Motorola Two Way Portable Radio Ht1000 Mt2000 Mts2000 Mtx Series 68p81200c40 O Manual

							d. Reinstall the rubber controls top seal on the
control top.
NOTE
Two tabs are provided in the emergency button
area to help hold the seal in place.
6. Front Cover Assembly to Chassis
a. Install the contoured O-ring/antenna bushing
seal around the antenna and in the groove 
provided (see Figure 40-15).
b. Orient the front cover assembly with the chas-
sis, and insert the front cover/display flex
connector into the locking connector of the con-
troller board (refer back to Figure 40-6). Secure
the connection. View the flex connection at a
slight angle from the topof the radio and
ensure that the flex connector is fully seated
into the locking connector as described in 
step 4c.
c. Check to make sure that the O-ring is in place,
and slide the chassis (switch end first) into thefront cover assembly. Check to ensure that the
orange emergency button seal slides into posi-
tion freely.
NOTE
When performing the next part of this step, pay
particular attention to the O-ring near the bottom
of the radio to ensure that it does not raise up
and get pinched between the front cover clip and
the chassis.With the top of the chassis fully seat-
ed, lower the bottom of the chassis and press it
into the front cover assembly until it snaps into
place.
d. Check the emergency button again. If it 
is cocked to one side, repositioning it may be
necessary.
6. Reinstall the switch knobs and antenna; the shorter
knob with the volume on/off switch, the taller knob
with the channel selector switch.
7. Reinstall the battery.
22
Figure 40-14.Misaligned
Plating
Reliefs
MAEPF-22579-A
MAEPF-22580-O
Contoured O-ring/
Antenna Bushing Seal
MAEPF-22580-O
Figure 40-15. 
						

							23
A. Introduction
This section of the manual describes preventive
maintenance, safe handling of CMOS devices, and
repair procedures and techniques. Each of these topics
provides information vital to the successful operation
and maintenance of your radio.
B. Preventive Maintenance
The HT 1000, MT 2000, MTS 2000, and MTX series
radios do not require a scheduled preventive mainte-
nance program; however, periodic visual inspection and
cleaning is recommended.
1. Inspection
Check that the external surfaces of the radio are
clean, and that all external controls and switches
are functional. A detailed inspection of the interior
electronic circuitry is not needed or desired.
2. Cleaning
The following procedures describe the recommend-
ed cleaning agents and the methods to be used
when cleaning the external and internal surfaces of
the radio. External surfaces include the front cover,
chassis (rear cover), and battery case. These sur-
faces should be cleaned whenever a periodic visual
inspection reveals the presence of smudges,
grease, and/or grime. Internal surfaces should be
cleaned only when the radio is disassembled for
servicing or repair.
The only recommended agent for cleaning the
external radio surfaces is a 0.5% solution of a mild
dishwashing detergent, such as JOY
®, in water. The
only factory recommended liquid for cleaning the
printed circuit boards and their components is iso-
propyl alcohol (70% by volume).
a. Cleaning External Plastic Surfaces
(The detergent-water solution should be applied
sparingly with a stiff, non-metallic, short-bristled
brush to work all loose dirt away from the radio.
A soft, absorbent, lintless cloth or tissue should
be used to remove the solution and dry the
radio. Make sure that no water remains
entrapped near the connectors, cracks, or
crevices.
b. Cleaning Circuit Boards and Components
Isopropyl alcohol may be applied with a stiff,
non-metallic, short-bristled brush to dislodge
embedded or caked materials located in hard-to-reach areas. The brush stroke should direct
the dislodged material out and away from the
inside of the radio.
Alcohol is a high-wetting liquid and can carry
contamination into unwanted places if an
excessive quantity is used. Make sure that con-
trols or tunable components are not soaked
with the liquid. Do not use high-pressure air to
hasten the drying process, since this could
cause the liquid to puddle and collect in unwant-
ed places.
Upon completion of the cleaning process, use a
soft, absorbent, lintless cloth to dry the area. Do
not brush or apply any isopropyl alcohol to the
frame, front cover, or back cover.
NOTE
Always use a fresh supply of alcohol and a
clean container to prevent contamination by dis-
solved material (from previous usage).
C. Safe Handling of CMOS Devices
Complementary metal-oxide semiconductor
(CMOS) devices are used in this family of radios. While
the benefits of CMOS are many, their characteristics
make them susceptible to damage by electrostatic or
high voltage charges. Damage can be latent, resulting in
failures occurring weeks or months later.  Therefore, you
must take special precautions to prevent device damage
during disassembly, troubleshooting, and repair. Han-
dling precautions are mandatory for CMOS circuits, and
are especially important in low humidity conditions. DO
NOT attempt to disassemble the radio without first
referring to the CMOS CAUTION  paragraph in the Dis-
assembly and Reassembly section of the manual.
