705438Y01
2705816W03
2705815W03Chassis Eliminator
Chassis Eliminator
Chassis EliminatorFor Low Power radios.
For Mid Power radios.
For High Power radios.