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Motorola Two Way Portable Radio Ht1000 Mt2000 Mts2000 Mtx Series 68p81200c40 O Manual
Motorola Two Way Portable Radio Ht1000 Mt2000 Mts2000 Mtx Series 68p81200c40 O Manual
Here you can view all the pages of manual Motorola Two Way Portable Radio Ht1000 Mt2000 Mts2000 Mtx Series 68p81200c40 O Manual. The Motorola manuals for Portable Radio are available online for free. You can easily download all the documents as PDF.
Page 31
d. Reinstall the rubber controls top seal on the control top. NOTE Two tabs are provided in the emergency button area to help hold the seal in place. 6. Front Cover Assembly to Chassis a. Install the contoured O-ring/antenna bushing seal around the antenna and in the groove provided (see Figure 40-15). b. Orient the front cover assembly with the chas- sis, and insert the front cover/display flex connector into the locking connector of the con- troller board (refer back to Figure 40-6). Secure the...
Page 32
23 A. Introduction This section of the manual describes preventive maintenance, safe handling of CMOS devices, and repair procedures and techniques. Each of these topics provides information vital to the successful operation and maintenance of your radio. B. Preventive Maintenance The HT 1000, MT 2000, MTS 2000, and MTX series radios do not require a scheduled preventive mainte- nance program; however, periodic visual inspection and cleaning is recommended. 1. Inspection Check that the external surfaces...
Page 33
24 b. Rigid Circuit Boards This family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are not accessible, some special considerations are required when soldering and unsoldering com- ponents. The printed-through holes may interconnect multiple layers of the printed cir- cuit. Therefore, care should be exercised to avoid pulling the plated circuit out of the hole. When soldering near the module socket pins, use care to avoid accidentally getting solder in the socket....
Page 34
(2) Refer to Figure 40-16 and use a small heat- focus head to distribute heat over the area occupied by the three solder tabs until the solder softens. (3) Carefully lift the RF switch assembly away from the rf board. Notice that the RF switch circuit board remains attached (soldered) to the RF board. (4) Using the same heat-focus head as in step (3), unsolder the RF switch circuit board and remove it from the RF board using forceps. (5) In the RF switch circuit board area, reflow all the solder pad...
Page 35
e. Over-Molded Pad-Array Carrier (OMPAC) During all repair procedures, heating neighbor- ing components can be minimized by: • using upper heat only. • using the correct size heat-focus head, approximately the same size as the carrier being replaced. • keeping the heat focus head approximately 1/8”-1/4” (0.3cm-0.6cm) above the printed circuit board when removing or replacing the device. (1)To remove an OMPAC, select the R-1319 Rework Station and the appropriate heat- focus head (approximately the same...
Page 36
f. Thin Small Outline Package (TSOP) Components Removing and replacing a TSOP component will be done with the R-1319, using the same procedure used to remove and replace an OMPAC. Place the circuit board in the circuit board hold- er. Select the proper heat focus head and attach it to the heater chimney. Position the TSOP component under the heat-focus head. Lower the vacuum tip and attach it to the com- ponent by turning on the vacuum pump. Lower the focus head until it is approximately 1/8”-1/4”...
Page 37
(215 degrees C) 445 degrees F (230 degrees C) maximum. Apply solder paste to the exposed solder pads under the PA. Place the circuit board in the circuit board holder, and position the RF PA under the heat-focus head. Lower the heat-focus head until it is approximately 1/8”-1/4” (0.3cm-0.6cm) above the PA cover. Turn on the heater and begin the reflow cycle. Heating time should not be less than two minutes. Once the part has reflowed, before trying to remove the PA, carefully lower the circuit board...
Page 38
SCHEMATIC AND CIRCUIT BOARD NOTES * COMPONENT IS FREQUENCY SENSITIVE. REFER TO THE ELECTRICAL PARTS LIST FOR VALUE AND USAGE. 1. UNLESS OTHERWISE STATED, RESISTANCES ARE IN OHMS (k = 1000), AND CAPACITANCES ARE IN PICOFARADS (pF) OR MICROFARADS (uF). 2. DC VOLTAGES ARE MEASURED FROM POINT INDICATED TO CHASSIS GROUND USING A MOTOROLA DC MULTIMETER OR EQUIVALENT. TRANSMITTER MEASUREMENTS SHOULD BE MADE WITH A 1.2 uF CHOKE IN SERIES WITH THE VOLTAGE PROBE TO PREVENT CIRCUIT LOADING. 3. REFERENCE...
Page 39
NUD7070A, NUD7070B, NUD7085A, AND NUD7085B VHF TRANSCEIVER BOARDS’ P\ ARTS LIST, AND NUE7213A, NUE7213B, NUE7231B, NUE7240A, AND NUE7240B UHF (403-470MHz) \ 30 TRANSCEIVER BOARDS’ COMPONENT LOCATION DIAGRAMS INSERT DIAGRAMS (L1) BEPF-24636-O (20% BLK, 133 LINE) (OL) BEPF-24637-O (100% BLK.) R.T. 50% INSERT DIAGRAMS (L6) BEPF-24638-O (20% BLK., 133 LINE) (OL) BEPF-24639-O (100% BLK.) R.T. 50% CAPACITOR, Fixed: pF ±5%; 50V unless stated C4 2113741F13 330 C6 2113740F22 6.2 ± 0.25pF C7 2113740F13 2.7 ±...
Page 40
NUE7213A, NUE7213B, NUE7231A, NUE7231B, NUE7240A, AND NUE7240B UHF (403-470MHz) TRANSCEIVER BOARDS’ SCHEMATIC DIAGRAM 31 INSERT SCHEMATIC 63D81200C32-O (100% BLK.) (OL) DEPF-24640-O (100% RED) SHOOT AT 100%