HP Pavilion Dv3 2000 Entertainment Notebook Pc Series Manual

							4–46Maintenance and Service Guide
Removal and replacement procedures
Power connector and cable
Before removing the power connector and cable, follow these steps: 
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, 
and then shut it down through the operating system. 
2. Disconnect all external devices connected to the computer. 
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then 
unplugging the AC adapter from the computer. 
4. Remove the battery (see “Battery” on page 6). 
5. Remove the following components: 
a. Hard drive (see “Hard drive” on page 8)
b. Optical drive (see “Optical drive” on page 19)
c. Keyboard (see “Keyboard” on page 21)
d. Switch cover (see “Switch cover” on page 25) 
e. Speaker assembly (see “Speaker assembly” on page 27)
f. Display assembly (see “Display assembly” on page 28).
g. Top cover (see “Top cover” on page 37).
Remove the power connector and cable:
1. Remove the power connector 1 from the clip 2 built into the base enclosure.
2. Remove the power connector and cable.
Reverse this procedure to install the power connector and cable. 
DescriptionSpare part number
Power connector and cable 531810-001 
						

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Maintenance and Service Guide4–47
System board
✎The system board spare part kit includes replacement thermal material.
Before removing the system board, follow these steps: 
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, 
and then shut it down through the operating system. 
2. Disconnect all external devices connected to the computer. 
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then 
unplugging the AC adapter from the computer. 
4. Remove the battery (see “Battery” on page 6). 
5. Remove the following components: 
a. Hard drive (see “Hard drive” on page 8)
b. Memory module (see “Memory module” on page 10)
c. WLAN module (see “WLAN module” on page 11)
d. WWAN module (see “WWAN module” on page 15)
e. SIM slot board (see “SIM slot board” on page 16)
f. RTC battery (see “RTC battery” on page 18)
g. Optical drive (see “Optical drive” on page 19)
h. Keyboard (see “Keyboard” on page 21)
i. Switch cover (see “Switch cover” on page 25) 
j. Speaker assembly (see “Speaker assembly” on page 27)
k. Display assembly (see “Display assembly” on page 28).
l. Top cover (see “Top cover” on page 37).
When replacing the system board, be sure that the following additional components are removed from the defective 
system board and installed on the replacement system board: 
■Heat sink (see “Fan/heat sink assembly” on page 50)
■Processor (see “Processor” on page 55)
DescriptionSpare part number
For use only with computer models equipped with graphics subsystems with 
discrete memory530780-001
For use only with computer models equipped with graphics subsystems with 
UMA memory530781-001 
						

							4–48Maintenance and Service Guide
Removal and replacement procedures
Remove the system board:
1. Disconnect the following cables from the system board:
1 LED board cable
2 Bluetooth module cable
3 Audio board cable
2. Remove the two Phillips PM2.0×4.0 screws that secure the system board to the base enclosure. 
						

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Maintenance and Service Guide4–49
3. Use the optical drive connector 1 to lift the left side of the system board 2 until it rests at an angle. 
4. Remove the system board from the base enclosure by pulling it away at an angle 3. 
Reverse this procedure to install the system board.  
						

							4–50Maintenance and Service Guide
Removal and replacement procedures
Fan/heat sink assembly
✎The fan/heat sink assembly spare part kit includes replacement thermal material.
✎To properly ventilate the computer, allow at least a 7.6-cm (3-inch) clearance on the left side of the computer. 
The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor and is designed 
to turn on automatically when high temperature conditions exist. These conditions are affected by high external 
temperatures, system power consumption, power management/battery conservation configurations, battery fast 
charging, and software requirements. Exhaust air is displaced through the ventilation grill located on the left side 
of the computer. 
Before removing the fan/heat sink assembly, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, 
and then shut it down through the operating system. 
2. Disconnect all external devices connected to the computer. 
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then 
unplugging the AC adapter from the computer. 
4. Remove the battery (see “Battery” on page 6). 
5. Remove the following components: 
a. Hard drive (see “Hard drive” on page 8)
b. Memory module (see “Memory module” on page 10)
c. WLAN module (see “WLAN module” on page 11)
d. WWAN module (see “WWAN module” on page 15)
e. SIM slot board (see “SIM slot board” on page 16)
f. RTC battery (see “RTC battery” on page 18)
g. Optical drive (see “Optical drive” on page 19)
h. Keyboard (see “Keyboard” on page 21)
i. Switch cover (see “Switch cover” on page 25) 
j. Speaker assembly (see “Speaker assembly” on page 27)
k. Display assembly (see “Display assembly” on page 28).
l. Top cover (see “Top cover” on page 37).
m. System board (see “System board” on page 47).
DescriptionSpare part number
For use only with computer models equipped with graphics subsystems with 
discrete memory531814-001
For use only with computer models equipped with graphics subsystems with 
UMA memory531813-001 
						