D. Repair Procedures and Techniques
Refer to the Disassembly and Reassembly section
of the manual for pertinent information prior to replacing
and substituting parts.
1. General
a. Parts Replacement and Substitution
Special care should be taken to be as certain
as possible that a suspected component is
actually the one at fault. This special care will
eliminate unnecessary unsoldering and removal
of parts, which could damage or weaken other
components or the printed circuit board itself.
When damaged parts are replaced, identical
parts should be used. If the identical replace-
ment component is not locally available, check
the parts list for the proper Motorola part num-
ber and order the component from the nearest
Motorola Communications Parts office listed in
the Replacement Parts Ordering section of
this manual.
SECTION VII. MAINTENANCE
The effects of certain chemicals and their vapors
can have harmful results on certain plastics.
Aerosol sprays, tuner cleaners, and other chemi-
cals should be avoided.!
CAUTION 
						

							24
b. Rigid Circuit Boards
This family of radios uses bonded, multi-layer,
printed circuit boards. Since the inner layers are
not accessible, some special considerations are
required when soldering and unsoldering com-
ponents. The printed-through holes may
interconnect multiple layers of the printed cir-
cuit. Therefore, care should be exercised to
avoid pulling the plated circuit out of the hole.
When soldering near the module socket pins,
use care to avoid accidentally getting solder in
the socket. Also, be careful not to form solder
bridges between the module socket pins.
Closely examine your work for shorts due to
solder bridges. When removing modules with
metal enclosures, be sure to desolder the
enclosure ground tabs as well as the module
pins.
c. Flexible Circuits
The flexible circuits are made from a different
material than the rigid boards, and different
techniques must be used when soldering.
Excessive prolonged heat on the flexible circuit
can damage the material. Avoid excessive heat
and excessive bending. For parts replacement,
use the ST-1087 Temperature-Controlled Sol-
der Station with a 600 or 700 degree tip, and
use small diameter solder such as ST-633. The
smaller size solder will melt faster and require
less heat being applied to the circuit.
To replace a component on a flexible circuit,
grasp the edge of the flexible circuit with seizers
(hemostats) near the part to be removed, and
pull gently. Apply the tip of the soldering iron to
the component connections while pulling with
the seizers. Do not attempt to puddle out com-
ponents. Prolonged application of heat may
damage the flexible circuit.
2. Specific
During all repair procedures, heating neighboring
components can be minimized by:
• using upper heat only.
• using the correct size heat-focus head, approxi-
mately the same size as the carrier being
replaced.
• keeping the heat focus head approximately 1/8”
above the printed circuit board when removing
or replacing the device.a. Strip Connector (P301/P704)
On the latest version HT 1000, MT 2000,
MTS 2000, and MTX series radios, a strip con-
nector, two female connectors and a strain relief
electrically connect the RF board with the con-
troller board. On earlier versions of these
radios, the RF board and controller board were
connected using a jumper flex that soldered
directly to the circuit board solder pads.
An interconnect kit, REX4035A, is available to
retrofit earlier version jumper-flex radios with
the later version strip connector parts. The
REX4035A kit includes the following items: 
• CONNECTOR, Female (J301) 0905461X01
• CONNECTOR, Female (J704) 0905461X01
• CONNECTOR, Male 
(P301/P704) 0905461X01
• STRAIN RELIEF 4205507X01
• INSTRUCTIONS 6880309F14
b. Jumper Flex (on radios shipped prior to 7/94)
Jumper flexes are not available.They are
replaced with connectors as described in para-
graph “a” of this section. If the jumper flex
needs to be replaced, order Interconnect Kit
REX4035A. The retrofit kit includes all of the
parts required and detailed instructions on the
removal of the old jumper flex, and the installa-
tion of the new connector arrangement.
c. RF Switch (S101):
Refer to the applicable exploded view and to
your radios RF board (antenna contact area) to
locate the RF switch components. 
NOTE
The RF switch spring and the RF switch piston
must be ordered separately.To remove the RF switch:
(1) On VHF and UHF radios, unsolder the two
tabs of the RF switch bracket that secure
the RF switch to the RF board. On 800MHz
and 900MHz radios, use a #2 slotted
screwdriver to straighten the two tabs of the
RF switch bracket that wrap around the RF
board. Use your forefinger to hold the RF
switch bracket to the RF board while
straightening the tabs to avoid lifting the
solder tabs on the opposite end of the RF
switch bracket.
If neighboring OMPAC components are heat-
ed above 365 degrees F. (185 degrees C.),
they will suffer die-bond delamination and
possible “popcorn” failure.!
CAUTION 
						

							(2) Refer to Figure 40-16 and use a small heat-
focus head to distribute heat over the area
occupied by the three solder tabs until the
solder softens.
