Sony Dej011 Service Manual
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PORTABLE CD PLAYER E Model SPECIFICATIONS D-EJ011 Ver. 1.0 2006.12 Model Name Using Similar Mechanism D-EJ010 CD Mechanism Type CDM-3525A Optical Pick-up Name DAX-25E 9-887-511-012006L02-1 © 2006.12 Sony Corporation Pe rsonal Audio Division Published by Sony Techno Create Corporation SERVICE MANUAL System: Compact disc digital audio system Laser diode properties Emission duration: Continuous Laser output: Less than 44.6 µW (This output is the value measured at a distance of 200 mm from the objective lens surface on the optical pick-up block with 7 mm aperture.) Power requirements • Two LR6 (size AA) batteries: 1.5 V DC × 2 Dimensions (w/h/d) (without projecting parts and controls) Approx. 139.8 × 27.9 × 139.8 mm Mass (excluding accessories) Approx.188 g Operating temperature 5°C - 35 °C (41 °F - 95 °F)Battery life* (approx. hours) (When the CD player is used on a flat and stable place.) Playing time varies depending on how the CD player is used.G-PROTECTION G-on G-off T wo Sony alkaline batteries LR6 (SG) (produced in Japan) 16 11 * Measured value by the standard of JEITA (Japan Electronics and Information Technology Industries Association). • The indicator sections of roughly show the remaining battery power. One section does not always indicate one-fourth of the battery power. Design and specifications are subject to change without notice. Supplied accessories Headphones (1)
2 D-EJ011 Notes on chip component replacement• Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270 ˚C during repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.T ABLE OF CONTENTS 1. SERVICING NOTES ................................................ 3 2. GENERAL................................................................... 3 3. DISASSEMBLY 3-1. Disassembly Flow ........................................................... 4 3-2. Cabinet (Inner) Assy, Cabinet (Lower) Assy ...................................................... 4 3-3. Optical Pick-up (CDM-3525A), MAIN Board .................................................................... 5 4. ELECTRICAL ADJUSTMENT............................. 6 5. DIAGRAMS 5-1. Block Diagram ................................................................ 8 5-2. Printed Wiring Board– Main Board (Side A) – ................................................. 9 5-3. Printed Wiring Board – Main Board (Side B), Jack Board – ............................. 10 5-4. Schematic Diagram – Main Board (1/2) – ..................... 11 5-5. Schematic Diagram – Main Board (2/2), Jack Board – . 12 5-6. IC Pin Function Description ............................................ 15 6. EXPLODED VIEWS................................................. 17 7. ELECTRICAL PARTS LIST.................................. 18 SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. • Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! • Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. • Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
3 D-EJ011 SECTION 1 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK During normal operation of the equipment, emission of the laser diode is prohibited unless the upper lid is closed while turning ON the S811. (push switch type) The following checking method for the laser diode is operable. Fig. 1 Method to push the S811 SECTION 2 GENERALThis section is extracted from instruction manual. LOCATING THE CONTROLS • Method: Emission of the laser diode is visually checked. 1. Open the upper lid. 2. With a disc not set, turn on the S811 with a screwdriver having a thin tip as shown in Fig.1. 3. Press the u button. 4. Observing the objective lens, check that the laser diode emits light. When the laser diode does not emit light, automatic power control circuit or optical pick-up is faulty. In this operation, the objective lens will move up and down 2 times along with inward motion for the focus search. S811 Remaining battery power Sound modeTrack number Playing time Play mode Bookmark * The button has a tactile dot . ^ *(play/pause) DC IN 4.5 V 2 (headphones) jack p (stop)HOLD (rear) VOL –/+* Headphones SOUND/AVLS =+ /P MODE/ OPEN Display
