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Dell R 420 Manual

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    							Figure 12. Inside the System—With Redundant Power Supplies
    1.power distribution board shroud
    2.cooling shroud
    3.power supply units (2)
    4.storage controller card
    5.expansion-card riser 2
    6.expansion card
    7.expansion-card riser 1
    8.heat sink for processor 2
    9.DIMMs (12)
    10.cooling fans (5)
    11.optical drive
    12.hard drives (4)
    13.control panel
    14.hard-drive backplane
    15.cable routing latch
    16.power distribution board
    41 
    						
    							Cooling Shroud
    Removing The Cooling Shroud
    CAUTION: Many repairs may only be done by a certified service technician. You should only perform 
    troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or 
    telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your 
    warranty. Read and follow the safety instructions that came with the product.
    CAUTION: Never operate your system with the cooling shroud removed. The system may get overheated quickly, 
    resulting in shutdown of the system and loss of data.
    1.Turn off the system, including any attached peripherals, and disconnect the system from the electrical outlet and  peripherals.
    2.Open the system.
    3.Hold the touch points and lift the shroud away from the fan bracket.
    Figure 13. Removing and Installing the Cooling Shroud
    1.cooling shroud
    2.cooling shroud tabs (4)
    3.cooling-fan bracket
    42 
    						
    							Installing The Cooling Shroud
    CAUTION: Many repairs may only be done by a certified service technician. You should only perform 
    troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or 
    telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your 
    warranty. Read and follow the safety instructions that came with the product.
    NOTE: For proper seating of the cooling shroud in the chassis, ensure that the cables inside the system are routed 
    through the cable routing latch.
    1.Align the cooling shroud with the numbered fan bays as a guide.
    2.Lower the cooling shroud into the chassis.
    When firmly seated, the memory socket numbers marked on the cooling shroud align with the respective memory  sockets and the four tabs on the cooling shroud rest on the cooling fan bracket.
    3.Close the system.
    4.Reconnect the system to its electrical outlet and turn the system on, including any attached peripherals.
    System Memory
    Your system supports DDR3 unbuffered ECC DIMMs (UDIMM ECC) and registered DIMMs (RDIMMs). It supports DDR3  and DDR3L voltage specifications.
    NOTE: MT/s indicates DIMM speed in MegaTransfers per second.
    Memory bus operating frequency can be 1600 MT/s, 1333 MT/s, 1066 MT/s, or 800 MT/s depending on:
    •DIMM type (UDIMM or RDIMM)
    •DIMM configuration (number of ranks)
    •maximum frequency of the DIMMs
    •number of DIMMs populated per channel
    •DIMM operating voltage
    •system profile selected (for example, Performance Optimized, Custom, or Dense Configuration Optimized)
    •maximum supported DIMM frequency of the processors
    The following table shows the memory populations and operating frequencies for the supported configurations.
    DIMM TypeDIMMs 
    Populated/
    ChannelOperating Frequency (in MT/s)Maximum DIMM Rank/ Channel1.5 V1.35 VUDIMM ECC11333, 1066, and 8001333, 1066 and 800Dual rank21333, 1066, and 8001066 and 800Dual rankRDIMM11600, 1333, 1066 and 800
    1333, 1066 and 800
    1333, 1066 and 800
    1066 and 800
    Dual rank
    Quad rank
    21600, 1333, 1066, and 800
    1066 and 800
    1333, 1066, and 800
    1066 and 800
    Dual rank
    Quad rank
    The system contains 12 memory sockets split into two sets of six sockets, one set per processor. Each six-socket set is 
    organized into three channels. In each channel, the release levers of the first socket is marked white and the second 
    black.
    43 
    						
    							NOTE: DIMMs in sockets A1 to A6 are assigned to processor 1 and DIMMs in sockets B1 to B6 are assigned to 
    processor 2.
    Figure 14. Memory Socket Locations
    Memory channels are organized as follows:
    Processor 1channel 1: memory sockets A1 and A4
    channel 2: memory sockets A2 and A5
    channel 3: memory sockets A3 and A6
    Processor 2channel 1: memory sockets B1 and B4
    channel 2: memory sockets B2 and B5
    channel 3: memory sockets B3 and B6
    44 
    						