(3) Carefully lift the RF switch assembly away
from the rf board. Notice that the RF switch
circuit board remains attached (soldered) to
the RF board.
(4) Using the same heat-focus head as in step
(3), unsolder the RF switch circuit board
and remove it from the RF board using 
forceps.
(5) In the RF switch circuit board area, reflow
all the solder pad areas on the main RF
board such that similarly shaped pads have
uniform solder heights. Add or remove sol-
der as required. Clean the RF board
thoroughly. Then swab on a minimum
amount of flux to each of the solder pads.To replace the RF switch:
(1) Place the RF switch assembly on the RF
main board and gently heat. Visually
inspect to make sure no flux migrated onto
the gold plated areas of the RF switch
board. The guide pins should provide self
alignment between the two circuit boards.
Visually inspect the plastic switch housing
to ensure that it has not warped due to
overheating.
(2) While holding the RF switch bracket firmly
against the RF board:
• VHF and UHF radios - solder the two
leads of the housing to the solder pads
on the RF board.
• 800MHZ and 900MHz radios - bend the
two tabs around the side of the RF
board as close to the board edge as
possible to hold the bracket down
tightly.(3) Insert the new RF switch spring and RF
switch piston into the RF switch assembly.
The contacts of the piston should be facing
the gold-plated pads of the RF switch
board. Once the spring and piston are
inserted into the RF switch, they will be
retained by the switch.
d. Chip Components
Use either the RLN-4062 Hot-Air Repair Station
or the Motorola 0180381B45 Repair Station for
chip component replacement. When using the
0180381B45 Repair Station, select the TJ-65
mini-thermojet hand piece. On either unit, adjust
the temperature control to 700 degrees F. (370
degrees C), and adjust the airflow to a minimum
setting. Airflow can vary due to component den-
sity.
(1)To remove a chip component, select a
hot- air hand piece and position the nozzle
of the hand piece approximately 1/8”
(0.3cm) above the component to be
removed. Begin applying the hot air. Once
the solder reflows, remove the component
using a pair of tweezers. Using solder wick
and a soldering iron or a power desoldering
station, remove the excess solder from the
pads.
(2)To replace a chip component using a
soldering iron, select the appropriate
micro-tipped soldering iron and apply fresh
solder to one of the solder pads. Using a
pair of tweezers, position the new chip
component in place while heating the fresh
solder. Once solder wicks onto the new
component, remove the heat from the sol-
der. Heat the remaining pad with the
soldering iron and apply solder until it wicks
to the component. If necessary, touch up
the first side. All solder joints should be
smooth and shiny.
(3)To replace a chip component using hot
air, select the hot-air hand piece and reflow
the solder on the solder pads to smooth it.
Apply a drop of solder paste flux to each
pad. Using a pair of tweezers, position the
new component in place. Position the hot-
air hand piece approximately 1/8” (0.3cm)
above the component and begin applying
heat. Once the solder wicks to the compo-
nent, remove the heat and inspect the
repair. All joints should be smooth and
shiny.
25
3 Solder
TabsFigure 40-16. 
						

							e. Over-Molded Pad-Array Carrier (OMPAC)
During all repair procedures, heating neighbor-
ing components can be minimized by:
• using upper heat only.
• using the correct size heat-focus head,
approximately the same size as the carrier
being replaced.
• keeping the heat focus head approximately
1/8”-1/4” (0.3cm-0.6cm) above the printed
circuit board when removing or replacing
the device.
(1)To remove an OMPAC, select the R-1319
Rework Station and the appropriate heat-
focus head (approximately the same size
as the OMPAC. Attach the heat-focus head
to the chimney heater. Adjust the tempera-
ture control to approximately 415 degrees F
(215 degrees C); 445 degrees F (230
degrees C) maximum. Apply the solder
paste flux around the edge of the OMPAC.
Place the circuit board in the circuit board
holder, and position the OMPAC under the
heat-focus head. Lower the vacuum tip and
attach it to the OMPAC by turning on the
vacuum pump. Lower the heat-focus head
until it is approximately 1/8”-1/4” (0.3cm-
0.6cm) above the carrier. Turn on the
heater and wait until the OMPAC lifts off the
circuit board. Once the part is off, grab it
with a pair of tweezers and turn off the vac-
uum pump. Remove the circuit board from
the R-1070’s circuit board holder.(2)To replace an OMPAC, the solder pads on
the board must first be cleaned of all solder
to ensure alignment of the new chip carrier.
Prepare the site by using solder wick and a
soldering iron to remove all solder from the
solder pads on the circuit board. If a power
desoldering tool is available, it can be used
instead of the solder wick. Clean the solder
pads with alcohol and a small brush. Dry
and inspect. Ensure that all solder is
removed.
