Sony Tc Kb820s Manual

							Ð 11 Ð
Tape Speed Adjustment
Procedure:
Mode: playback
1. Set to FWD playback mode.
2. Adjust RV71 so that the frequency counter reading becomes
3,000 ± 90 Hz.
3. If, the frequency counter reading does not become 3,000 ±
90Hz.
Turn RV72 and back to 1st. step again.
Note:Turn RV72 to clockwise Ð Tape speed becomes fast.
Turn RV72 to counter clockwise Ð Tape speed becomes slow.
4. Frequency difference between the beginning and the end of
the tape should be within 1%.
Adjustment Location: AUDIO board (See page 12.)
Sample value of Wow and Flutter:0.3% or less W.RMS (JIS)
(WS-48B)
Playback Level Adjustment
Procedure:
Mode: playback
Adjust RV11 (L-CH) and RV21 (R-CH) so that the reading on
level meter meets the adjustment limits below.
Adjustment Limits:
LINE OUT level: Ð7.7±0.5 dB (0.301 to 0.338 V)
Level difference between channels: within 0.5 dB
Check that the LINE OUT level does not change even if Playback
and Stop operation is repeated several times.
Adjustment Location: AUDIO board (See page 12.)
+–set
LINE OUTfrequency counte
r
test tape
WS-48B
(3 kHz, 0 dB)
47 k W
+–set
LINE OUT 47 k 
W
test tape
P-4-L300
(315 Hz, 0 dB)level mete
r
Bias Consumption Current Adjustment
Procedure:
1. Set RV81 (L-CH) and RV91 (R-CH) to mechanical center and
turn the set recording mode.
2. Connect digital voltmeter as shown by the following table.
3. Adjust the following transformers for the minimum readings
on the digital voltmeter.
Measurement Point Adjustment Part Value
L-CH1 and 2, TP321 T81
minimum
R-CH3 and 2, TP321 T91
Adjustment Location: AUDIO board (See page 12.)
Record Bias Adjustment
Setting:
REC LEVEL control: Standard Record (See page 10.)
Procedure:
1. Mode: record
2. Mode: playback
3. Adjust RV81(L-CH) and RV91 (R-CH) so that 10 kHz play-
back output is 0±0.5 dB relative to the 315 Hz output.
Adjustment Location: AUDIO board (See page 12.)
–+set LINE IN
(no signal)
B+ (+7.5 V) TP81
32
1
R-CH
L-CH
digital voltmeterCS-413 blank tape
set AF OSC
AttenuatorLINE IN
315 Hz
10 kHz
50 mV (–23.8 dB)
600 
W
10 k W
CS-123
blank tape
+–set
LINE OUT 47 k 
W
recorded
portionlevel meter 
						

							Ð 12 Ð
Record Level Adjustment
Setting:
REC LEVEL control: Standard Record (See page 10.)
Procedure:
1. Mode: record
2. Mode: playback
3. Adjust RV111 (L-CH) and RV211 (R-CH) so that the reading
on level meter meets the adjustment limits below.
Adjustment Limits: Ð3.8 ± 0.5 dB (0.47 to 0.53 V)
Adjustment Location: MAIN board
[AUDIO BOARD] ÐSIDE A Ð
set AF OSC
Attenuator
600 W
10 k W
CS-123
blank tape LINE IN
315 Hz, 0.5 V (–3.8 dB)
+–set
LINE OUT 47 k 
W
recorded
portionlevel meter
Adjustment Location:[MAIN BOARD] ÐCOMPONENT SIDE Ð
DOLBY-S
BOARD
RV211 RV111
J501CN831 CN833
TP801
RV72
RV71
RV21
RV11 T81
T91 RV81
IC31
TP81 RV91 
						

							Ð 13 ÐÐ 14 Ð
SECTION  5
DIAGRAMS
¥ Circuit Boards Location
TRANSFORMER board
AC POWER
SW board
HP board
PANEL board
LEAF SW board
REC VOL board
DOLBY-S boards
MAIN board
AUDIO board
5-1. NOTE  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC  DIAGRAMS
(In addition to this, the necessary note is each block.)
Note on Schematic Diagram:
¥ All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
¥ All resistors are in W and 
1/4
 W or less unless otherwise
specified.
¥
¢: internal component.
¥2: nonflammable resistor.
¥C: panel designation.
¥U: B+ Line.
¥V: BÐ Line.
¥ Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no  mark : PB
( ) : REC
*: Impossible to measure
¥ Voltages are taken with a VOM (Input impedance 10 MW).
Voltage variations may be noted due to normal produc-
tion tolerances.
¥ Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
¥ Circled numbers refer to waveforms.
¥ Signal path.
E: PB
a: REC
Note:The components identified by mark ! or dotted line
with mark ! are critical for safety.
Replace only with part number specified.Note on Printed Wiring Boards:
¥X: parts extracted from the component side.
¥Y: parts extracted from the conductor side.
¥
r: Through hole.
¥b: Pattern from the side which enables seeing.
(The other layers patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Par ts face side: Parts  on the parts face side seen from
(Side A) the parts face are indicated.
¥ Indication of transistor.
B
These are omitted. CE Q
B
These are omitted. CE Q 
						

