Sony Cd Player Cdpxe370 Manual

							11
CDP-XE270/XE370
Ver 1.1  2001.07
Note:
1. CD Block is basically designed to operate without adjustment. There-
fore, check each item in order given.
2. Use PATD-012 disc (4-225-203-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10MΩ impedance.
4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
S Curve Check
Connection:
Procedure:
1. Connect an oscilloscope to test point TP (FE1) and TP (VC)
on the BD board.
2. Turn the power on and insert the disc (PATD-012).
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track and press the
xbutton to stop playing back.
5. Press the  
[REPEAT] button. (The object lens moves up and
down)
6. Confirm the oscilloscope waveform (S-curve) is symmetrical
between A and B. And check peak to peak level within 2 ± 1
Vp-p.
S-curve waveform
Note:• Try to measure several times to make sure than the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
Checking Location: BD board (See page 12)
RFDC Level Check
Connection:
+–
BD board
TP (FE1)
TP (VC)
oscilloscope
A
B symmetry
within 2 ± 1 Vp-p
+–
BD board
TP (RFDC)
TP (VC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns 
level: 1.15 
± 0.35 Vp-p
VC
Procedure:
1. Connect an oscilloscope to test point TP (RFDC) and TP (VC)
on the BD board.
2. Turn the power on and insert the disc (PATD-012).
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track.
5. Confirm that oscilloscope waveform is clear and check RFDC
signal level is correct or not.
Note:A clear RFDC signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
       RFDC signal waveform
Checking Location: BD board (See page 12)
RFAC Level Check
Connection:
Procedure:
1. Connect an oscilloscope to test point TP (RFAC) and TP (VC)
on the BD board.
2. Turn the power on.
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track.
5. Confirm that oscilloscope waveform is clear and check RFAC
signal level is correct or not.
Note:A clear RFAC signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
       RFAC signal waveform
Checking Location: BD board (See page 12)
+–
BD board
TP (RFAC)
TP (VC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns 
level: 1.35 
± 0.4 Vp-p
SECTION  5
ELECTRICAL  CHECKS 
						

							12
CDP-XE270/XE370Ver 1.1 2001.07
E-F Balance Check
Connection:
Procedure:
1. Connect an oscilloscpe to test point TP (TE1) and TP (VC) on
the BD board.
2. Turn the power on.
3. Put the disc (PATD-012) in to playback the number two track.
4. Press the 
[TIME] button.  (The tracking servo and the sledding
servo are turned OFF)
5. Check the level B of the oscilliscopes waveform and the A
(DC voltage) of the center of the Traverse waveform.
Confirm the following :
A/B x 100 = less than ± 22%
Traverse Waveform
6. Press the [TIME] button. (The tracking servo and sledding servo
are turned ON)
Confirm the C (DC voltage) is almost equal to the A (DC
voltage) is step 5.
Traverse Waveform
Checking Location: BD board
+–
BD board
TP (TE1)
TP (VC)
oscilloscope
0VB
level: 1.15 ± 0.5 Vp-p Center of 
the waveform
A (DC 
voltage)
0V
Tracking servo
Sled servo
ONC (DC 
voltage)Tracking servo
Sled servo
OFF
Checking Location:
– BD BOARD (Conductor Side) –
TP 
(RFDC) TP
 (FE1) TP
 (VC)
IC131 IC150
IC101
TP
 (TE1)
TP 
(RFAC) 
						

							13 13
CDP-XE270/XE370
SECTION  6
DIAGRAMS
6-1. NOTE  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC  DIAGRAMS
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts  on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor
C
BThese are omitted.
E Q
B
These are omitted. CE Q
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted.  pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ω and 
1/4
 W or less unless otherwise
specified.
•C: panel designation.
•A: B+ Line.
•B: B– Line.
•Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : CD PLAY
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
J: CD PLAY (ANALOG OUT)
c: CD PLAY (DIGITAL OUT)
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
• Circuit Boards Location
POWER SW board
KEY board
LOADING board
DISPLAY board
MAIN board BD board 
						

							14 14
CDP-XE270/XE370
6-2. PRINTED  WIRING  BOARD  – BD Board –• See page 13 for Circuit Boards Location.
TP (DGND)
C111
R138 C140C158
C112
C182R151R152
R140C154
R174
C138
C132 C151
C191C153
C192C134
C102
C101
R101 C171R142
R192C133
C199C103
C110 C172 R110
R136
C131 R184C150
R112
Q132 R111
C194R146 C152
R149
FB191C181
Q131 R134
R137 X191R103
R143 C193
R102 C130
C137
   
 
E EM101
(SPINDLE)
M102
(SLED) S101
(LIMIT)
  
 
 
     
    
 
 
 
 
 
  
   
    
 
 
 
 
    
 
   
 
 
 
  
   
 
 
 
 
 
 
 
 
  
 
 
  
    
IC150
CN101 C136C184 RB101
C124RB102
IC131
CN102 R135 C145R141
R172R183 R182 C139
C174 C173
R171 R144
IC101
R191 R155
R145
R173 C183R181
R127
R123C123
C125 C120
R120
R122
C126
C122
R125
R129
R126
R121C121 R153
R139
 