Once the preparation is complete, place the
circuit board back in the circuit board hold-
er. Add solder paste flux in the trench of the
flux block and spread it using a one-inch
putty knife. Flux the OMPAC by placing it in
the trench of the flux block. Once the flux is
applied, place the OMPAC on the circuit
board, making certain that it is oriented cor-
rectly on the board. Position the heat-focus
head over the OMPAC and lower it to
approximately 1/8”-1/4” (0.3cm-0.6cm) over
the carrier. Using the same heat setting
used to remove the OMPAC, turn on the
heater and wait for the carrier to reflow
(heating and reflow should take longer than
60 seconds).
Watch the OMPAC reflow
and note that when a proper reflow has
taken place, the OMPAC will drop (usually
one side, then the other). The end result is
that both sides have reflowed, and the
OMPAC is sitting parallel to the circuit
board.
Once the carrier reflows, raise the heat-
focus head and wait approximately one
minute for the part to cool. Remove the cir-
cuit board and inspect the repair. No
cleaning should be necessary.
26
If neighboring OMPAC components are
heated above 365 degrees F. (185 degrees
C.), they will suffer die-bond delamination and
possible “popcorn” failure.All pad-array carriers in these radios, except
for the IF IC (U3), are OMPAC. Prior to use,
all OMPACs must be kept in the sealed bag
(with moisture-indicator card) as supplied by
the Motorola Parts Department.  Once the
sealed bag is opened and/or the OMPAC
subjected to ambient humidity (for an
unknown amount of time or for more than 96
hours) then that OMPAC must be baked in
an oven for at least eight hours at 260
degrees F. (125 degrees C.)!
CAUTIONCAUTION
!
CAUTION
The application of heat to the OMPAC
device, beginning at ambient air tem-
perature and ending with the OMPAC
lifting from the circuit board, should
take longer than 60 seconds. If the
OMPAC lifts from the circuit board
earlier than 60 seconds:
• check the temperature control set-
ting on the rework station, and 
if OK 
• lift the heat-focus head an addition-
al 1/8” from nominal setting, and
• check the circuit board plating for
possible damage.! 
						

							f. Thin Small Outline Package (TSOP) 
Components
Removing and replacing a TSOP component
will be done with the R-1319, using the same
procedure used to remove and replace an
OMPAC.
Place the circuit board in the circuit board hold-
er. Select the proper heat focus head and
attach it to the heater chimney. Position the
TSOP component under the heat-focus head.
Lower the vacuum tip and attach it to the com-
ponent by turning on the vacuum pump. Lower
the focus head until it is approximately 1/8”-1/4”
(0.3cm-0.6cm) above the component. Turn on
the heater and wait until the TSOP lifts off the
circuit board.
Once the part is off, turn off the heat, grab the
part with a pair of tweezers, and turn off the
vacuum pump. Prepare the circuit board for the
new component by applying solder paste flux to
the solder pads. Position the circuit board under
the heat-focus head, lower the head to approxi-
mately 1/8”-1/4” (0.3cm-0.6cm) above the
board, and turn on the heat. When the solder
left behind on the pads reflows, turn off the heat
and raise the heat-focus head. Remove the cir-
cuit board from the holder and inspect the pads
to ensure that the solder has flattened out and
that there are no solder shorts. Clean the area
with alcohol and a small brush.
Once the preparation is complete, place the cir-
cuit board back in the circuit board holder. Add
solder paste flux to the solder pads and place
the new component on the circuit board. Posi-
tion the heat-focus head over the component
and lower it to approximately 1/8”-1/4” (0.3cm-
0.6cm) above the carrier. Turn on the heater
and wait for the component to reflow.
Once the component reflows, raise the heat-
focus head and wait approximately one minute
for the part to cool. Remove the circuit board
and inspect the repair. No cleaning should be
necessary.
g. Shields
Removing and replacing the shields will be
done with the R-1319, using the same proce-
dure used to remove and replace TSOP and
OMPAC components.
Place the circuit board in the circuit board hold-
er. Select the proper heat focus head and
attach it to the heater chimney. Add solder
paste flux around the base of the shield. Posi-
tion the shield under the heat-focus head.
Lower the vacuum tip and attach it to the shield
by turning on the vacuum pump. Lower thefocus head until it is approximately 1/8”-1/4”
(0.3cm-0.6cm) above the shield. Turn on the
heater and wait until the shield lifts off the circuit
board. Once the shield is off, turn off the heat,
grab the part with a pair of tweezers, and turn
off the vacuum pump. Remove the circuit board
from the circuit board holder.
To replace the shield, add solder to the shield
if necessary, using a micro-tipped soldering
iron. Next, rub the soldering iron tip along the
edge of the shield to smooth out any excess
solder. Use solder wick and a soldering iron to
remove excess solder from the solder pads on
the circuit board. Place the circuit board back in
the circuit board holder.  Place the shield on the
circuit board using a pair of tweezers. Position
the heat-focus head over the shield and lower it
to approximately 1/8”-1/4” (0.3cm-0.6cm) above
the shield. Turn on the heater and wait for the
solder to reflow.
