Motorola Bpr40 Magone 6816986h01 B Manual

							Repair Procedures and Techniques — General 2-3
4.0Repair Procedures and Techniques — General
Any rework or repair on Environmentally Preferred Products must be done using the appropriate 
lead-free solder wire and lead-free solder paste as stated in the following table:
Parts Replacement and Substitution
When damaged parts are replaced, identical parts should be used. If the identical replacement part 
is not locally available, check the parts list for the proper Motorola part number and order the part 
from the nearest center listed under 
Replacement Parts Ordering  on page A-1.
Rigid Circuit Boards
This family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are not 
accessible, some special considerations are required when soldering and unsoldering components. 
The printed-through holes may interconnect multiple layers of the printed circuit. Therefore, exercise 
care to avoid pulling the plated circuit out of the hole.
When soldering near the 20-pin and 40-pin connectors: 
•Avoid accidentally getting solder in the connector. 
•Be careful not to form solder bridges between the connector pins. 
•Examine your work closely for shorts due to solder bridges.
NOTEEnvironmentally Preferred Products (EPP) (refer to the marking on the printed circuit 
boards — examples shown below) were developed and assembled using environmen
-
tally preferred components and solder assembly techniques to comply with the Euro-
pean Union’s Restriction of Hazardous Substances (ROHS) Directive 2002/95/EC 
and Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. To 
maintain product compliance and reliability, use only the Motorola specified parts in this 
manual.
Table 2-1.  Lead Free Solder Wire Part Number List
Motorola 
Part NumberAlloyFlux TypeFlux Content 
by WeightMelting 
PointSupplier Part 
numberDiameterWeight
1088929Y0195.5Sn/3.8Ag/0.7CuRMA Version2.7-3.2%217C521710.015”1lb spool
Table 2-2.  Lead Free Solder Paste Part Number List
Motorola Part 
NumberManufacturer Part 
NumberViscosityTy p eComposition & Percent MetalLiquid 
Temperature
1085674C03NC-SMQ230900-1000KCPs 
Brookfield (5rpm)Ty p e  3  
(-325/+500)(95.5%Sn-3.8%Ag-0.7%Cu) 
89.3%217°C 
						

							2-4 Repair Procedures and Techniques — General
Flexible Circuits
The flexible circuits are made from a different material than the rigid boards, and require different 
soldering techniques. Excessive prolonged heat on a flexible circuit can damage the material. 
Therefore, avoid excessive heat and excessive bending. 
For parts replacement, use the ST-1087 Temperature-Controlled Solder Station with a 600-700 
degree F tip, and use small diameter solder such as ST-633. The smaller size solder will melt faster 
and require less heat to be applied to the circuit.
To replace a component on a flexible circuit: 
1. Grasp with seizers (hemostats) the edge of the flexible circuit near the part to be removed. 
2. Pull gently.
3. Apply the tip of the soldering iron to the component connections while pulling with the seizers.
Chip Components
Use the RLN4062 Hot-Air Repair Station for chip component replacement. Adjust the temperature 
control to 370°C (700°F), and adjust the airflow to a minimum setting. Airflow can vary due to 
component density.
•To remove a chip component: 
1. Use a hot-air hand piece and position the nozzle of the hand piece approximately 0.3 cm 
(1/8) above the component to be removed. 
2. Begin applying the hot air. Once the solder reflows, remove the component using a pair of 
tweezers. 
3. Using a solder wick and a soldering iron or a power desoldering station, remove the excess 
solder from the pads.
•To replace a chip component using a soldering iron: 
1. Select the appropriate micro-tipped soldering iron and apply fresh solder to one of the solder 
pads.
2. Using a pair of tweezers, position the new chip component in place while heating the fresh 
solder.
3. Once solder wicks onto the new component, remove the heat from the solder.
4. Heat the remaining pad with the soldering iron and apply solder until it wicks to the compo-
nent. If necessary, touch up the first side. All solder joints should be smooth and shiny.
•To replace a chip component using hot air:
1. Use the hot-air hand piece and reflow the solder on the solder pads to smooth it.
2. Apply a drop of solder paste flux to each pad.
3. Using a pair of tweezers, position the new component in place.
4. Position the hot-air hand piece approximately 0.3 cm (1/8”) above the component and begin 
applying heat.
5. Once the solder wicks to the component, remove the heat and inspect the repair. All joints 
should be smooth and shiny.
NOTEDo not attempt to puddle-out components. Prolonged application of heat may damage the 
flexible circuit. 
						

							Disassembling and Reassembling the Radio — General 2-5
5.0 Disassembling and Reassembling the Radio — General
For disassembly or reassembly of the radio, it is important to pay particular attention to all the snaps 
and tabs, and how parts align with each other.
The following tools are required for disassembling the radio:
•Phillips screwdriver
•Flat head screwdriver
•Chassis Opener
•Crab Eye Nut Opener
•Tw e ez e r s
If a unit requires more complete testing or service than is customarily performed at the basic level, 
send this unit to a Motorola Authorized Service Center (See 
section 2.4 on page 2 for a list of 
authorized service centers). 
						