    							General Memory Module Installation Guidelines
    This system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset 
    architectural configuration. The following are the recommended guidelines for best performance:
    •UDIMMs and RDIMMs must not be mixed.
    •x4 and x8 DRAM based DIMMs can be mixed. For more information, see Mode-Specific Guidelines.
    •A maximum of two UDIMMs can be populated in a channel.
    •A maximum of two quad-rank RDIMMs can be populated in a channel.
    •A maximum of two single- or dual-rank RDIMMs can be populated in a channel.
    •One quad-rank RDIMM and one single- or dual-rank RDIMM can be populated per channel.
    •Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A6 are 
    available. For dual-processor systems, sockets A1 to A6 and sockets B1 to B6 are available.
    •Populate all sockets with white release tabs first and then black.
    •Populate the sockets by highest rank count in the following order - first in sockets with white release levers and then  black. For example, if you want to mix quad-rank and dual-rank DIMMs, populate quad-rank DIMMs in the sockets  with white release tabs and dual-rank DIMMs in the sockets with black release tabs.
    •In a dual-processor configuration, the memory configuration for each processor must be identical. For example, if 
    you populate socket A1 for processor 1, then populate socket B1 for processor 2, and so on.
    •Memory modules of different sizes can be mixed provided that other memory population rules are followed (for  example, 2 GB and 4 GB memory modules can be mixed).
    •Depending on mode-specific guidelines, populate two or three DIMMs per processor (one DIMM per channel) at a time to maximize performance. For more information, see Mode-Specific Guidelines.
    •If memory modules with different speeds are installed, they will operate at the speed of the slowest installed memory module(s) or slower depending on system DIMM configuration.
    Mode-Specific Guidelines
    Three memory channels are allocated to each processor. The allowable configurations depend on the memory mode 
    selected.
    NOTE: x4 and x8 DRAM based DIMMs can be mixed providing support for (Reliability, Availability, and 
    Serviceability) RAS features. However, all guidelines for specific RAS features must be followed. x4 DRAM based  DIMMs retain Single Device Data Correction (SDDC) in either memory optimized (independent channel) or 
    Advanced ECC modes. x8 DRAM based DIMMs require Advanced ECC mode to gain SDDC.
    The following sections provide additional slot population guidelines for each mode.
    Advanced ECC (Lockstep)
    Advanced ECC mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects against single  DRAM chip failures during normal operation.
    Memory installation guidelines:
    •Memory sockets A1, A4, B1, and B4 are disabled and do not supported Advanced ECC mode.
    •DIMMs must be installed in matched pairs — DIMMs installed in memory sockets (A2, B2) must match DIMMs installed in memory sockets (A3, B3) and DIMMs installed in memory sockets (A5, B5) must match DIMMs installed 
    in memory sockets (A6, B6).
    NOTE: Advanced ECC with mirroring is not supported.
    45 
    						
