Motorola Gtx2000 Lcs2000 68p02945c70 O Manual

							viii Model Charts & Maintenance Specifications
LCS 2000 Accessories
Mics
HMN3220 Compact Mic with Hang-Up Clip
HMN1035 Full Size Palm Mic
HMN3013 Full Size Mic, Non-Backlit
TDN8310 DTMF Full Size Mic, Backlit
Speakers
FSN5510 7.5 W External Speaker
Installation
GLN7317 Non-Locking Trunnion
Cables
GKN6270 Mobile Power Cable
GKN6271 Ignition Switch Cable
Alarms
GKN6272 External Alarm & Relay Cable
HLN9329 Emergency Pushbutton
GLN7323 Emergency Footswitch
Antennas
RRA4914 3 dB Gain Roof Mount SS Antenna
RRA4990 3 dB Gain Roof Mount BC Antenna
RRA4983 3 dB Gain Roof Mount LL/SS Antenna
RRA4986 3 dB Gain Roof Mount LL/BC Antenna
HAF4002 1/4 Wave Roof Mount
Accessory Connectors
HLN5282 Mini-U Connector
HKN9557 Mini-U Antenna Adapter Cable
HLN8027 Mini-U to BNC Adapter
Documentation Kits
User Guides (Operator Manuals)
68P02945C95 Quick Start
68P02945C90 UserÕs Manual
Installation and Service Manuals
68P02945C80 Installation Manual
68P02945C70 Service Manual 
						

							Model Charts & Maintenance Specifications ix
Maintenance SpeciÞcations
All speciÞcations subject to change without notice.
GENERALRECEIVERTRANSMITTER
FCC Designation:
GTX:
LCS 2000:AZ492FT5778
AZ492FT5779Frequency Range:
GTX & LCS 2000:
LCS 2000:851-866 MHz
851-870 MHzFrequency range:
GTX:
LCS 2000:806-821MHz
851-866MHz
806-825MHz
851-870MHz
Temperature Range:
Operating:
Storage:-30+60ûC
-40+85ûCMax. Frequency
Separation:
GTX:
LCS 2000:15 MHz
19 MHzMax. Freq. Separation:
GTX:
LCS 2000:60 MHz
64 MHz
 Sensitivity
(12dB SINAD):0.35mV max. RF Power:
GTX (LCS 2000): 15W
806-821 (825) MHz)
10W
851-866 (870) MHz
Power Supply:
Nominal:
Operating:
Current Drain,
maximum values:
Stand-by:
Receive:
Transmit (15 W):
Off:13.6 V
10.8 to 16.3 V
0.45 A
1.7 A with 7.5 W
6.5 A
30 mAAdj. Channel
Selectivity:-65 dB Deviation, Max.:
GTX:
@ 806-821 & 851-866
MHz
LCS 2000:
@821-825 & 866-870 MHz±5 kHz
±4 kHz
Number of Systems:
Talkgroups:
Conventional:10
8
10Spurious & Image
Rejection:-65dB Spurious & Harmonics: -56 dBc
Channel Spacing: 25 kHz Intermodulation: -65dB Audio Response: 6 dB/octave
+1/-3 dB at
300-3000 Hz
Mode of Operation: Semi-Duplex Selectivity
(25kHz Adjacent
Channel):-65dB Distortion:5% @ 60% of
maximum deviation
Modulation: FM
Antenna Impedance: 50WConducted
Spurious Emission:per FCC part 90
Frequency Stability:
GTX & LCS 2000:
LCS 2000:806-821 MHz
& 851-866 MHz,
±2.5ppm
821-824 MHz
& 866-869 MHz,
±1.5ppmAudio Output: 4 W
(internal, 16W)
7.5 W
(external, 8W)
Dimensions:
(H X WX D) 44x168x169 mm;
1.73x6.61x6.67ÓAudio Response: 6 dB/octave
+1/-3 dB at
300-3000 Hz
Weight: 1.21 kg (2.67 lbs)
Distortion:  5% @ 7.5 W 
						

