Samsung Exynos 5 User Manual
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Samsung Exynos 5 Dual (Exynos 5250) RISC Microprocessor Revision 1.00 October 2012 UUsseerrss MMaannuuaall 2012 Samsung Electronics Co., Ltd. All rights reserved.
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Important Notice Samsung Electronics Co. Ltd. (“Samsung”) reserves the right to make changes to the information in this publication at any time without prior notice. All information provided is for reference purpose only. Samsung assumes no responsibility for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. This publication on its own does not convey any license, either express or implied, relating to any Samsung and/or...
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Trademarks All brand names, trademarks and registered trademarks belong to their respective owners. Exynos, Exynos 5250, FlexOneNAND, and OneNAND are trademarks of Samsung Electronics. ARM, Jazelle, TrustZone, and Thumb are registered trademarks of ARM Limited. Cortex, ETM, ETB, Coresight, ISA, and Neon are trademarks of ARM Limited. Java is a trademark of Sun Microsystems, Inc. SD is a registered trademark of Toshiba Corporation. MMC and eMMC are trademarks of...
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Chip Handling Guide Precaution against Electrostatic Discharge When using semiconductor devices, ensure that the environment is protected against static electricity: 1. Wear antistatic clothes and use earth band. 2. All objects that are in direct contact with devices must be made up of materials that do not produce static electricity. 3. Ensure that the equipment and work table are earthed. 4. Use ionizer to remove electron charge. Contamination Do not use semiconductor products in...
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Revision History Revision No. Date Description Author(s) 1.00 Oct. 11, 2012 First Version for Public User Manual Haekyu Park
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Table of Contents 1 PRODUCT OVERVIEW ................................................................................. 1-1 1.1 Introduction .............................................................................................................................................. 1-1 1.2 Features ................................................................................................................................................... 1-3 1.3 Block Diagram...
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5.5 Clock Configuration Procedure .............................................................................................................. 5-23 5.5.1 Clock Gating ................................................................................................................................... 5-25 5.5.2 Clock Diving .................................................................................................................................... 5-25 5.6 Special Clock Description...
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10.3 PWM Operation.................................................................................................................................... 10-5 10.3.1 Prescaler and Divider ................................................................................................................... 10-5 10.3.2 Basic Timer Operation .................................................................................................................. 10-5 10.3.3 Auto-Reload and Double Buffering...
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13.4 I/O Description ................................................................................................................................... 13-13 13.5 Register Description ........................................................................................................................... 13-14 13.5.1 Register Map Summary .............................................................................................................. 13-14 14 SERIAL PERIPHERAL INTERFACE...
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16.7.1 Register Map Summary ................................................................................................................ 16-6
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