1-681-001-11
(11)
BD BOARD
(COMPONENT SIDE)
TP (VC)
TP (TE1)
TP (FE1)
TP (RFAC)1-681-001-11(11)
M
BD BOARD
(CONDUCTOR SIDE)
A
MAIN BOARD
CN651
M
OPTICAL PICK-UP
BLOCK
(PXR-104X)
B
C
D
E
F
G1
2345678910111213
A
TP (RFDC)
•Semiconductor
Location
Ref. No. Location
IC101 E-10
IC131 E-8
IC150 C-8
Q131 F-6
Q132 E-6(Page 16)
Ver 1.1  2001.07 
						

							15 15
CDP-XE270/XE370
6-3. SCHEMATIC  DIAGRAM  – BD Board –• See page 20 for Waveforms.• See page 20 for IC Block Diagrams.
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.Les composants identifiés par une marque 0 sont
critiques pour la sécurité. Ne les remplacer que
par une pièce portant le numéro spécifié. (Page 17)
TP
(RFDC)
Ver 1.1  2001.07 
						

							16 16
CDP-XE270/XE370
6-4. PRINTED  WIRING  BOARDS  – LOADING/MAIN/POWER SW Boards –• See page 13 for Circuit Boards Location.
•Semiconductor
Location
Ref. No. Location
D601 D-7
D602 D-7
D603 C-7
D604 D-7
D605 D-7
D612 D-7
D613 C-7
D614 D-6
D615 D-6
D616 D-6
D631 E-3
D641 E-4
D643 E-3
D681 D-6
D682 D-5
D691 D-6
D692 D-5
IC601 E-6
IC602 F-6
IC603 D-6
IC631 E-2
IC651 B-9
IC801 B-8
Q642 E-4
Q681 C-6
Q682 B-9
Q691 C-6
Q692 C-9
1 5 CN151
S151
LOAD
OUT
M151
(LOADING)
M
S152
LOAD
IN
1-645-721-11(21)
LOADING BOARD
 
 
JW620
J
W
6
5
6
C620 D681JW664 JW650
D
6
9
1
JW645
JW608
J
W
6
2
4
J
W
6
0
2
C610 JW628
R
6
4
8R
8
0
9
IC601
C802
C902JW649
J
W
6
5
1
JW671
C
6
3
1
R651
IC603
JW617 JW668
JW
6
5
3 J
W
6
1
0
R606
J
W
6
1
5
J
W
6
01
JW635
R
8
05
IC602
J
W
6
2
5
JW670JW662
JW669
IC631
C
6
4
2
C619
JW
6
4
0
JW606
D616D615
R607 JW629
JW
6
0
5
C606
JW
6
5
4
R
6
4
7
CN621
C612
J
W
6
1
2
JW607
Q
6
4
2
R
6
3
1Q
6
9
2
JW673
R611
D
6
0
5 J
W
6
1
4
C618
R
8
0
6
C
6
7
5
R
9
0
4
R
8
0
4
IC801
JW627
J
W
6
6
1
JW663
C
6
4
1
J
W
6
3
8
C
9
0
8
R
6
4
1
R
6
9
1
Q
6
8
2
R692
R
9
0
9
CN651
R
8
1
2C
6
5
4
D
6
1
3
JW604
JW618
R
9
1
0
C609
J
W
6
0
3
R
9
0
6
D
6
0
4
D
6
0
1
R
6
4
6
T601
POWER
TRANSFORMER
D
6
0
3
R
6
8
1
NO603
J
W
6
1
3
R
9
1
2
JW666
J
W
6
5
8
C
6
7
7
R632
C608J
W
6
1
1D
6
4
1D
6
0
2
IC651
J
W
6
1
6 N
O
6
3
1
C657 Q691
J
W
6
5
7
C
6
0
5R612
C604
C
6
5
3
Q
6
8
1
JW646
C601
R
6
4
2R
8
1
0
D643
C
8
0
8
C658 R682
J
W
6
5
5
C
6
1
6D
6
1
2
JW
6
1
9
C603
C607
JW
6
5
2
C602
C659 JW609 R652 
  
  C651
D614
D682 D692C811 C911
C663
JW679
R
9
0
5
 
L
6
5
1
J
W
6
7
4
J
W
6
7
5
JW
6
7
6
JW
6
7
7
JW678 JW680
JW
6
8
1
J
W
6
8
2JW683
JW
6
84
J
W
6
8
5
J
W
6
8
6 
C682 R653
D631
 
   
 
   
   
 
    
 
 
 
 
 
CN601 S601C621
CN602
MAIN BOARD
BDISPLAY
BOARD
CN501
91
1 5
ABD BOARD
CN101EE
31
313158
413
1
E
E
*
NOT REPLACEABLE:
BUILT IN TRANSFORMER*
121-681-128-11(11)
RANALOG
OUT
L
J681 IC651
DIGITAL
OUT
OPTICAL
POWER SW BOARD
P
O
W
E
R2
1
2
1
11
(11)1-681-131-
2
1
AC IN
A
B
C
D
E
F
G
H
123456789
(Page 18)
(Page 14) 
						

