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Motorola Two Way Portable Radio Ht1000 Mt2000 Mts2000 Mtx Series 68p81200c40 O Manual

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Page 31

d. Reinstall the rubber controls top seal on the
control top.
NOTE
Two tabs are provided in the emergency button
area to help hold the seal in place.
6. Front Cover Assembly to Chassis
a. Install the contoured O-ring/antenna bushing
seal around the antenna and in the groove 
provided (see Figure 40-15).
b. Orient the front cover assembly with the chas-
sis, and insert the front cover/display flex
connector into the locking connector of the con-
troller board (refer back to Figure 40-6). Secure
the...

Page 32

23
A. Introduction
This section of the manual describes preventive
maintenance, safe handling of CMOS devices, and
repair procedures and techniques. Each of these topics
provides information vital to the successful operation
and maintenance of your radio.
B. Preventive Maintenance
The HT 1000, MT 2000, MTS 2000, and MTX series
radios do not require a scheduled preventive mainte-
nance program; however, periodic visual inspection and
cleaning is recommended.
1. Inspection
Check that the external surfaces...

Page 33

24
b. Rigid Circuit Boards
This family of radios uses bonded, multi-layer,
printed circuit boards. Since the inner layers are
not accessible, some special considerations are
required when soldering and unsoldering com-
ponents. The printed-through holes may
interconnect multiple layers of the printed cir-
cuit. Therefore, care should be exercised to
avoid pulling the plated circuit out of the hole.
When soldering near the module socket pins,
use care to avoid accidentally getting solder in
the socket....

Page 34

(2) Refer to Figure 40-16 and use a small heat-
focus head to distribute heat over the area
occupied by the three solder tabs until the
solder softens.
(3) Carefully lift the RF switch assembly away
from the rf board. Notice that the RF switch
circuit board remains attached (soldered) to
the RF board.
(4) Using the same heat-focus head as in step
(3), unsolder the RF switch circuit board
and remove it from the RF board using 
forceps.
(5) In the RF switch circuit board area, reflow
all the solder pad...

Page 35

e. Over-Molded Pad-Array Carrier (OMPAC)
During all repair procedures, heating neighbor-
ing components can be minimized by:
• using upper heat only.
• using the correct size heat-focus head,
approximately the same size as the carrier
being replaced.
• keeping the heat focus head approximately
1/8”-1/4” (0.3cm-0.6cm) above the printed
circuit board when removing or replacing
the device.
(1)To remove an OMPAC, select the R-1319
Rework Station and the appropriate heat-
focus head (approximately the same...

Page 36

f. Thin Small Outline Package (TSOP) 
Components
Removing and replacing a TSOP component
will be done with the R-1319, using the same
procedure used to remove and replace an
OMPAC.
Place the circuit board in the circuit board hold-
er. Select the proper heat focus head and
attach it to the heater chimney. Position the
TSOP component under the heat-focus head.
Lower the vacuum tip and attach it to the com-
ponent by turning on the vacuum pump. Lower
the focus head until it is approximately 1/8”-1/4”...

Page 37

(215 degrees C) 445 degrees F (230
degrees C) maximum. Apply solder paste
to the exposed solder pads under the PA.
Place the circuit board in the circuit board
holder, and position the RF PA under the
heat-focus head. Lower the heat-focus
head until it is approximately 1/8”-1/4”
(0.3cm-0.6cm) above the PA cover. Turn
on the heater and begin the reflow cycle.
Heating time should not be less than two
minutes.
Once the part has reflowed, before trying to
remove the PA, carefully lower the circuit
board...

Page 38

SCHEMATIC AND CIRCUIT BOARD NOTES
* COMPONENT IS FREQUENCY SENSITIVE. REFER TO 
THE ELECTRICAL PARTS LIST FOR VALUE AND
USAGE.
1.  UNLESS OTHERWISE STATED, RESISTANCES ARE IN OHMS (k = 1000), AND CAPACITANCES ARE IN 
PICOFARADS (pF) OR  MICROFARADS (uF).
2.  DC VOLTAGES ARE MEASURED FROM POINT INDICATED TO CHASSIS GROUND USING A
MOTOROLA DC MULTIMETER OR EQUIVALENT.
TRANSMITTER MEASUREMENTS SHOULD BE MADE 
WITH A 1.2 uF CHOKE IN SERIES WITH THE 
VOLTAGE PROBE TO PREVENT CIRCUIT LOADING.
3.  REFERENCE...

Page 39

NUD7070A, NUD7070B, NUD7085A, AND NUD7085B  VHF TRANSCEIVER BOARDS’ P\
ARTS LIST, AND 
NUE7213A, NUE7213B, NUE7231B, NUE7240A, AND NUE7240B UHF (403-470MHz) \
30 TRANSCEIVER BOARDS’ COMPONENT LOCATION DIAGRAMS
INSERT DIAGRAMS
(L1) BEPF-24636-O (20% BLK, 133 LINE) (OL) BEPF-24637-O (100% BLK.) R.T. 50%
INSERT DIAGRAMS
(L6) BEPF-24638-O (20% BLK., 133 LINE) (OL) BEPF-24639-O (100% BLK.) R.T. 50%
CAPACITOR, Fixed: pF ±5%; 
50V unless stated
C4 2113741F13 330
C6 2113740F22 6.2 ± 0.25pF
C7 2113740F13 2.7 ±...

Page 40

NUE7213A, NUE7213B, NUE7231A, NUE7231B, NUE7240A, AND NUE7240B 
UHF (403-470MHz) TRANSCEIVER BOARDS’ SCHEMATIC DIAGRAM
31
INSERT SCHEMATIC
63D81200C32-O (100% BLK.)
(OL) DEPF-24640-O (100% RED)
SHOOT AT 100% 
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