    							Memory Optimized (Independent Channel) Mode
    This mode supports SDDC only for memory modules that use x4 device width and does not impose any specific slot population requirements.
    Memory Sparing
    NOTE: To use memory sparing, this feature must be enabled in the System Setup.
    In this mode, one rank per channel is reserved as a spare. If persistent correctable errors are detected on a rank, the 
    data from this rank is copied to the spare rank and the failed rank is disabled.
    With memory sparing enabled, the system memory available to the operating system is reduced by one rank per  channel. For example, in a system with three 8 GB dual-rank DIMMs, the available system memory is: 1/2 (ranks/
    channel) × 3 (DIMMs) × 8 GB = 12 GB, and not 3 (DIMMs) × 8 GB = 24 GB.
    NOTE: Memory sparing does not offer protection against a multi-bit uncorrectable error.
    NOTE: Both Advanced ECC/Lockstep and Optimizer modes support Memory Sparing.
    Memory Mirroring
    Memory Mirroring offers the strongest DIMM reliability mode compared to all other modes, providing improved  uncorrectable multi-bit failure protection. In a mirrored configuration, the total available system memory is one half of 
    the total installed physical memory. Half of the installed memory is used to mirror the active DIMMs. In the event of an  uncorrectable error, the system will switch over to the mirrored copy. This ensures SDDC and multi-bit protection.
    Memory installation guidelines:
    NOTE: The first memory channel for each processor (Channel 1) is disabled and not available for Memory 
    Mirroring.
    •Memory channels 2 and 3 must be populated.
    •Memory modules must be identical in size, speed, and technology.
    •DIMMs installed in memory sockets with white release tabs must be identical and similar rule applies for sockets  with black release tabs. For example, DIMMs installed in sockets A2 and A3 must be identical.
    Sample Memory Configurations
    The following tables show sample memory configurations that follow the appropriate memory guidelines stated in this 
    section.
    NOTE: 16 GB quad-rank RDIMMs are not supported.
    NOTE: 1R, 2R, and 4R in the following tables indicate single-, dual-, and quad-rank DIMMs respectively.
    Table 1. Memory Configurations — Single ProcessorSystem Capacity 
    (in GB)DIMM Size (in 
    GB)Number of 
    DIMMsOrganization and 
    SpeedDIMM Slot Population2211R x8, 1333 MT/s
    1R x8, 1600 MT/s
    A14221R x8, 1333 MT/s
    1R x8, 1600 MT/s
    A1, A210251R x8, 1333 MT/s
    1R x8, 1600 MT/s
    A1, A2, A3, A4, A512431R x8, 1333 MT/sA1, A2, A346 
    						
    							System Capacity 
    (in GB)DIMM Size (in 
    GB)Number of 
    DIMMsOrganization and 
    SpeedDIMM Slot Population1R x8, 1600 MT/s20451R x8, 1333 MT/s
    1R x8, 1600 MT/s
    A1, A2, A3, A4, A524832R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A332842R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A3, A4481632R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A3961662R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A3, A4, A5, A61283244R x4, 1066 MT/sA1, A2, A3, A41923264R x4, 1066 MT/sA1, A2, A3, A4, A5, A6Table 2. Memory Configurations — Two ProcessorsSystem Capacity (in 
    GB)DIMM Size (in 
    GB)Number of 
    DIMMsOrganization and 
    SpeedDIMM Slot Population4221R x8, 1333 MT/s
    1R x8, 1600 MT/s
    A1, B18241R x8, 1333 MT/s
    1R x8, 1600 MT/s
    A1, A2, B1, B212261R x8, 1333 MT/s
    1R x8, 1600 MT/s
    A1, A2, A3, B1, B2, B324462R x8, 1333 MT/s
    2R x8, 1600 MT/s
    A1, A2, A3, B1, B2, B348862R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A3, B1, B2, B3961662R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A3, B1, B2, B31281682R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A3, A4, B1, B2, B3, B416016102R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A3, A4, A5, B1, B2, B3, 
    B4, B519216122R x4, 1333 MT/s
    2R x4, 1600 MT/s
    A1, A2, A3, A4, A5, A6, B1, B2, 
    B3, B4, B5, B62563284R x4, 1066 MT/sA1, A2, A3, A4, B1, B2, B3, B438432124R x4, 1066 MT/sA1, A2, A3, A4, A5, A6, B1, B2, 
    B3, B4, B5, B647 
    						