4 D-EJ011SECTION 3 DISASSEMBLY • This set can be disassembled in the order shown below. 3-1. DISASSEMBLY FLOW 3-2. CABINET (INNER) ASSY, CABINET (LOWER) ASSY Note: Follow the disassembly procedure in the numerical order given. 3-2. CABINET (INNER) ASSY, CABINET (LOWER) ASSY (Page 4) 3-3. OPTICAL PICK-UP (CDM-3525A), MAIN BOARD (Page 5) SET 4 two screws cabinet (inner) assy cabinet (lower) assy 3 five screws 1 2 5 two claws 6 two claws
5 D-EJ011 3-3.OPTICAL PICK-UP (CDM-3525A), MAIN BOARD MAIN Board (side A) To / F rom Optical devic eCDM-3525A BLK RED ORGGRY 4 MAIN board cabinet (lower) assy 3 optical pick-up CDM-3525A 1 CN501 2 Unsolder four lead wires
6 D-EJ011SECTION 4 ELECTRICAL ADJUSTMENTS The CD section adjustments are done automatically in this set. Adjusting Procedure: 1. Perform check in the order given. 2. Use YEDS-18 disc (Part No: 3-702-101-01) unless otherwise indicated. 3. Power supply voltage requirement :DC4.5 V in DC IN jack. (J401) VOLUME button : Minimum HOLD switch :OFF Focus bias Check Condition: • Hold the set in horizontal state. Connection: Procedure: 1. Make a solder bridge to short SL801 (OPEN) on the MAIN board side B. 2. Connect the oscilloscope to the test point TP604 (EQOUT) and TP406 (M-GND) on the MAIN board side B. 3. Set a disc. (YEDS-18) 4. Press the u button. 5. Check the oscilloscope waveform is as shown below. A good eye pattern means that the diamond shape ( ) in the center of the waveform can be clearly distinguished. RF Signal reference Waveform (Eye Pattern) To watch the eye pattern, set the oscilloscope to AC range and increase the vertical sensitivity of the oscilloscope for easy w atch-ing. 6. Stop revolving of the disc motor by pressing the x button. 7. SL801 is opened by taking the solder bridge. RF level 1.3 ± 0.2 Vp-p VOLT/DIV : 500 mV (With the 10 : 1 probe in use )TIME/DIV : 500n s (SIDE B)MAIN BOARD 1 25 26 50X601 S811 (OPEN) SL801 (OPEN) iJ30 1 E C629 TP604 EQ OUT C627 C110 R107 R207 R101 C803 R305 L201 R211 R111 C612 R602R617 C625 R622 R625 R626R618 Q602L301L101IC602 oscilloscope (AC range) + – TP604 (EQOUT) SL801 (OPEN)
7 7 D-EJ011 D-EJ011 Note on Printed Wiring Boards. • X : parts extracted from the component side. • Y : parts extracted from the conductor side. • a: Through hole. • f: internal component • : Pattern from the side which enables seeing. (The other layers patterns are not indicated.) • Note for Printed Wiring Boards and Schematic Diagrams Note on Schematic Diagrams. •All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. • f : internal tolerance. • C : panel designation. • A : B+ Line. • H : adjustment for repair. • Power voltage is dc 3 V and fed with regulated dc power supply from battery terminal. •V oltages and waveforms are dc with respect to ground under no-signal conditions. no mark : CD PLAY •V oltages are taken with a VOM (Input impedance 10 M Ω). V oltage variations may be noted due to normal produc- tion tolerances. •W aveforms are taken with a oscilloscope. V oltage variations may be noted due to normal produc- tion tolerances. • Circled numbers refer to waveforms. • Signal path. J : CD PLAY Caution: Pattern face side: Parts on the pattern face side seen from (Side B) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (Side A) the parts face are indicated. • Indication of transistor.Note: The components identified by mark 0 or dotted line with mark ! are critical for safety. Replace only with part number specified. SECTION 5 DIAGRAMS C B These are omitted. E Q D G These are omitted. S Q •W averforms 1IC601 yj XO 2 V/DIV, 50 ns/DIV 59.5 ns 4.5 Vp-p 2IC801 yd XOUT4M 2 V/DIV, 0.1 µs/DIV 244 ns 3.5 Vp-p