Once complete, turn off the heat, raise the heat-
focus head, and wait approximately one minute
for the part to cool. Remove the circuit board
and inspect the repair. No cleaning should be
necessary.
h.  RF PA (U105)
The procedure for removing and replacing the
RF PA is very similar to the procedure for
removing and replacing an OMPAC or a TSOP
component. But because the the device is
large, extra heating time is required to flow the
pads. And as a result, neighboring components
(especially those on the opposite side of the cir-
cuit board) will heat, reflow, and may
inadvertently move. Be careful when performing
the following procedure.
(1) Refer to Figure 40-17 for 
RF PA nomenclature.
To remove the RF PA, add flux to the
leads of the device, and use a soldering
iron and pair of tweezers to heat and lift
each lead free and clear of its respective
solder pad on the circuit board. Use the 
R-1319 Rework Station and the heat- focus
head designed especially for removal of the
RF PA. Attach the heat-focus head to the
chimney heater. Adjust the temperature
control to approximately 415 degrees F
27
PA Cover
LeadsSlab
Solder
PadsFigure 40-17. 
						

							(215 degrees C) 445 degrees F (230
degrees C) maximum. Apply solder paste
to the exposed solder pads under the PA.
Place the circuit board in the circuit board
holder, and position the RF PA under the
heat-focus head. Lower the heat-focus
head until it is approximately 1/8”-1/4”
(0.3cm-0.6cm) above the PA cover. Turn
on the heater and begin the reflow cycle.
Heating time should not be less than two
minutes.
Once the part has reflowed, before trying to
remove the PA, carefully lower the circuit
board holder as follows:
• Loosen the thumbscrew on the shaft of
the circuit  board holder,
• push the spring-loaded holder down and
away from the heat-focus head, and 
• retighten the thumbscrew with the holder
in the bottomed position. 
Grab the PA with a large pair of tweezers
and remove it from the circuit board. Let the
circuit board cool for approximately two
minutes. Then remove the circuit board
from the circuit board holder.
(2)To replace the RF PA; if necessary, add
solder to the PA ground plane on the print-
ed circuit board. Then clean each PA leadsolder pad on the circuit board to ensure
alignment of the new RF PA. Prepare the
sight by using solder wick and a soldering
iron to remove all solder from the solder
pads. Clean the solder pads with alcohol
and a small brush. Dry and inspect. Ensure
that all solder is removed.
Once the preparation is complete, place the
circuit board back in the circuit board hold-
er. Add solder paste flux to the ground
plane and to the leads’ solder pads. Once
the flux is applied, place the new RF PA on
the circuit board, making certain that the PA
heatsink sits flush on the board. Position
the heat-focus head over the RF PA and
lower it to approximately 1/8”-1/4” (0.3cm-
0.6cm)) above the PA cover. Turn on the
heater and begin the reflow cycle. Heating
time should not be less than two minutes.
Once the RF PA reflows, raise the heat-
focus head and wait approximately two
minute for the part to cool. Remove the cir-
cuit board and inspect the solder joint
between the slab and the ground plane. No
cleaning should be necessary. Use the sol-
dering iron and add solder to each of the
RF PA leads and associated pads. Inspect
the lead/pad bond for opens and solder
shorts.
28 
						

							SCHEMATIC AND CIRCUIT BOARD NOTES
* COMPONENT IS FREQUENCY SENSITIVE. REFER TO 
THE ELECTRICAL PARTS LIST FOR VALUE AND
USAGE.
1.  UNLESS OTHERWISE STATED, RESISTANCES ARE IN OHMS (k = 1000), AND CAPACITANCES ARE IN 
PICOFARADS (pF) OR  MICROFARADS (uF).
2.  DC VOLTAGES ARE MEASURED FROM POINT INDICATED TO CHASSIS GROUND USING A
MOTOROLA DC MULTIMETER OR EQUIVALENT.
TRANSMITTER MEASUREMENTS SHOULD BE MADE 
WITH A 1.2 uF CHOKE IN SERIES WITH THE 
VOLTAGE PROBE TO PREVENT CIRCUIT LOADING.