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Remove the fan/heat sink assembly:
1. Turn the system board upside down with the front toward you.
✎Steps 2 and 3 apply to computer models equipped with graphics subsystems with discrete memory. See steps 4 
and 5 for instructions on removing the fan/heat sink assembly on computer models equipped with graphics 
subsystems with UMA memory.
2. Loosen the four captive Phillips PM2.0×7.0 screws 1 that secure the fan/heat sink assembly to the 
system board.
3. Remove the fan/heat sink assembly 2.
✎Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board 
components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly. 
						

							4–52Maintenance and Service Guide
Removal and replacement procedures
✎The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system 
board each time the fan/heat sink assembly is removed:
■Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
■Thermal pads are used on the graphics subsystem memory module 5 and the heat sink section 6 that 
services it.
■Thermal pads are used on the other system board components 7 and heat sink sections 8 that service them.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare 
part kits. 
						

							Removal and replacement procedures
Maintenance and Service Guide4–53
✎Steps 4 and 5 apply to computer models equipped with graphics subsystems with UMA memory. See steps 2 
and 3 for instructions on removing the fan/heat sink assembly on computer models equipped with graphics 
subsystems with discrete memory.
4. Loosen the four captive Phillips PM2.0×7.0 screws 1 that secure the fan/heat sink assembly to the 
system board.
5. Remove the fan/heat sink assembly 2.
✎Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board 
components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly. 
						

							4–54Maintenance and Service Guide
Removal and replacement procedures
✎The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system 
board each time the fan/heat sink assembly is removed:
■Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
■Thermal pads are used on the other system board components 5 and sections of the heat sink 6 that 
service them.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare 
part kits.
Reverse this procedure to install the fan/heat sink assembly. 
						

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Processor
✎The processor spare part kit includes replacement thermal material.
Before removing the processor, follow these steps: 
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, 
and then shut it down through the operating system. 
2. Disconnect all external devices connected to the computer. 
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then 
unplugging the AC adapter from the computer. 
4. Remove the battery (see “Battery” on page 6). 
5. Remove the following components: 
a. Hard drive (see “Hard drive” on page 8)
b. Memory module (see “Memory module” on page 10)
c. WLAN module (see “WLAN module” on page 11)
d. WWAN module (see “WWAN module” on page 15)
e. SIM slot board (see “SIM slot board” on page 16)
f. RTC battery (see “RTC battery” on page 18)
g. Optical drive (see “Optical drive” on page 19)
DescriptionSpare part number
Intel Core 2 processors:
■T9900 2.93-GHz processor (6-MB L2 cache, 1066-MHz FSB)570434-001
■T9800 2.93-GHz processor (6-MB L2 cache, 1066-MHz FSB)507951-001
■T9600 2.80-GHz processor (6-MB L2 cache, 1066-MHz FSB)507952-001
■T9550 2.66-GHz processor (6-MB L2 cache, 1066-MHz FSB)507953-001
■P8800 2.66-GHz processor (3-MB L2 cache, 1066-MHz FSB)570036-001
■P8700 2.53-GHz processor (3-MB L2 cache, 1066-MHz FSB)507960-001
■P8600 2.40-GHz processor (3-MB L2 cache, 1066-MHz FSB)507963-001
■P7550 2.26-GHz processor (3-MB L2 cache, 1066-MHz FSB)573076-001
■T6600 2.20-GHz processor (3-MB L2 cache, 1066-MHz FSB)513593-001
■P7450 2.13-GHz processor (3-MB L2 cache, 1066-MHz FSB)507965-001
■T6500 2.10-GHz processor (3-MB L2 cache, 1066-MHz FSB)572928-001
■T6400 2.06-GHz processor (6-MB L2 cache, 1066-MHz FSB)513592-001
■P7350 2.00-GHz processor (3-MB L2 cache, 1066-MHz FSB)507967-001
Intel Pentium processors:
■T4300 2.10-GHz processor (1-MB L2 cache, 800-MHz FSB)572929-001
■T4200 2.00-GHz processor (1-MB L2 cache, 800-MHz FSB)513599-001
■T3000 1.80-GHz processor (1-MB L2 cache, 800-MHz FSB)572926-001
Intel Celeron T1600 1.66-GHz processor (1-MB L2 cache, 667-MHz FSB) 532324-001