							x Model Charts & Maintenance Specifications
Radio Model Numbering System
The model number, serial number, and Motorola FCC designation number are all on a label attached to the back of your
radio.
All GTX/LCS 2000 radio models are synthesized, 8-channel units that come standard with Tone Private-Line (TPL)/Dig-
ital Private-Line (DPL) coded squelch or carrier squelch, which may be enabled/disabled on a per channel basis. Program-
ming changes can be made by your local dealer.
M 1 1UGD6CB1AN
Position 1 - Type of Unit
M = Mobile
Model Number:
Position:123456789101112
Position 4 - Frequency Band
Position 2 & 3 - Model Series
Position 5 - Power Level
Position 6 - Physical Package
Position 12 -
Position 10 - Feature Level
Position 8 - Primary Operation
Position 11- Version
Position 9 - Primary System Type
806-870 MHz
10-25 W
Standard Control with Display
Position 7 - Channel Spacing
20/25 kHzUnique Model Variations
Standard Package
Version Letter (Alpha) - Major Change
Basic
Privacy Plus
¨
Trunked Twin Type
M 1 0UGD6DC5AN
Position 1 - Type of Unit
M = Mobile
Model Number:
Position:123456789101112
Position 4 - Frequency Band
Position 2 & 3 - Model Series
Position 5 - Power Level
Position 6 - Physical Package
Position 12 -
Position 10 - Feature Level
Position 8 - Primary Operation
Position 11- Version
Position 9 - Primary System Type
806-870 MHz
10-25 W
Standard Control with Display
Position 7 - Channel Spacing
20/25 kHzUnique Model Variation
Standard Package
Version Letter (Alpha) - Major Change
Standard Package
Clear SMARTNET
ª
Dual Mode Trunked
GTX
LCS 2000 
						

							Introduction 1-1
1
1Introduction1
Notational ConventionsThroughout the text in this publication, you will notice the use of warnings,
cautions, and notes. These notations are used to emphasize that safety hazards
exist, and care must be taken and observed.
Warning
Caution
Note
An operational procedure, practice, or condition, etc., which it is essential to
emphasize.
Scope of this ManualThis manual includes model/kit information, speciÞcations, disassembly/
reassembly procedures, maintenance, alignment, troubleshooting, and all theory,
schematic diagrams, printed circuit board details and parts lists for all parts in the
equipment described.
Safety informationEvery radio, when transmitting, radiates energy into the atmosphere which may,
under certain conditions, causes the generation of a spark.
All users of vehicles Þtted with radios should be aware of the following warnings:
WARNING
Indicates a potentially hazardous situation which, if not
avoided, COULD result in death or serious injury.
CAUTION
Indicates a potentially hazardous situation which, if not
avoided, MAY result in minor or moderate injury.
CAUTION may also be used to alert against unsafe
practices and property-damage-only accident hazards.
CAUTION
This manual is intended for use by experienced
technicians who are familiar with similar types of
equipment.
WARNING
¥Do not operate the radio near ßammable liquids or
in the vicinity of explosive devices.
¥ During normal use, the radio will subject you to
radio energy substantially below the level where any
kind of harm is reported.
!
!
!
! 
						

							1-2 IntroductionTo ensure personal safety, please observe the following simple rules:
Air Bag Warning
Installation of vehicle equipment should be performed by a professional installer/
technician qualiÞed in the requirements for such installations.
An air bagÕs size, shape and deployment area can vary by vehicle make, model and
front compartment conÞguration (e.g., bench seat vs. bucket seats). Contact the
vehicle manufacturerÕs corporate headquarters, if necessary, for speciÞc air bag
information for the vehicle make, model and front compartment conÞguration
involved in your communication equipment installation.
LP Gas Warning
WARNING
¥Do not transmit when the antenna is very close to, or
touching, exposed parts of the body, especially the
face and eyes.
¥Do not hold the transmit (PTT) key in when not
desiring to transmit.
¥Check the laws and regulations on the use of two-
way mobile radios in the areas where you drive.
Always obey them. Also, when using your radio while
driving, please:
give full attention to driving,
use hands-free operation, if available, and
pull off the road and park before making or answering
a call if driving conditions so require.
WARNING
Vehicles equipped with air bags.
An air bag inßates with great force.Do not place
objects, including communication equipment, in the area
over the air bag or in the air bag deployment area. If the
communication equipment is improperly installed and
the air bag inßates, this could cause serious injury.
WARNING
It is mandatory that radios installed in vehicles fueled by
liqueÞed petroleum gas conform to the National Fire
Protection Association standard NFPA 58, which applies
to vehicles with a liquid propane (LP) gas container in
the trunk or other sealed off space within the interior of
the vehicle. The NFPA 58 requires the following:
¥Any space containing radio equipment shall be
isolated by a seal from the space in which the LP gas
container and its Þttings are located.
¥Removable (outside) Þlling connections shall be
used.
¥The container space shall be vented to the outside.
!
!
! 
						