3.  REFERENCE DESIGNATORS ARE ASSIGNED IN THE FOLLOWING MANNER:
UNITS SERIES = RECEIVER
100 SERIES = TRANSMITTER
200 SERIES = FREQUENCY GENERATION
300 SERIES = MISCELLANEOUS
400 SERIES = HOUSING/ESCUTCHEON
500 SERIES = DISPLAY 
600 SERIES =  HEAR CLEAR OPTION
700 SERIES = CONTROLLER
4.  INTERCONNECT TIE POINT LEGEND: 5V REG = REGULATED FIVE VOLTS
B+ = BATTERY VOLTAGE (7.5V)
R5 = RECEIVER FIVE VOLTS
T5 = TRANSMITTER FIVE VOLTS
CLK = CLOCK
D = DATA
DAC = DIGITAL TO ANALOG  CONVERTER
DAC RST = DAC RESET
LCK = LOCK
NC = NO CONNECTION
SYN = SYNTHESIZER
VR = VOLTAGE REGULATOR
INSERT DIAGRAMS
(L1) BEPF-24631-O (20% BLK, 133 LINE) (OL) BEPF-24632-O (100% BLK.) R.T. 50%
INSERT DIAGRAMS
(L8) BEPF-24633-O (20% BLK., 133 LINE) (OL) BEPF-24634-O (100% BLK.) R.T. 50%
W26Xf@?g@?e@?e@??@@@@@?@@@@6X?fW2@6X?@??@@@@6X??W2@6X?@f@??@?@@@@@f?@@@6\
XeW2@6X?f@??@@@@6X??@@@6Xf?@@@6Xe?@@@@@?@@@@@f@??@e?@g?@e?@?@e?@@@@@?@e?@e?@@??)X?e@??W2@6X 
7
						

							NUD7070A, NUD7070B, NUD7085A, AND NUD7085B  VHF TRANSCEIVER BOARDS’ P\
ARTS LIST, AND 
NUE7213A, NUE7213B, NUE7231B, NUE7240A, AND NUE7240B UHF (403-470MHz) \
30 TRANSCEIVER BOARDS’ COMPONENT LOCATION DIAGRAMS
INSERT DIAGRAMS
(L1) BEPF-24636-O (20% BLK, 133 LINE) (OL) BEPF-24637-O (100% BLK.) R.T. 50%
INSERT DIAGRAMS
(L6) BEPF-24638-O (20% BLK., 133 LINE) (OL) BEPF-24639-O (100% BLK.) R.T. 50%
CAPACITOR, Fixed: pF ±5%; 
50V unless stated
C4 2113741F13 330
C6 2113740F22 6.2 ± 0.25pF
C7 2113740F13 2.7 ± 0.25pF
C8 2113740F32 16
C9 - - - - - - - - -  Not Placed
C11 2113741F49 .01µF
C12 - - - - - - - - -  Not Placed
C13 2113741F49 .01µF
C14 2311049A66 22µF; 4V
C15 2113741F49 .01µF
C16 2113740F20 5.1 ± 0.25pF
C31 2113741F49 .01µF
C33 2113740F26 9.1
C34 2113740F43 47
C35 2113740F40 36
C36 2113740F19 0.47µF; ±0.25pF
C38 2113740F17 3.9µFl ±0.25pF
C39 0662057B47 0
C40 2113740F51 100
C41 2113743A19 0.1µF
C42 thru 46 2113743A23 0.22µF
C47 2109720D14 0.1µF
C48 2113741F16 430
C49 2113743A19 0.1µF
C50 2113743K15 0.1µF
C52 2113741A51 0.18µF
C53 2113743B17 0.15µF
C54 2113741F13 330
C55 2113740F37 27
C56, 57 2113740F42 43
C58 2113740F11 2.2
C60 2113743K15 0.1µF
C61 2109720D14 0.1uF
C62 2113741F49 .01µF
C63 2113743K15 0.1µF
C65 2113741F49 .01µF
C70 2113741F49 .01µF
C71 thru 72 2113741F13 330
C77 2113743K15 0.1µF
C80 2113740F39 33
C82 thru 84 2113741F49 .01µF
C85 2311049A60 10µF; 4V
C86 2113740F22 6.2 ± 0.25pF
C87 2113740F32 16
C88 2113740F25 8.2 ± 0.25pF
C90 2113740F18 4.3 ±0.25pF
C95 2113740F33 18
C96 2113741F49 .01µF
C97 2113740A32 13
C98 2113741F13 330
C99 2113740F39 33
C101 2113743K15 0.1µF
C102 2113741F13 330
C103 2311049J26 10µF; 16V
C104 2311049A54 3.3µF; 16V
C105 2113741F13 330
C106 2311049J26 10µF; 16V
C107, 108 2113741F13 330
C109 2311049A07 1µF; 16V
C111 2113741F13 330
C112 - - - - - - - - - Not Placed
C113 2113741F13 330
C115 2113743K03 .033µF
C116 2113740F03 1.0±0.1pF
C118 2113743K15 0.1µF
C121 2113741F13 330
C123 2113743K15 0.1µF
C125, 126 2311049A54 3.3µF; 16V
C128 2311049A07 1µF; 16V
C129 2113740F03 1
C130 2113740F28 11
C132 2113740F38 30
C133, 135 2113741F13 330
C139 - - - - - - - - - Not Placed