							2-6Radio Disassembly — Detailed
6.0 Radio Disassembly — Detailed
6.1 Front Cover from Chassis Disassembly
1. Turn off the radio.
2. Unlatch the battery latch at the bottom of the radio (see “Figure 2-1”). Remove the battery by 
gently lifting the hilt of the battery, nearest to the battery latch, 
away from the housing.
3. Slide the battery downwards to remove the battery.
4. Remove the antenna by unscrewing it (see “Figure 2-2”).
5. Pull the On/Off Volume and Channel knobs out of their shafts using the Chassis Opener (see 
“Figure 2-2”).
Figure 2-1 
Figure 2-2 
2a
2a3
2b
6
4
5 
						

							Radio Disassembly — Detailed2-7
6. Insert the Chassis Opener at the bottom of the radio, between the chassis and housing (see 
“Figure 2-2”). Lift the chassis gently. Be careful not to damage the housing or the O-ring 
underneath.
7. Lift rear chassis away from the front cover. Be careful not to damage the speaker wire under-
neath.
8. Slide the rear chassis downwards, and away from the front cover.
9. Remove the speaker connector, which connects between the PC Board and the internal 
speaker on front cover (
see “Figure 2-4”).
10. Remove the latch pad from right slot space.
11. With the battery latch on the housing, push the shaft in the housing slot to the right (see “Fig-
ure 2-5”).
Figure 2-3 
Figure 2-4 
NOTEProceed to perform steps 10, 11, and 12 only if there is a need to replace the latch.
Speaker Wire
Speaker 
Connector 
						

							2-8Radio Disassembly — Detailed
12.Slide the battery latch shaft out from the latch. 
13. Unscrew the speaker bracket from the housing (see “Figure 2-6”).
14. Remove the speaker from on top of the speaker felt.
15.Remove the speaker felt from the grille area.
Figure 2-5 
NOTEProceed to perform steps 13, 14, and 15 only if there is a need to replace the speaker, 
speaker bracket or speaker felt.
Figure 2-6  
						

							Radio Reassembly — Detailed2-9
6.2 PC Board Disassembly
1. Remove the audio jack seal.
2. Remove the 10 screws which hold the PC board to the diecast.
3. Next, remove the 2 nuts on the On/Off Volume and Channel knobs shafts with the Crab Eye 
Nut Opener.
4. The PC board can now be removed from the rear diecast.
5. The completely disassembly PC board is shown in “Figure 2-7”.
7.0 Radio Reassembly — Detailed
7.1 PC Board Reassembly
1. Place the PC board on the rear diecast.
2. Tighten the screws and the nuts on the two knobs.
Figure 2-7 Completely Disassembled PC Board
Stickers for 
Tuning Holes  O-ring
Radio Chasis
PCB Antenna Bracket Crab-eye Knob Nut
Audio Jack Seal
Microphone BootPOGO Pin Housing
Audio Bracket POGO Pin SealTanapa Label
Thermal Pad
Thermal Paste PTT Insulation Tape
Shield
PCB-Chassis Tape 
						

							2-10Radio Reassembly — Detailed
7.2 Chassis and Front Cover Reassembly 
1. Place the speaker felt onto the grille area (see “Figure 2-8”) . 
2.Place the speaker on top of the felt.
3. Stick the speaker poron pad onto the back of speaker magnet.
4. Place the speaker bracket and screw the bracket to the housing.
5.Slot the battery latch shaft into the latch (see “Figure 2-9”).
6. Place the latch onto the housing, with the shaft protruding on the right side of the latch (see 
“Figure 2-10”). 
NOTEProceed to perform steps 1, 2, 3 and 4 only if there is a need to replace the speaker, 
speaker bracket or speaker felt.
Figure 2-8 
NOTEProceed to perform steps 5, 6, 7 and 8 only if there is a need to replace the latch.
Figure 2-9  
						

							Radio Reassembly — Detailed2-11
7. With the battery latch placed on the housing, push the shaft in the housing slot to the left (see 
“Figure 2-11”). 
8. Place the small latch pad onto the right slot space (see “Figure 2-11”).
Figure 2-10 
Figure 2-11  
						

							2-12Radio Reassembly — Detailed
9.Connect the internal speaker connector to the PC board (“see “Figure 2-12”).
10. Place the diecast into the front housing (see “Figure 2-13”).
11. Snap the front housing cover firmly into place on the rear diecast .
12. Attach the battery.
13. Attach the On/Off Volume Knob, Channel Knob and Antenna.
Figure 2-12 
Figure 2-13 
Speaker 
Connector