							Basic Maintenance 2-1
2Basic Maintenance2
IntroductionThis section of the manual describes preventive maintenance, safe handling of
CMOS devices, and repair procedures and techniques. Each of these topics
provides information vital to the successful operation and maintenance of your
radio.
Preventive
MaintenanceThe radios do not require a scheduled preventive maintenance program; however,
periodic visual inspection and cleaning is recommended.
InspectionCheck that the external surfaces of the radios are clean, and that all external
controls and switches are functional. A detailed inspection of the interior
electronic circuitry is not needed or desired.
Cleaning
The following procedures describe the recommended cleaning agents and the
methods to be used when cleaning the external and internal surfaces of the radio.
External surfaces include the front cover, housing and assembly. These surfaces
should be cleaned whenever a visual inspection reveals the presence of smudges,
grease, and/or grime. Internal surfaces should be cleaned only when the radio is
disassembled for servicing or repair.
The only recommended agent for cleaning the external radio surfaces is a
0.5%solution of mild dishwashing detergent in water. the only factory
recommended liquid for cleaning the printed circuits boards and their components
is isopropyl alcohol (70% by volume).
Plastic SurfacesThe detergent solution should be applied sparingly with a stiff non-metallic, short-
bristled brush to work all loose dirt away from the radio. A soft, absorbent, lint-
free cloth or tissue should be used to remove the solution and dry the radio. Make
sure that no water remains entrapped near the connectors, cracks, or crevices.
Circuit Boards and
ComponentsIsopropyl alcohol may be applied with a stiff, non-metallic, short-bristled brush to
dislodge embedded or caked material located in hard-to-reach areas. The brush
stroke should direct the dislodged material out and away from the inside of the
radio.
CAUTION
The effects of certain chemical and their vapors can have
harmful results on certain plastics. Aerosol sprays, tuner
cleaners, and other chemicals should be avoided.
CAUTION
Alcohol is a high-wetting liquid and can carry
contamination into unwanted places if an excessive
quantity is used.
!
! 
						

							2-2 Basic MaintenanceMake sure that controls or tunable components are not soaked with the liquid. Do
not use high-pressure air to hasten the drying process. This could cause the liquid
to puddle and collect in unwanted places. Upon completion of the cleaning
process, use a soft, absorbent, lint-free cloth to dry the area. Do not brush or apply
any isopropyl alcohol to the frame, front cover, or back cover.
Note:Always use a fresh supply of isopropyl alcohol and a clean
container to prevent contamination by dissolved material
from previous usage.
Safe Handling of
CMOS DevicesComplementary metal-oxide semiconductor (CMOS) devices are used in this
family of radios. While the attributes of CMOS are many, their characteristics
make them susceptible to damage by electrostatic or high voltage charges.
Damage can be latent, resulting in failures occurring weeks or months later.
Therefore, special precautions must be taken to prevent device damage during
disassembly, troubleshooting, and repair. Handling precautions are mandatory for
CMOS circuits and are especially important in low humidity conditions.
Precautions1. Eliminate static generators (plastics, stryofoam, etc. in the work area.
2. Remove nylon or double-knit polyester jackets, roll up long sleeves, and
remove or tie back loose hanging neckties.
3. Store and transport all static-sensitive devices in ESD-protective containers.
4. If at all possible, handle CMOS devices by the package and not by the leads.
Prior to touching the unit, touch an electrical ground to remove any static
charge that you may have accumulated. The package and substrate may be
electrically common. If so, the reaction of a discharge to the case would cause
the same dame as touching the leads.
5. Disconnect all power from the unit before ESD-sensitive components are
removed or inserted unless otherwise noted.
6. Use a static safeguarded workstation, which can be accomplished through the
use of an anti-static kit (Motorola part number 0180386A82). This kit
includes a writ strap, two ground cords, a static-control table mat and a static-
control ßoor mat. For additional information, refer to Service and Repair
Note SRN F1052, ÒStatic Control Equipment for Servicing ESD Sensitive
ProductsÓ, available form Motorola Literature Distribution 2290 Hammond
Drive Schaumburg, IL 60173 (708) 576-2826.
When these items are not readily available, observing the following
techniques will minimize chance of damage.
- If a static-sensitive device is to be temporarily set down, use a
conductive surface for placement of the device.
- Make skin contact with a conductive work surface Þrst and maintain
this contact when the device is set down or picked up.
CAUTION
Do not attempt to disassemble the radio without
observing the following handling precautions.! 
						