C140, 141, 146 2113741F13 330
C147 2113743E07 .022µF
C148 2113740F20 5.1 ± 0.25pF
C149, 150 2113740F34 20
C151 2113740F27 10
C152 2113741F13 330 
C153 2113741F13 330
C154 2113741F13 330
C161 2113743K15 0.1µF
C162 2113741F13 330
C163 2113740F44 51
C164 2113740F51 100
C165 2311049A86 1.0µF; 10V
C202 2113740F27 10
C203 2113740F20 5.1 ± 0.25pF
C204 2113741F13 330
C205 2113740F14 3.0 ± 0.25pF
C206 2113741F20 620
C207 2113740F03 1.0 ± 0.1pF
C208 2113740F22 6.2 ± 0.25pF
C209 2113743K15 0.1µF
C210 2113743E07 .022µF
C211 2113741F13 330
C212 - - - - - - - - - Not Placed
C213 2113740F21 5.6 ± 0.25pF
C214 - - - - - - - - - Not Placed
C219 2113740F27 10
C220 2113740F31 15
C221 2113741F13 330
C222 2113740F24 7.5 ± 0.25pF
C223 2113906C02 ATC, 4pF
C225 2113740F08 1.6 ± 0.1pF
C226 2113740F46 62
C227, 228 2113741F13 330
C230 2113740F19 4.7 ± 0.25pF
C231 2311049A60 10µF; 4V
C233 2113741F13 330
C235 2113740F31 15
C236 2113740F27 10
C237 2113740F30 13
C238 2113741F25 .001µF
C240 2113906C02 ATC, 4pF
C241, 243 2113740F38 30
C244 2109720D09 .022µF 
C245 2113741F25 .001µF
C246 2109720D09 .022µF 
C247 2311049A07 1µF; 16V
C248 2113743K15 0.1µF
C250 2113741F25 .001µF
C251, 252 2113741F13 330
C253 2311049J23 10µF; 6V
C254 2311049A56 4.7µF; 10V
C255 2113741F25 .001µF
C256, 257 2113741F49 .01µF
C258 2311049J11 4.7µF; 16V
C259 2113743A23 0.22µF
C260 2113743K05 .039µF
C266, 267 2113741F49 .01µF
C270 2113741F25 .001µF
C271 2311049A56 4.7µF; 10V
C274 2113741F49 .01µF
C277 2113741F13 330
C280 2113740F51 100
C285, 286 2113741F13 330
C287 2113740F14 3.0 ± 0.25pF
C288 2113741F13 330
C291, 292 2113743E07 .022µF
C293 - - - - - - - - -  Not Placed
C294 2113741F13 330
C303 2113743E07 .022µF
C304 2113741F13 330
C305 thru 308 2113740F51 100
C309 2113741F37 .0033µF
C310 2113741F13 330
C311 2113741F37 .0033µF
C313, 314 - - - - - - - - -  Not Placed
C315 2113741F13 330
DIODE:
CR1 thru 9 4862824C01 Varactor
CR11 4805129M96 PIN
CR12 4805218N57 Dual
CR102, 103 4805129M67 Dual 
CR108, 109 4802482J02 PIN
CR201 4805649Q10 Varactor
CR202, 203 4805649Q08 Varactor
CR204, 205 4802233J09 Triple 
CR206 4805129M06 Dual 
CORE:
E101 2484657R01 Bead, Ferrite 
F1 6505757V01 FUSE: 1-Amp.FILTER:
FL1 4802655J05 Crystal, 44.85 MHz
JACK:
J301 - - - - - - - - -  Circuit plating on NUD7070A  and NUD7085A; 20 contacts;   
to P301 on Jumper Flex
or 0905461X01 Connector on NUD7070B  and NUD7085B; 20 contacts;  
to P301 Strip Connector
J401 3905264W01 Contact, Antenna and 3905643V01 Contact, Antenna Ground
COIL, RF:
L3 2462587T42 .047µH
L4 2462587T41 .039µH
L5 2462587T42 .047µH
L6 2462587T13 .068µH
L7 2462587T16 0.12µH
L8 2462587T17 0.15µH
L9 2462587T15 0.1µH
L10 2462587T12 .056µH
L11 2460591M12 4 turns, airwound
L12 2462587T23 0.47µH
L13, 14 2460591N36 5 turns, airwound
L16 2460591M12 4 turns, airwound
L19 2462587T20 0.27µH
L20 2462587N69 1.2µH
L22 2462587T30 1µH
L23 2462587Q50 1.8µH
L24 2462587T23 0.47µH
L25 2462587Q20 2.2µH
L30 2462575A21 .047µH
L32, 33 2462587Q20 2.2µH
L101 2462587T30 1µH
L105 2462587T30 1µH
L121, 122 2462587T30 1µH
L126 2460591K40 12 turns, airwound
L127 2460591G24 9 turns, airwound