8 8 D-EJ011 D-EJ011 5-1. BLOCK DIAGRAM : CD PLAY • Signal Path 3 8079 3 5 65 1 7722 174 7 8 15161819 6463 51 6667 242350534947483962 272625242322 3 576 9 18 DRIVER DRIVER DRIVER 17 19 20 23 22 11 DIGITALFILTERSERVO SIGNAL GEN. RF SIGNAL GEN. OP IC DIGITAL SERVO SIGNAL GEN. PD LD FDOUT TDOUT SDOUT CLVOUT TRK FOCUS 20CLK88 CLK TRK SLED CLV XO XI SUBSYQ MCK DIN/DOUT R/W RESETX BUSY CLOCKOSC DAC 31 36 21 35 SWITCHING Q404 SWITCHINGQ403 171615 47-62 19-24,27-322,3,5,6,8,9,11,12,39, 40,42,43,45,46,48,49 43-32 MEMORY CONTROLLER 41401-18 77-8029-32,34 70 LCD801 LIQUID CRYSTAL DISPLAYKEY MATRIX XIN4M SUBSYQ 21CLK MCK DIN OUT RW EE_SCL EE_SDA/REM_SDA XXRESET BUSY DQM MUTE2 XRESET SEG0 I SEG17 COM1 I COM4 KEYSCAN1 I KEYSCAN5 OPEN/CLOSE HOLD REGB 65 DC IN 30 DCIN IC801SYSTEM CONTROL L401 D403 F402F401 DDC LG PVCC +VBAT VG DDC L402 L403 VG 38 VSYS 37SW X601 16.9344MHz RDACO LDACO Q602 OUT1 OUT2 IN1 IN2 SDA SCL7WP 8VCC IC301HEADPHONE AMP IC802EEPROM IC401 (2/2)DC/DC CONVERTER BD AC DDC E FO+ FO- TRK- TRK+ SLED+ SLED- F SDIN VBIAS AMP 10FOCUSAMP 8 SLEDAMP 7 CLVCLK TRK FOCUS VREF SLED CLVCLK AMP RESET 742 XP.OFF OFF 764 MUTE34755 MUTE1 MUTE1 431 K_PLAY WP IC401 (1/2)FOCUS/TRACKING COIL DRIVE, SLED/SPINDLE MOTOR DRIVE IC602 SDRAM(16M) RAS CAS WE RASX A00-A11 DQ0-15 RFI EQO CASX WEXDQ0-15 A0-11 444546 1436LDQM UDQM3534CLK CKE RCLK C2FX YFLAG RCKE 2829 IC601RF AMP, SERVO, DIGITAL SIGNAL PROCESSOR, SDRAM CONTROLLER,D/A CONVERTER J401 DC IN 4.5V ! DRY BATTERY SIZE AA (IEC DESIGNATION LR6) 2PCS. 3V J301 i (SLED)FOCUS COIL (SPINDLE)M TRACKING COIL F+ F- T+ T- SLED+ SLED- DRIVER25 24 SPID+ SPIN-M SPINDLE+ SPINDLE- OPTICAL DEVICE (CDM-3525A) VCC + + A B C E F LD PD VC LD DRIVER Q601 DDC S811 (OPEN) S812 HOLD OFF ON S807 APC10 9 D80346K_STOP S801 S802 | S805 S808, S809 +B SWITCH Q401 DC IN DETECT Q402 L404 L405
9 9 D-EJ011 D-EJ011 5-2. PRINTED WIRING BOARD – MAIN BOARD (SIDE A) – :Uses unleaded solder. • Semiconductor Location Ref. No.Location D401 E-6 D403 D-6 D803 D-5 IC301 A-2 IC601 B-4 IC802 E-4 Q401 D-6 Q402 E-6 Q403 E-7 IC301 IC601 14 85 120 40 60 21 41 61 80 1 4 8 5 E E +– –+ (SLED) M (SPINDLE) M OPTICAL DEVICE (CDM-3525A) (1/2) GRY ORG BLK RED C210 R201 R205 R206 R106 R104R204 R620 R601R608 C613 C614 C615 R615 R609 R610 C609 C611C604 R606 R103 R203R616 R105 R304 R619 C108 C102 C618 R607 C605 C626 R815 R833 R834 R839 R818 R817 C809 C806C808 D803 R404 D403 R810 L406L407 CN408 CN403 CN407 CN404SLED – SLED+ SPINDLE – SPINDLE+ C405 R407 C413 R406 R405 R403D401 F402 L404 L405 C807 R410 R807 R806 C805 R840 R841 R832 Q401 Q402 Q403 C802 R804 R844 R805 R843 IC802 R614 C606 R613 L801 C202 C201 C624 C208 C306 C303 C630 C620 C101 11 (11)1-871-743- (SIDE A)BOARD MAIN 234567 A 1 B C D E F 8
10 10 D-EJ011 D-EJ011 5-3. PRINTED WIRING BOARD – MAIN BOARD (SIDE B) – :Uses unleaded solder. • Semiconductor Location Ref. No.Location D404 E-1 IC401 D-3 IC602 B-6 IC801 E-4 Q404 E-2 Q601 C-5 Q602 A-5 1 20 21 40 1 20 60 80 40 21 61 41 1 22 BP VL 1 25 26 50 DC IN 4.5V J401 S803. S802 > S807 x S801u LCD801LIQUID CRYSTAL DISPLAY S812HOLD. 1 2 15 16 OPTICAL DEVICE (CDM-3525A) (2/2) X601 S811 (OPEN) SL801 (OPEN) i J301 S804 VOL– S808 SOUND/ AVLS S805 VOL+ S809 P MODE/ DRY BATTERY SIZE AA (IEC DESIGNATION LR6) 2PCS. 3V CN401 CN402 OFFtON E E 11 (11)1-871-743- D404 Q404 C417 C406 R821C416 C401 C410 C804 C412 C403C404 L401 C411 C409 F401 CB414 IC401 IC801 SL803 R828R831 R830 CN801 C420C408 R414 R415 R402 R416 R418 R419 R417 R811 C623C628C610 C602 C607 C105 C305 C205C204 C104 C304 C601 C603 CN501 C629 TP604 EQ OUT C627 C110 R107 R207 R101 C803 R305 L201 R211 R111 C612 R603 R602 R617 C625 R622 R625 R626 R618 Q602 R604 Q601 L301 L101IC602 R812R823 R624 C619R829 C811R401 L403 C419 L402 (SIDE B)MAIN BOARD 23456781 B A C D E F