							Basic Maintenance 2-3 7. Always wear a conductive strip when servicing this equipment. the Motorola
part number for a replacement wrist strap that connects to the table mat is 42-
80385A59.
8. When straightening CMOS pins, provide ground straps for apparatus used.
9. When soldering, use a grounded soldering iron.
Repair Procedures and
TechniquesThe radio support center is at the following address:
Motorola Radio Support Center
3651 South Central Avenue
Rockford, Ill, 61102
Telephone: (800) 227-6772
                   (815) 874-1400
Refer to the Disassembly and Reassembly section of the manual for pertinent
information prior to replacing and substituting parts.
Parts ReplacementSpecial care should be taken to be as certain as possible that a suspected
component is actually the one at fault. This special care will eliminate unnecessary
unsoldering and removal of parts, which could damage or weaken other
components or the printed circuit board itself.
When damaged parts are replaced, identical parts should be used. If the identical
replacement component is not locally available, check the parts list for the proper
Motorola part number and order the component from the nearest Motorola
Communications Parts ofÞce.
Rigid Circuit BoardsThis family of radios uses bonded, multi-layer, printed circuit boards.
Since the inner layers are not accessible, some special considerations are
required when soldering and unsoldering components. The printed-
through holes may interconnect multiple layers of the printed circuit.
When soldering near the 16 or 18-pin connector, use care to avoid
accidentally getting solder in the connector.
Chip ComponentsUse either the RLN4062 Hot-Air Repair Station or the Motorola 0180381B45
Repair Station for chip component replacement. When using the 0180381B45
Repair Station, select the TJ-65 mini-thermojet hand piece. On either unit, adjust
the temperature control to 700û F (370û C), and adjust the airßow to a minimum
setting. Airßow can vary due to component density.
Chip Component RemovalTo remove a chip component, select a hot-air hand piece and position the nozzle
of the hand piece approximately 1/8Ó above the component to be removed. Begin
applying the hot air. Once the solder reßows, remove the component using a pair
of tweezers. Using solder wick and a soldering iron or a power desoldering station,
remove the excess solder from the pads.
CAUTION
 Therefore, care should be exercised to avoid pulling the
plated circuit out of the hole.
CAUTION
Be careful not to form solder bridges between the
connector pins. Closely examine your work for shorts due
to solder bridges.
!
! 
						