							Ð 15 Ð
Ð 16 Ð
TC-KB820S
5-2. PRINTED  WIRING  BOARDS  Ð MD Section Ð ¥ See page 13 for Circuit Boards Location.
¥ Semiconductor
Location
Ref. No. Location
D31 C-1
IC31 C-2
IC81 B-3
·IC81 G-4
Q51 B-2
Q52 B-2
Q53 B-2
Q71 C-4
(Note) ·:LEAF SW BOARD (Page 20)
(Page 19)
(Page 19) 
						

							TC-KB820S
Ð 18 Ð Ð 17 Ð
5-3. SCHEMATIC  DIAGRAM  Ð MD Section Ð ¥ See page 27 for Waveforms.
(Page 21)
(Page 21)
(Page 23) 
						

							Ð 19 ÐÐ 20 Ð
TC-KB820S
5-4. PRINTED  WIRING  BOARD  Ð MAIN Section Ð ¥ See page 13 for Circuit Boards Location.
¥ Semiconductor
Location
Ref. No. Location
D131 C-5
D132 C-5
D231 C-5
D232 C-5
D511 B-7
D512 B-7
D513 E-7
D551 B-5
D701 G-2
D702 G-2
D703 G-2
D704 G-2
D705 F-2
D706 F-2
D707 F-2
D708 G-3
D709 G-5
D710 F-3
D711 F-4
D712 F-3
D713 E-1
D714 E-3
D715 F-4
D801 D-2
D802 D-2
IC501 C-9
IC502 F-9
IC503 D-6
IC504 C-5
IC505 D-5
IC506 A-9
IC507 C-7
IC508 B-4
IC509 C-4
IC510 B-6
IC511 F-10
IC512 D-9
IC601 A-3
IC701 G-4
IC801 B-2
IC802 D-2
Q101 A-8
Q102 B-8
Q103 E-8
Q121 F-6
Q122 D-7
Q201 A-8
Q202 B-10
Q203 E-9
Q221 F-6
Q222 D-7
Q503 E-8
Q511 B-6
Q512 B-7
Q521 F-7
Q531 B-5
Q532 B-5
Q551 A-5
Q572 F-7
Q573 C-7
Q601 B-3
Q701 G-6
Q702 G-5
Q704 G-4
Q705 F-3
Q707 F-3
Q708 F-2
Q805 D-2(Page 32)(Page 31)
(Page 15)(Page 32)(Page 31)
(Page 29)
(Page 29) (Page 15) (Page 15) 
						

							TC-KB820S
Ð 22 Ð Ð 21 Ð
5-5. SCHEMATIC  DIAGRAM  Ð MAIN Section Ð (1/3)
(Page 30)
(Page 34)
(Page 18)
(Page 18)
(Page 30)
(Page 23)(Page 23)
The components identified by mark ! or dotted
line with mark ! are critical for safety.
Replace only with part number specified. 
						

							Ð 23 ÐÐ 24 Ð
TC-KB820S
5-6. SCHEMATIC  DIAGRAM  Ð MAIN Section Ð (2/3) ¥ See page 27 for Waveforms.
(Page 22)
(Page 22)
(Page 18)(Page 25) (Page 25) 
						

							TC-KB820S
Ð 26 Ð Ð 25 Ð
5-7. SCHEMATIC  DIAGRAM  Ð MAIN Section Ð (3/3) ¥ See page 28 for IC Block Diagrams.
The components identified by mark ! or dotted
line with mark ! are critical for safety.
Replace only with part number specified.(Page 33) (Page 33) (Page 34)
(Page 24)
(Page 24) 
						

							Ð 27 ÐÐ 28 Ð
¥ Waveforms
Ð AUDIO BOARD Ð
1T51 1
2Q51 C, Q52 C
3T81 4
4T91 46IC81 !Á, !ª
Ð MAIN BOARD (2/3) Ð1IC801 #Á
5IC81 7, 8
118 Vp-p
9.3 
µs
26.4 Vp-p
9.3 µs
63.2 Vp-p
9.3 µs
64.8 Vp-p
9.3 µs
6.4 Vp-p
9.3 µs
4.3 Vp-p
6 MHz
6.2 Vp-p
9.3 µs
¥ IC Block Diagrams
21
RECOUT
SCINL ANTSATMC3INMC4IN
HLSOUT MCBO
VCC IREF SCBOL
TCS2L TCS1LFBOL
TCF1L
TCF2L
4
LFIN
3
TCL2ZL2
59876
TCL1
SCINH
TCS1HZL1 HLSMP
MCTC
10111213
VCT
14
VEE
15
242526272829302021222319171816
TCS2HTCF2HFBOH
TCF1H
ANTSAT
FLVCRSLVCR
FHVCR
LFICGLFVCR
LFDETSHVCR
SLDETSLICG
SHICGSHDET
FLDET
FHDET
FLICG
FHICG
V TO I
CONV H
V TO I
CONV H
VREF &
IREF
MC4
MC3DS
MC3DT
MC2
MC1 MC4
MC3
MC1MC
IC1 CXA1917AM-T6 (DOLBY-S BOARD)
IC502 CXA1579P (MAIN BOARD)
21
MUTE
R.CAL G.CAL
IN
I.REF
BOOST
VCC
OUT
435
9
876
VEEIN
10111213
GND
14
BOOST
1516
70US METAL
OUT SPEED
CONTROLREC EQ AMP
REC EQ AMP
BIAS
+
–
VGS
VEE VCC