HP Pavilion G4 1000 Notebook Pc Series Service Guide
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DescriptionSpare part number For use only with computer models equipped with an HM55 chipset and a graphics subsystem with 512-MB of discrete video memory636371-001 For use only with computer models equipped with an HM65 chipset and a graphics subsystem with UMA video memory636373-001 For use only with computer models equipped with an HM55 chipset and a graphics subsystem with UMA video memory636370-001 Before removing the system board, follow these steps: 1.Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system. 2.Disconnect all external devices connected to the computer. 3.Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the computer. 4.Remove the battery (see Battery on page 48), and then remove the following components: ●Optical drive (see Optical drive on page 49) ●Hard drive (see Hard drive on page 51) ●WLAN module (see WLAN module on page 54) ●Keyboard (see Keyboard on page 56) ●Top cover (see Top cover on page 59) When replacing the system board, be sure that the following components are removed from the defective system board and installed on the replacement system board: ●Memory module (see Memory module on page 53) ●RTC battery (see RTC battery on page 77) ●Fan and heat sink (see Fan and heat sink on page 79) ●Processor (see Processor on page 84) Component replacement procedures 73
Remove the system board: 1.Disconnect the following cables from the system board: (1) LED board cable (2) Speaker cable (3) Optical drive cable (4) Display panel cable 2.Disconnect the power connector cable (1) from the system board. 74 Chapter 4 Removal and replacement procedures
3.Release the ZIF connector to which the USB board cable is attached, and then disconnect the USB cable (2) from the system board. 4.Remove the Phillips PM2.5×6.0 screw (1) that secures the system board to the base enclosure. 5.Lift the right side of the system board (2) until it rests at an angle. Component replacement procedures 75
6.Remove the system board (3) by sliding it up and to the right at an angle. NOTE:System boards for use with computer models equipped with an AMD processor have the Southbridge chip located on the bottom of the board. A thermal pad is used on the Southbridge chip (1) and the base enclosure heat sink (2) that services it. The thermal material must be thoroughly cleaned from the surfaces of the system board and the heat sink attached to the base enclosure each time the system board is removed. Replacement thermal material is included with all base enclosure and system board spare part kits. Reverse this procedure to install the system board. 76 Chapter 4 Removal and replacement procedures
RTC battery DescriptionSpare part number RTC battery (includes cable and double-sided tape) 637193-001 Before removing the RTC battery, follow these steps: 1.Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system. 2.Disconnect all external devices connected to the computer. 3.Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the computer. 4.Remove the battery (see Battery on page 48), and then remove the following components: ●Optical drive (see Optical drive on page 49) ●Hard drive (see Hard drive on page 51) ●WLAN module (see WLAN module on page 54) ●Keyboard (see Keyboard on page 56) ●Top cover (see Top cover on page 59) ●System board (see System board on page 72) Remove the RTC battery: 1.Turn the system board upside down, with the front toward you. 2.Disconnect the RTC battery cable (1) from the system board. Component replacement procedures 77
3.Remove the RTC battery (2) from the system board. (The RTC battery is attached to the system board with double-sided tape.) Reverse this procedure to install the RTC battery. 78 Chapter 4 Removal and replacement procedures
Fan and heat sink NOTE:The fan and heat sink spare part kits include replacement thermal material. DescriptionSpare part number Fan639460-001 Heat sink for use only with computer models equipped with an AMD processor: For use only with computer models equipped with the AMD A60M chipset and a graphics subsystem with discrete video memory649953-001 For use only with computer models equipped with the AMD A60M chipset and a graphics subsystem with UMA video memory649954-001 For use only with computer models equipped with the AMD RS880MD chipset and a graphics subsystem with discrete video memory 649952-001649952-001 For use only with computer models equipped with an AMD Athlon, Phenom, Turion, or V-series processor and a graphics subsystem with discrete video memory639462-001 For use only with computer models equipped with an AMD Athlon, Phenom, Turion, or V-series processor and a graphics subsystem with UMA video memory639463-001 Heat sink for use only with computer models equipped with an Intel processor: For use only with computer models equipped with the Intel HM65 or HM55 chipset and a graphics subsystem with discrete video memory654119-001 For use only with computer models equipped with the Intel HM65 or HM55 chipset and a graphics subsystem with UMA video memory654120-001 For use only with computer models equipped with an HM65 chipset and a graphics subsystem with discrete video memory641141-001 For use only with computer models equipped with an HM65 chipset and a graphics subsystem with UMA video memory641140-001 For use only with computer models equipped with an HM55 chipset and a graphics subsystem with discrete video memory637190-001 For use only with computer models equipped with an HM55 chipset and a graphics subsystem with UMA video memory637189-001 NOTE:To properly ventilate the computer, allow at least 7.6 cm (3 in) of clearance on the left side of the computer. The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor and is designed to turn on automatically when high temperature conditions exist. These conditions are affected by high external temperatures, system power consumption, power management/battery conservation configurations, battery fast charging, and software requirements. Exhaust air is displaced through the ventilation grill located on the left side of the computer. Before removing the fan and heat sink, follow these steps: 1.Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system. 2.Disconnect all external devices connected to the computer. Component replacement procedures 79
3.Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the computer. 4.Remove the battery (see Battery on page 48), and then remove the following components: ●Optical drive (see Optical drive on page 49) ●Hard drive (see Hard drive on page 51) ●WLAN module (see WLAN module on page 54) ●Keyboard (see Keyboard on page 56) ●Top cover (see Top cover on page 59) ●System board (see System board on page 72) Remove the fan and heat sink: 1.Turn the system board upside down, with the front toward you. NOTE:Steps 2 through 4 apply to computer models equipped with an AMD processor. See steps 5 through 7 for heat sink removal information for computer models equipped with an Intel processor. 2.Disconnect the fan cable (1) from the system board. 3.Remove the three Phillips PM2.5×5.0 screws (2) and the three Phillips PM2.5×10.0 spring- loaded screws (3) that secure the heat sink to the system board. NOTE:Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach it. 4.Remove the fan and heat sink (4). 80 Chapter 4 Removal and replacement procedures
NOTE:The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. ●Thermal paste is used on the processor (1) and the heat sink section (2) that services it ●A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it ●A thermal pad is used on the graphics subsystem chip (5) and the heat sink section (6) that services it (only on computer models equipped with a graphics subsystem with discrete memory) NOTE:Steps 5 through 7 apply to computer models equipped with an Intel processor. See steps 2 through 4 for heat sink removal information for computer models equipped with an AMD processor. 5.Disconnect the fan cable (1) from the system board. Component replacement procedures 81
6.Remove the three Phillips PM2.5×5.0 screws (2) and the four Phillips PM2.5×10.0 spring-loaded screws (3) that secure the heat sink to the system board. NOTE:Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach it. 7.Remove the fan and heat sink (4). NOTE:The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. ●Thermal paste is used on the processor (1) and the heat sink section (2) that services it ●A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it (only on computer models equipped with a graphics subsystem with discrete memory) 82 Chapter 4 Removal and replacement procedures