L128 2460591K40 12 turns, airwound
L130, 131 2462587T30 1µH
L201 2462587T40 .033µH
L204 2462587T30 1µH
L205 2462587S28 .033µH
L208, 209 2462587T30 1µH
L210 2462587T39 .027µH
L211 2462587T12 .056µH
L212 2462587T15 0.1µH
L213, 215 2462587T30 1µH
L216 2462587T41 .039µH
L217, 218 2462587T30 1µH
L219 2462587T38 .022µH
L220 2462587T17 0.15µH
L221, 222 2462587Q42 0.39µH
L223 2462587T18 0.18µH
L225 2462587Q20 2.2µH
L301, 302 2462587Q47 1µH
PLUG:
P402 - - - - - - - - - Contact, External Antenna; part of RF switch S101
P404 3905861X02 Connector, Battery; 2-pin
TRANSISTOR:
Q1, 4 4805218N63 NPN
Q101 4805128M16 PNP
Q104, 105, 107 4805921T02 PNP NPN
Q108 4802245J10 NPN Dual
Q110 4813822A10 PNP
Q201 4802245J15 JFET
Q202 4805218N55 NPN
RESISTOR, Fixed: ½±5%
.0625W unless stated
R1 0662057A01 10
R2 0662057A91 56k
R4, 5 0662057A73 10k
R7 0662057A25 100
R8 0662057A41 470
R16 0662057A59 2.7k
R17 0662057A80 20k
R32, 33 0662057A59 2.7k
R34. 35 0662057A89 47k
R40 0662057A35 270
R41 0662057A09 22
R42 0662057A35 270
R43 0662057A42 510
R44 0662057A77 15k
R45 0660257B47 0R46 0662057A89 47k 
R47 0662057A09 22
R49 0662057A53 1.5k
R50 0662057A63 3.9k
R51 0662057B05 200k
R70 0662057A53 1.5k
R72 0662057A25 100
R73 0662057A73 10k
R101 0662057C01 0
R102 0662057A65 4.7k
R106 0662057A61 3.3k
R110 0662057A57 2.2k
R111 0662057A67 5.6k
R112 0662057B22 1 M
R113 0662057A73 10k
R114 0662057A77 15k
R115 0660078L28 180k ± 1%
R116 0662057G19 130k ± 1%; 0.1W
R117 0662057A89 47k
R126 0662057A18 51
R127 0662057A15 39
R130 0662057A65 4.7k
R131, 132 0662057A97 100k
R199 0660257B47 0; used in place of S101 in  NUD7085A and NUD7085B
or - - - - - - - - - Not Used, replaced with S101  in NUD7070A and NUD7070B
R203 0662057A09 22
R204 0662057A80 20k
R205 0662057A84 30k
R206, 207 0662057A80 20k
R208 0662057A62 3.6k
R209, 210 0662057A42 510
R211 0662057A20 62
R212 0662057A44 620
R213 0662057A41 470
R214 0662057A88 43k
R215 0662057A84 30k
R217 0662057A84 30k
R218 0662057A97 100k
R219 0662057A09 22
R220, 221 0662057A56 2k
R222 0662057A51 1.2k
R223 0662057A89 47k
THERMISTOR:
RT101 0605621T02 Thermistor, 50k
SWITCH:
S101 4005831W01 RF; used on NUD7070A and  NUD7070B
or - - - - - - - - - Not Used, replaced with R199  on NUD7085A and
NUD7085B
TRANSFORMER:
T1 2505515V08 Balun; 4:1
T2 2505515V11 Balun; 16:1
MODULES:
U1 5105329V20 RF Amp
U2 5105329V26 Mixer
U3 5105457W11 IF
U101 5105662U72 TX ALC
U102 5105662U70 D/A
U103 5160880B02 5V Regulator
U104 5102001J69 Stripline Coupler
U105 5105625U03 5-Watt PA
U201 5105662U78 VCO
U202 5105469E65 5V Regulator
U203 5105279V39 Ref. Oscillator, 16.8 MHz
U204 5105625U31 SynthesizerElectrical Parts List, VHF Transceiver Boards; VHF 
NUD7070A, NUD7070B
NUD7085A, NUD7085B
TPLF- 4072-C
REFERENCE MOTOROLA SYMBOL PART NO. DESCRIPTION
Note:   Not Placed means that components are for future use, and are not
placed on the circuit board at this time. 
						

							NUE7213A, NUE7213B, NUE7231A, NUE7231B, NUE7240A, AND NUE7240B 
UHF (403-470MHz) TRANSCEIVER BOARDS’ SCHEMATIC DIAGRAM
31
INSERT SCHEMATIC
63D81200C32-O (100% BLK.)
(OL) DEPF-24640-O (100% RED)
SHOOT AT 100%