    							Removing Memory Modules
    WARNING: The memory modules are hot to the touch for some time after the system has been powered down. 
    Allow time for the memory modules to cool before handling them. Handle the memory modules by the card edges 
    and avoid touching the components or metallic contacts on the memory module.
    CAUTION: Many repairs may only be done by a certified service technician. You should only perform 
    troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or 
    telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your 
    warranty. Read and follow the safety instructions that came with the product.
    CAUTION: To ensure proper system cooling, memory-module blanks must be installed in any memory socket that is 
    not occupied. Remove memory-module blanks only if you intend to install memory modules in those sockets.
    1.Turn off the system, including any attached peripherals, and disconnect the system from the electrical outlet and 
    peripherals.
    2.Open the system.
    3.Remove the cooling shroud.
    4.Locate the appropriate memory-module socket(s).
    5.To release the memory-module blank from the socket, simultaneously press the ejectors on both ends of the  memory module socket.
    CAUTION: Handle each memory module only on the card edges, making sure not to touch the middle of the 
    memory module or metallic contacts. To avoid damaging the memory module, handle only one memory 
    module at a time.
    Figure 15. Ejecting The Memory Module
    1.memory module
    2.memory-module socket ejectors (2)
    3.memory-module socket
    6.If a memory module or a memory-module blank is installed in the socket, remove it.
    NOTE: Retain removed memory-module blank(s) for future use.
    48 
    						
    							Figure 16. Removing The Memory Module
    1.memory module/memory-module blank
    7.Install the cooling shroud.
    8.Close the system.
    9.Reconnect the system to its electrical outlet and turn the system on, including any attached peripherals.
    Installing Memory Modules
    WARNING: The memory modules are hot to the touch for some time after the system has been powered down. 
    Allow time for the memory modules to cool before handling them. Handle the memory modules by the card edges 
    and avoid touching the components or metallic contacts on the memory module.
    CAUTION: Many repairs may only be done by a certified service technician. You should only perform 
    troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or 
    telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your 
    warranty. Read and follow the safety instructions that came with the product.
    CAUTION: To ensure proper system cooling, memory-module blanks must be installed in any memory socket that is 
    not occupied. Remove memory-module blanks only if you intend to install memory modules in those sockets.
    1.Turn off the system, including any attached peripherals, and disconnect the system from the electrical outlet.
    2.Open the system.
    3.If applicable, remove the cooling shroud.
    4.Locate the memory-module sockets.
    CAUTION: Handle each memory module only by the card edges, making sure not to touch the middle of the 
    memory module or metallic contacts. To avoid damaging the memory module, handle only one memory 
    module at a time.
    5.If a memory module or a memory-module blank is installed in the socket, remove it.
    NOTE: Retain removed memory-module blank(s) for future use.
    6.Align the memory-module's edge connector with the alignment key of the memory-module socket, and insert the  memory module in the socket.
    NOTE: The memory-module socket has an alignment key that allows you to install the memory module in the 
    socket in only one orientation.
    49 
    						
    							CAUTION: To prevent damage to the memory-module socket during installation, apply pressure at both ends 
    of the memory module evenly. Do not apply pressure to the center of the memory module.
    7.Press down on the memory module with your thumbs until the memory module snaps into place.
    Figure 17. Installing The Memory Module
    1.memory module
    2.memory-module ejectors
    3.memory-module socket alignment key
    4.memory-module alignment key
    NOTE: When the memory module is properly seated in the socket, the levers on the memory-module socket 
    align with the levers on the other identical sockets that have memory modules installed.
    8.Repeat step 4 through step 7 of this procedure to install the remaining memory modules.
    9.Replace the cooling shroud.
    10.Close the system.
    11.Reconnect the system to its electrical outlet and turn on the system, including any attached peripherals.
    12.Press  to enter the System Setup, and check the memory settings.
    The system should have already changed the value to reflect the newly installed memory.
    13.If the value is incorrect, one or more of the memory modules may not be installed properly. Repeat step 4 through 
    step 7 of this procedure, checking to ensure that the memory modules are firmly seated in their sockets.
    14.Run the appropriate diagnostic test. For more information, see Using System Diagnostics.
    Hard Drives
    Depending on the configuration, your system supports one of the following:
    Four hard-drive 
    systemsUp to four 3.5 inch cabled hard drives, or
    Up to four 3.5 inch hot-swappable SAS, SATA, or Nearline SAS hard drives, or
    Up to four 2.5 inch hot-swappable SAS, SATA, SAS SSD, SATA SSD, or Nearline SAS hard 
    drives
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