							17 17
CDP-XE270/XE370
6-5. SCHEMATIC  DIAGRAM  – LOADING/MAIN/POWER SW Boards –• See page 20 for IC Block Diagram.
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.Les composants identifiés par une marque 0 sont
critiques pour la sécurité. Ne les remplacer que
par une pièce portant le numéro spécifié. (Page 15)
(Page 19) 
						

							18 18
CDP-XE270/XE370
                  JW511
IC561
R522
R521
C532 R523 R524
JW
505
C561 R525C502
R511JW514
X501Q541
R532 R531 R501C501
JW
504
R528JW510
JW
502
JW
507R
551 R552
JW
506
CN501
JW
509 JW
501
JW
503
R527C531
JW515R561 R541
JW513JW512
JW
508
R526
R533R562
JW
516
NO502
                           
NO301
R502
R503
R504S501S502
S503
S504 
   
    
    TP
(ADJ)
(GND)
TP
(AFADJ)DISPLAY BOARD
l AMS L
PUSH ENTERJ681
BMAIN BOARD
CN621
xS524
XS523
M
S527
mS526m
S522
A OPEN/CLOSES521
IC501E12 432 34 35
FL501
FLUORESCENT INDICATOR TUBE
21
13
1-681-129-11(11)
45
31
1 2
TIM
EPLAY M
O
D
E
CLEARR
EP
EAT
KEY BOARD
11(11)1-681-130-
S501 – 504
S521 – 524,
S526, 527
A
B
C
D
E
F
123456789101112
6-6. PRINTED  WIRING  BOARDS  – DISPLAY/KEY Boards –• See page 13 for Circuit Boards Location.
IC501 C-6
IC561 C-12
Q541 C-7
•Semiconductor
Location
Ref. No. Location
(Page 16) 
						

							19 19
CDP-XE270/XE370
6-7. SCHEMATIC  DIAGRAM  – DISPLAY/KEY Boards –• See page 20 for Waveform.
(Page 17) 
						

							20 20
CDP-XE270/XE370
1IC101 ta (RFAC) (CD Play Mode)6IC101 w; (SCOR) (CD Play Mode)
1IC501 es (XTAL)
2IC101 rd (RFDC) (CD Play Mode)7
IC101 yj (XTAO) (CD Play Mode)
3IC101 el (FE) (CD Play Mode)
4IC101 ra (TE) (CD Play Mode)
•Waveforms
– BD Board –
5IC101 wh (MDP) (CD Play Mode)
1.3 Vp-p
5.2 Vp-p
13.4 ms
5.5 Vp-p
250 ns
1.4 Vp-p5.9 Vp-p
59 ns
approx.
200 mVp-p
approx.
400 mVp-p
2.7 V
7.5 
µs
– DISPLAY Board –•IC Block Diagrams
– BD Board –
IC101 CXD2587Q
TE RFDC
CE IGEN 
AVSS0 
ADIO  AVDD0 CLTVFILO
AVSS3VSS
AVDD3 DOUT
VDD
PCO
FILI
ASYOASYI RFAC
BIAS
SSTP
DFCT
MIRR MDP
LOCK
FOKSFDR VSS TEST
FRDRFE
VC
COUTSE
XTSL
TES1
SRDRTFDR FFDR
TRDR
21
7071
6869
6667
64
65
6261
63
7374
72
75
76
77787980
4
XRST
3
SQCK SQSO
59876
5660535455595758515248495047444546434142
XLAT
CLOK
SENS SYSM
DATA
XUGF
XPCK
GFS
C2PO WFCK
1011121314151617181920
21
222324
2526
3233
3031
3637
3435
3940
38
28
27
29
SPOAATSKSCLK
VDD
SCORSPOB
XLON
XTAI XVDD EMPH
AVDD1
AOUT1
AIN1 XTAO
XVSS
AIN2
AOUT2
AVDD2
RMUT LOUT2LOUT1BCK LRCK
PCMD
LMUT AVSS1
AVSS2
CPU
INTERFACE
SERVO AUTO
SEQUENCER
SERIAL IN
INTERFACE
OVER SAMPLING
DIGITAL FILTER
3rd ORDER
NOISE SHAPER
PWMPWM
EFM
DEMODULATOR
TIMING
LOGIC
DIGITAL
OUT
D/A
INTERFACE
DIGITAL
PLLASYMMETRY
CORRECTOR
CLOCK
GENERATOR
MIRR, DFCT,
FOK
DETECTOR
DIGITAL
CLV
SUBCODE
PROCESSOR
SERVO
INTERFACE
SERVO DSP
FOCUS
SERVO
TRACKING
SERVO
SLED
SERVOPWM GENERATOR
FOCUS PWM
GENERATOR
TRACKING
PWM GENERATOR
SLED PWM
GENERATOR
16K
RAM
ERROR
CORRECTOR
INTERNAL BUSA/D
CONVERTER OPERATIONAL
AMPLIFIER
ANALOG SWITCH