							2-4 Basic Maintenance
Chip Component
ReplacementTo replace a chip component using a soldering iron,select the appropriate
micro-tipped soldering iron and apply fresh solder to one of the solder pads. Using
a pair of tweezers, position the new chip component in place while heating the
fresh solder. Once solder wicks onto the new component, remove the heat from
the solder. Heat the remaining pad with the soldering iron and apply solder until it
wicks to the component. If necessary, touch up the Þrst side. All solder joints
should be smooth and shiny.
To replace a chip component using hot air, select the hot-air hand piece and
reßow the solder on the solder pads to smooth it. Apply a drop of solder paste ßux
to each pad. Using a pair of tweezers, position the new component in place.
Position the hot- air hand piece approximately 1/8Ó above the component and
begin applying heat. Once the solder wicks to the component, remove the heat and
inspect the repair. All joints should be smooth and shiny.
Over-Molded Pad-Array
Carrier (OMPAC)ASFIC U0201 is an OMPAC. It must be kept in a sealed bag with dessicant in the
bag (in a Òdry boxÓ as supplied by the Motorola Parts Department prior to use. If
the OMPAC is ambient for an unknown amount of time or for more than 96 hours,
then it must be baked for at least eight hours at 260 û F (185û C).
If neighboring OMPAC components are heated above 365û F (185û C), they will
suffer die-bond delamination and possible ÒpopcornÓ failure.
During all repair procedures, heating neighboring components can be minimized
by:
¥Using upper heat only. using the correct size heat-focus head, approximately
the same size as the carrier being replaced.
¥Keeping the heat-focus head approximately 1/8Ó (0.3cm) above the printed
circuit board when removing or replacing the device.
OMPAC RemovalTo remove the OMPAC, select the R-1070A Air-Flow Station and the
appropriate heat- focus head (approximately the same size as the OMPAC. Attach
the heat-focus head to the chimney heater. Adjust the temperature control to
approximately 415û F (215û C) 445û F (230û C) maximum. Adjust the airßow
slightly above the minimum setting. Apply the solder paste ßux around the edge
of the OMPAC. Place the circuit board in the R-1070As circuit board holder, and
position the OMPAC under the heat-focus head. Lower the vacuum tip and attach
it to the OMPAC by turning on the vacuum pump. Lower the heat-focus head until
it is approximately 1/8Ó (0.3cm) above the carrier. Turn on the heater and wait
until the OMPAC lifts off the circuit board. Once the part is off, grab it with a pair
of tweezers and turn off the vacuum pump. Remove the circuit board from the R-
1070As circuit board holder.
OMPAC ReplacementTo replace the OMPAC, the solder pads on the board must Þrst be cleaned of all
solder to ensure alignment of the new chip carrier. Prepare the sight by using
solder wick and a soldering iron to remove all solder from the solder pads on the
circuit board. If a power desoldering tool is available, it can be used instead of the
solder wick. Clean the solder pads with alcohol and a small brush. Dry and
inspect. Ensure that all solder is removed.
Once the preparation is complete, place the circuit board back in the R-1070As
circuit board holder. Add solder paste ßux in the trench of the ßux block and
spread it using a one-inch putty knife. Flux the OMPAC by placing it in the trench
of the ßux block. Once the ßux is applied, place the OMPAC on the circuit board,
making certain that it is oriented correctly on the board. Position the heat-focus 
						

							Basic Maintenance 2-5 head over the OMPAC and lower it to approximately 1/8Ó (0.3cm) over the carrier.
Using the same heat and airßow setting used to remove the OMPAC, turn on the
heater and wait for the carrier to reßow (heating and reßow should take longer
than 60 seconds).
Once the carrier reßows, raise the heat-focus head and wait approximately one
minute for the part to cool. Remove the circuit board and inspect the repair. No
cleaning should be necessary.
ShieldsRemoving and replacing the shields will be done with the R-1070A, using the
same heat and airßow proÞle used to remove and replace OMPAC components.
Shield RemovalPlace the circuit board in the R-1070As holder. Select the proper heat focus head
and attach it to the heater chimney. Add solder paste ßux around the base of the
shield. Position the shield under the heat-focus head. Lower the vacuum tip and
attach it to the shield by turning on the vacuum pump. Lower the focus head until
it is approximately 1/8Ó(0.3cm) above the shield. Turn on the heater and wait until
the shield lifts off the circuit board. Once the shield is off, turn off the heat, grab
the part with a pair of tweezers, and turn off the vacuum pump. Remove the circuit
board from the R-1070As circuit board holder.
Shield ReplacementTo replace the shield, add solder to the shield if necessary, using a micro-tipped
soldering iron. Next, rub the soldering iron tip along the edge of the shield to
smooth out any excess solder. Use solder wick and a soldering iron to remove
excess solder from the solder pads on the circuit board. Place the circuit board
back in the R-1070As circuit board holder. Place the shield on the circuit board
using a pair of tweezers. Position the heat-focus head over the shield and lower it
to approximately 1/8Ó above the shield. Turn on the heater and wait for the solder
to reßow.
Once complete, turn off the heat, raise the heatfocus head, and wait approximately
one minute for the part to cool. Remove the circuit board and inspect the repair.
No cleaning should be necessary.